公开(公告)号：US09818618B2

公开(公告)日：2017-11-14

申请号：US14700580

申请日：2015-04-30

Applicant: Cabot Microelectronics Corporation

Inventor： Brian Mrzyglod ,  Jayakrishnan Nair ,  Garrett Blake

IPC: B24B37/22 ,  H01L21/306 ,  B24D11/00 ,  B24B37/04 ,  B24B37/24 ,  B24D18/00

CPC classification number: H01L21/30625 ,  B24B37/042 ,  B24B37/22 ,  B24B37/24 ,  B24D11/00 ,  B24D11/001 ,  B24D18/0045

Abstract: The invention is directed to a multi-layer polishing pad for chemical-mechanical polishing comprising a top layer, a middle layer and a bottom layer, wherein the top layer and bottom layer are joined together by the middle layer, and without the use of an adhesive. The invention is also directed to a multi-layer polishing pad comprising an optically transmissive region, wherein the layers of the multi-layer polishing pad are joined together without the use of an adhesive.

公开(公告)号：US20150325451A1

公开(公告)日：2015-11-12

申请号：US14700580

申请日：2015-04-30

Applicant: Cabot Microelectronics Corporation

Inventor： Brian Mrzyglod ,  Jayakrishnan Nair ,  Garrett Blake

IPC: H01L21/306 ,  B24D11/00

CPC classification number: H01L21/30625 ,  B24B37/042 ,  B24B37/22 ,  B24B37/24 ,  B24D11/00 ,  B24D11/001 ,  B24D18/0045

Abstract: The invention is directed to a multi-layer polishing pad for chemical-mechanical polishing comprising a top layer, a middle layer and a bottom layer, wherein the top layer and bottom layer are joined together by the middle layer, and without the use of an adhesive. The invention is also directed to a multi-layer polishing pad comprising an optically transmissive region, wherein the layers of the multi-layer polishing pad are joined together without the use of an adhesive.

Abstract translation: 本发明涉及一种用于化学机械抛光的多层抛光垫，其包括顶层，中间层和底层，其中顶层和底层通过中间层连接在一起，而不使用 胶粘剂。 本发明还涉及一种包括光学透射区域的多层抛光垫，其中多层抛光垫的层在不使用粘合剂的情况下连接在一起。