公开(公告)号：US20040259484A1

公开(公告)日：2004-12-23

申请号：US10463680

申请日：2003-06-17

Applicant: Cabot Microelectronics Corporation

Inventor： Abaneshwar Prasad ,  Roland K. Sevilla ,  Michael S. Lacy

IPC: B24B001/00

CPC classification number: B24B37/205 ,  B24D3/32

Abstract: The invention is directed to a multi-layer polishing pad for chemical-mechanical polishing comprising a polishing layer and a bottom layer, wherein the polishing layer and bottom layer are joined together without the use of an adhesive. The invention is also directed to a polishing pad comprising an optically transmissive multi-layer polishing pad material, wherein the layers of the polishing pad material are joined together without the use of an adhesive.

Abstract translation: 本发明涉及一种用于化学机械抛光的多层抛光垫，其包括抛光层和底层，其中抛光层和底层在不使用粘合剂的情况下连接在一起。 本发明还涉及一种包括光学透射多层抛光垫材料的抛光垫，其中抛光垫材料的层在不使用粘合剂的情况下连接在一起。