公开(公告)号：US20040171339A1

公开(公告)日：2004-09-02

申请号：US10792342

申请日：2004-03-03

Applicant: Cabot Microelectronics Corporation

Inventor： Abaneshwar Prasad

IPC: B24D011/00

CPC classification number: B24B37/24 ,  B24D3/32 ,  B29K2105/041

Abstract: The invention provides polishing pads for chemical-mechanical polishing comprising a porous foam and a method for their production. In one embodiment, the porous foam has an average pore size of about 50 nullm or less, wherein about 75% or more of the pores have a pore size within about 20 nullm or less of the average pore size. In another embodiment, porous foam has an average pore size of about 20 nullm or less. In yet another embodiment, the porous foam has a multi-modal pore size distribution. The method of production comprises (a) combining a polymer resin with a supercritical gas to produce a single-phase solution and (b) forming a polishing pad from the single-phase solution, wherein the supercritical gas is generated by subjecting a gas to an elevated temperature and pressure.

公开(公告)号：US20040259484A1

公开(公告)日：2004-12-23

申请号：US10463680

申请日：2003-06-17

Applicant: Cabot Microelectronics Corporation

Inventor： Abaneshwar Prasad ,  Roland K. Sevilla ,  Michael S. Lacy

IPC: B24B001/00

CPC classification number: B24B37/205 ,  B24D3/32

Abstract: The invention is directed to a multi-layer polishing pad for chemical-mechanical polishing comprising a polishing layer and a bottom layer, wherein the polishing layer and bottom layer are joined together without the use of an adhesive. The invention is also directed to a polishing pad comprising an optically transmissive multi-layer polishing pad material, wherein the layers of the polishing pad material are joined together without the use of an adhesive.

Abstract translation: 本发明涉及一种用于化学机械抛光的多层抛光垫，其包括抛光层和底层，其中抛光层和底层在不使用粘合剂的情况下连接在一起。 本发明还涉及一种包括光学透射多层抛光垫材料的抛光垫，其中抛光垫材料的层在不使用粘合剂的情况下连接在一起。

公开(公告)号：US20040082276A1

公开(公告)日：2004-04-29

申请号：US10282489

申请日：2002-10-28

Applicant: Cabot Microelectronics Corporation

Inventor： Abaneshwar Prasad

IPC: B24B001/00

CPC classification number: B24B37/24

Abstract: The invention is directed to a chemical-mechanical polishing pad substrate comprising a porous material having an average pore size of about 0.01 microns to about 1 micron. The polishing pad substrate has a light transmittance of about 10% or more at at least one wavelength of about 200 nm to about 35,000 nm. The invention is further directed to a polishing pad comprising the polishing pad substrate, a method of polishing comprising the use of the polishing pad substrate, and a chemical-mechanical apparatus comprising the polishing pad substrate.

Abstract translation: 本发明涉及包含平均孔径为约0.01微米至约1微米的多孔材料的化学机械抛光垫基材。 抛光垫基板在约200nm至约35,000nm的至少一个波长处具有约10％以上的透光率。 本发明还涉及包括抛光垫基板的抛光垫，包括使用抛光垫基板的抛光方法以及包括抛光垫基板的化学机械装置。

公开(公告)号：US20040258882A1

公开(公告)日：2004-12-23

申请号：US10463730

申请日：2003-06-17

Applicant: Cabot Microelectronics Corporation

Inventor： Abaneshwar Prasad

IPC: B32B001/00

CPC classification number: B24B37/24 ,  B24D3/26 ,  B24D3/32 ,  Y10T428/24273 ,  Y10T428/24355 ,  Y10T428/24446 ,  Y10T428/249953 ,  Y10T428/268 ,  Y10T428/31551 ,  Y10T428/31591

Abstract: The invention provides a polishing pad for chemical-mechanical polishing comprising a body, a polishing surface, and a plurality of elongated pores, wherein about 10% or more of the elongated pores have an aspect ratio of about 2:1 or greater and are substantially oriented in a direction that is coplanar with the polishing surface. The invention further provides a method of polishing a substrate.

Abstract translation: 本发明提供了一种用于化学机械抛光的抛光垫，其包括主体，抛光表面和多个细长孔，其中约10％或更多的细长孔具有约2:1或更大的纵横比，并且基本上 在与抛光表面共面的方向上取向。 本发明还提供一种抛光衬底的方法。

公开(公告)号：US20040177563A1

公开(公告)日：2004-09-16

申请号：US10792344

申请日：2004-03-03

Applicant: Cabot Microelectronics Corporation

Inventor： Abaneshwar Prasad

IPC: C09K003/14

CPC classification number: B24B37/24 ,  B24D3/32 ,  B29K2105/041

Abstract: The invention provides polishing pads for chemical-mechanical polishing comprising a porous foam and a method for their production. In one embodiment, the porous foam has an average pore size of about 50 nullm or less, wherein about 75% or more of the pores have a pore size within about 20 nullm or less of the average pore size. In another embodiment, porous foam has an average pore size of about 20 nullm or less. In yet another embodiment, the porous foam has a multi-modal pore size distribution. The method of production comprises (a) combining a polymer resin with a supercritical gas to produce a single-phase solution and (b) forming a polishing pad from the single-phase solution, wherein the supercritical gas is generated by subjecting a gas to an elevated temperature and pressure.

Abstract translation: 本发明提供了包括多孔泡沫的化学机械抛光用抛光垫及其制造方法。 在一个实施方案中，多孔泡沫的平均孔径为约50μm或更小，其中约75％或更多的孔具有平均孔径的约20μm或更小的孔径。 在另一个实施方案中，多孔泡沫的平均孔径为约20μm或更小。 在另一个实施方案中，多孔泡沫具有多模式孔径分布。 生产方法包括：（a）将聚合物树脂与超临界气体组合以产生单相溶液，和（b）从单相溶液形成抛光垫，其中超临界气体是通过使气体经由 升高的温度和压力。

公开(公告)号：US20040171340A1

公开(公告)日：2004-09-02

申请号：US10792348

申请日：2004-03-03

Applicant: Cabot Microelectronics Corporation

Inventor： Abaneshwar Prasad

IPC: B24B001/00

CPC classification number: B24B37/24 ,  B24D3/32 ,  B29K2105/041

Abstract: The invention provides polishing pads for chemical-mechanical polishing comprising a porous foam and a method for their production. In one embodiment, the porous foam has an average pore size of about 50 nullm or less, wherein about 75% or more of the pores have a pore size within about 20 nullm or less of the average pore size. In another embodiment, porous foam has an average pore size of about 20 nullm or less. In yet another embodiment, the porous foam has a multi-modal pore size distribution. The method of production comprises (a) combining a polymer resin with a supercritical gas to produce a single-phase solution and (b) forming a polishing pad from the single-phase solution, wherein the supercritical gas is generated by subjecting a gas to an elevated temperature and pressure.

公开(公告)号：US20040171338A1

公开(公告)日：2004-09-02

申请号：US10792183

申请日：2004-03-03

Applicant: Cabot Microelectronics Corporation

Inventor： Abaneshwar Prasad

IPC: B24D011/00

CPC classification number: B24B37/24 ,  B24D3/32 ,  B29K2105/041

Abstract: The invention provides polishing pads for chemical-mechanical polishing comprising a porous foam and a method for their production. In one embodiment, the porous foam has an average pore size of about 50 nullm or less, wherein about 75% or more of the pores have a pore size within about 20 nullm or less of the average pore size. In another embodiment, porous foam has an average pore size of about 20 nullm or less. In yet another embodiment, the porous foam has a multi-modal pore size distribution. The method of production comprises (a) combining a polymer resin with a supercritical gas to produce a single-phase solution and (b) forming a polishing pad from the single-phase solution, wherein the supercritical gas is generated by subjecting a gas to an elevated temperature and pressure.

公开(公告)号：US20040157533A1

公开(公告)日：2004-08-12

申请号：US10361520

申请日：2003-02-10

Applicant: Cabot Microelectronics Corporation

Inventor： Abaneshwar Prasad

IPC: B24B001/00

CPC classification number: B24B37/205 ,  B24D3/34 ,  Y10S451/921

Abstract: The invention is directed to chemical-mechanical polishing pads comprising a transparent window. In one embodiment, the transparent window comprises an inorganic material and an organic material, wherein the inorganic material comprises about 20 wt. % or more of the transparent window. In another embodiment, the transparent window comprises an inorganic material and an organic material, wherein the inorganic material is dispersed throughout the organic material and has a dimension of about 5 to 1000 nm, and wherein the transparent window has a total light transmittance of about 30% or more at at least one wavelength in the range of about 200 to 10,000 nm. In yet another embodiment, the transparent window comprises an inorganic/organic hybrid sol-gel material. In an additional embodiment, the transparent window comprises a polymer resin and a clarifying material, wherein the transparent window has a total light transmittance that is substantially higher than a window comprising only the polymeric resin.

Abstract translation: 本发明涉及包括透明窗口的化学机械抛光垫。 在一个实施方案中，透明窗包括无机材料和有机材料，其中无机材料包含约20wt。 ％以上的透明窗口。 在另一个实施方案中，透明窗包括无机材料和有机材料，其中无机材料分散在整个有机材料中并且具有约5至1000nm的尺寸，并且其中透明窗的总透光率为约30 在约200〜10,000nm的范围内的至少一个波长的％以上。 在另一个实施方案中，透明窗口包括无机/有机杂化溶胶 - 凝胶材料。 在另外的实施方案中，透明窗口包括聚合物树脂和澄清材料，其中透明窗的总透光率基本上高于仅包含聚合树脂的窗口。

公开(公告)号：US20030220061A1

公开(公告)日：2003-11-27

申请号：US10281782

申请日：2002-10-28

Applicant: Cabot Microelectronics Corporation

Inventor： Abaneshwar Prasad

IPC: B24D011/00

CPC classification number: B24B37/24 ,  B24D3/32 ,  B29K2105/041

Abstract: The invention provides polishing pads for chemical-mechanical polishing comprising a porous foam and a method for their production. In one embodiment, the porous foam has an average pore size of about 50 nullm or less, wherein about 75% or more of the pores have a pore size within about 20 nullm or less of the average pore size. In another embodiment, porous foam has an average pore size of about 20 nullm or less. In yet another embodiment, the porous foam has a multi-modal pore size distribution. The method of production comprises (a) combining a polymer resin with a supercritical gas to produce a single-phase solution and (b) forming a polishing pad from the single-phase solution, wherein the supercritical gas is generated by subjecting a gas to an elevated temperature and pressure.

Abstract translation: 本发明提供了包括多孔泡沫的化学机械抛光用抛光垫及其制造方法。 在一个实施方案中，多孔泡沫的平均孔径为约50μm或更小，其中约75％或更多的孔具有平均孔径的约20μm或更小的孔径。 在另一个实施方案中，多孔泡沫的平均孔径为约20μm或更小。 在另一个实施方案中，多孔泡沫具有多模式孔径分布。 生产方法包括：（a）将聚合物树脂与超临界气体组合以产生单相溶液，和（b）从单相溶液形成抛光垫，其中超临界气体是通过使气体经由 升高的温度和压力。