Multi-layer polishing pad material for CMP
    1.
    发明申请
    Multi-layer polishing pad material for CMP 有权
    CMP多层抛光垫材料

    公开(公告)号:US20040259484A1

    公开(公告)日:2004-12-23

    申请号:US10463680

    申请日:2003-06-17

    CPC classification number: B24B37/205 B24D3/32

    Abstract: The invention is directed to a multi-layer polishing pad for chemical-mechanical polishing comprising a polishing layer and a bottom layer, wherein the polishing layer and bottom layer are joined together without the use of an adhesive. The invention is also directed to a polishing pad comprising an optically transmissive multi-layer polishing pad material, wherein the layers of the polishing pad material are joined together without the use of an adhesive.

    Abstract translation: 本发明涉及一种用于化学机械抛光的多层抛光垫,其包括抛光层和底层,其中抛光层和底层在不使用粘合剂的情况下连接在一起。 本发明还涉及一种包括光学透射多层抛光垫材料的抛光垫,其中抛光垫材料的层在不使用粘合剂的情况下连接在一起。

    Polishing pad for electrochemical-mechanical polishing
    2.
    发明申请
    Polishing pad for electrochemical-mechanical polishing 审中-公开
    抛光垫用于电化学机械抛光

    公开(公告)号:US20040259479A1

    公开(公告)日:2004-12-23

    申请号:US10601601

    申请日:2003-06-23

    CPC classification number: B24B37/26 B23H5/08 B24B37/046

    Abstract: The invention provides a polishing pad comprising a body having a top surface comprising a first set of grooves with a first depth and first width and a bottom surface comprising a second set of grooves with a second depth and second width, wherein the first set of grooves and second set of grooves are interconnected and are oriented such that they are not aligned.

    Abstract translation: 本发明提供了一种抛光垫,其包括具有顶表面的主体,该顶表面包括具有第一深度和第一宽度的第一组凹槽,以及包括具有第二深度和第二宽度的第二组凹槽的底表面,其中第一组凹槽 并且第二组凹槽互连并且被定向成使得它们不对齐。

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