公开(公告)号：US07671615B2

公开(公告)日：2010-03-02

申请号：US11839899

申请日：2007-08-16

申请人： Carel van de Beek ,  Stefan Kreissig ,  Volker Hansel ,  Sebastian Giessmann ,  Frank-Michael Werner ,  Claus Dietrich ,  Jorg Kiesewetter

发明人： Carel van de Beek ,  Stefan Kreissig ,  Volker Hansel ,  Sebastian Giessmann ,  Frank-Michael Werner ,  Claus Dietrich ,  Jorg Kiesewetter

IPC分类号： G01R31/02

CPC分类号： G01R31/2874 ,  H01L21/67109

摘要： In a method and an apparatus for measuring temperature-controlled electronic components in a test station, a component to be measured is held and positioned using a chuck, has a temperature-controlled and directed fluid flow applied to it and is electrically contact-connected using probes and is measured. The setting of the temperature of the component to the temperature at which the measurement is intended to be carried out is effected solely using a directed fluid flow at a defined temperature.

摘要翻译： 在测试台中用于测量温度控制的电子部件的方法和装置中，使用卡盘来保持和定位要测量的部件，其中施加有受温度控制和定向的流体流动并且使用 探头并进行测量。 将组件的温度设定为要进行测量的温度仅仅使用在限定温度下的定向流体流进行。

公开(公告)号：US20080042679A1

公开(公告)日：2008-02-21

申请号：US11839899

申请日：2007-08-16

申请人： Carel van de Beek ,  Stefan Kreissig ,  Volker Hansel ,  Sebastian Giessmann ,  Frank-Michael Werner ,  Claus Dietrich ,  Jorg Kiesewetter

发明人： Carel van de Beek ,  Stefan Kreissig ,  Volker Hansel ,  Sebastian Giessmann ,  Frank-Michael Werner ,  Claus Dietrich ,  Jorg Kiesewetter

IPC分类号： G01R31/02

CPC分类号： G01R31/2874 ,  H01L21/67109

摘要： In a method and an apparatus for measuring temperature-controlled electronic components in a test station, a component to be measured is held and positioned using a chuck, has a temperature-controlled and directed fluid flow applied to it and is electrically contact-connected using probes and is measured. The setting of the temperature of the component to the temperature at which the measurement is intended to be carried out is effected solely using a directed fluid flow at a defined temperature.

摘要翻译： 在测试台中用于测量温度控制的电子部件的方法和装置中，使用卡盘来保持和定位要测量的部件，其中施加有受温度控制和定向的流体流动并且使用 探头并进行测量。 将组件的温度设定为要进行测量的温度仅仅使用在限定温度下的定向流体流进行。

公开(公告)号：US20100029022A1

公开(公告)日：2010-02-04

申请号：US12025253

申请日：2008-02-04

申请人： Frank FEHRMANN ,  Juliane Busch ,  Volker Hansel ,  Daniel Ouellette ,  Stojan Kanev

发明人： Frank FEHRMANN ,  Juliane Busch ,  Volker Hansel ,  Daniel Ouellette ,  Stojan Kanev

IPC分类号： H01L21/66 ,  H01L21/67

CPC分类号： H01L21/78

摘要： In a method for producing semiconductor components, in which chips are structured, tested, and isolated into dies on a wafer, in the event of a wafer being broken during the method, undamaged chips of a fragment of the wafer delimited by at least one edge section and at least one fracture contour are processed further as usual. The method has the result that the yield of usable chips is significantly increased in relation to the discarding and disposal of broken wafers provided in the prior art. The average production costs of electronic components and the loss of valuable semiconductor materials and the costs for the disposal of the fragments viewed as discards up to this point are thus significantly reduced.

摘要翻译： 在制造半导体部件的方法中，其中芯片被构造，测试和分离到晶片上的管芯中，在该方法期间晶片破裂的情况下，由至少一个边缘限定晶片片段的未损坏的芯片 截面和至少一个断裂轮廓像往常一样进一步处理。 该方法的结果是，相对于现有技术中提供的破碎晶片的丢弃和处理，可用芯片的产量显着增加。 因此，电子元件的平均生产成本和有价值的半导体材料的损失以及被视为丢弃的片段的处理成本至今为止大大降低。