Method and arrangement for positioning a probe card
    1.
    发明授权
    Method and arrangement for positioning a probe card 有权
    定位探针卡的方法和布置

    公开(公告)号:US07733108B2

    公开(公告)日:2010-06-08

    申请号:US12329968

    申请日:2008-12-08

    IPC分类号: G01R31/02

    CPC分类号: G01R31/2891 G01R31/2887

    摘要: A method for perpendicular positioning of a probe card relative to a test substrate, includes storing a separation position approached in a first positioning step as a distance between the needle tips of the probe card and the substrate, storing a contact position approached in a second positioning step until the probe card contacts the substrate, and displaying an image of the needle tips. For avoiding erroneous operation after a probe card has been changed, when imaging the needle tips, the stored contact position is imaged and is changed until presentation of this contact position corresponds to actual height of the tips appropriate for the respective probe card and this setting is then stored as a new contact position. A display device presents the needle tips and the stored contact position and is connected to a memory, a recording device and an input device which changes the contact position.

    摘要翻译: 一种用于相对于测试基板垂直定位探针卡的方法,包括将在第一定位步骤中接近的分离位置存储为探针卡的针尖与基底之间的距离,存储在第二定位中接近的接触位置 一直到探针卡接触基板,并显示针尖的图像。 为了避免在探针卡改变之后的错误操作,当成像针尖时,存储的接触位置成像并改变,直到该接触位置的呈现对应于适合于相应探针卡的尖端的实际高度,并且该设置为 然后存储为新的联系人位置。 显示装置呈现针尖和存储的接触位置,并且连接到存储器,记录装置和改变接触位置的输入装置。

    METHOD AND DEVICE FOR FORMING A TEMPORARY ELECTRICAL CONTACT TO A SOLAR CELL
    2.
    发明申请
    METHOD AND DEVICE FOR FORMING A TEMPORARY ELECTRICAL CONTACT TO A SOLAR CELL 审中-公开
    形成与太阳能电池临时接触的方法和装置

    公开(公告)号:US20100045265A1

    公开(公告)日:2010-02-25

    申请号:US12541530

    申请日:2009-08-14

    摘要: In a method and devices for forming a temporary electrical contact to a solar cell for testing purposes, probes form a contact to the electrode terminals of a solar cell held by a sample holder. The probes are held by a probe holder and exhibit an elastic, electrically conductive contact element and at least one reference sensor. In order to form a contact, the solar cell and the probes are positioned in relation to each other, and then a probe is placed on an electrode terminal of the solar cell. To this end, a feed motion of the probe is carried out until a reference sensor of the probe generates a reference signal upon reaching a predefined distance. Then the feed motion is continued by a predefined path that goes beyond the contact element making contact with the electrode terminal, in order to carry out an overtravel.

    摘要翻译: 在用于形成用于测试目的的太阳能电池的临时电接触的方法和装置中,探针与由样品架保持的太阳能电池的电极端子形成接触。 探头由探头支架保持并且展现弹性的导电接触元件和至少一个基准传感器。 为了形成接触,太阳能电池和探针相对于彼此定位,然后将探针放置在太阳能电池的电极端子上。 为此,执行探针的进给运动,直到探针的参考传感器在达到预定距离后产生参考信号。 然后,通过超过接触元件与电极端子接触的预定路径继续进给运动,以便执行超程。

    METHOD FOR TESTING ELECTRONIC COMPONENTS AND TEST APPARATUS FOR CARRYING OUT THE METHOD
    3.
    发明申请
    METHOD FOR TESTING ELECTRONIC COMPONENTS AND TEST APPARATUS FOR CARRYING OUT THE METHOD 失效
    用于测试电子元件的方法和用于实施该方法的测试装置

    公开(公告)号:US20080180119A1

    公开(公告)日:2008-07-31

    申请号:US11947206

    申请日:2007-11-29

    IPC分类号: G01R31/26 G01R31/02

    CPC分类号: G01R31/2887

    摘要: A method and an apparatus are provided which make it possible, when testing chips arranged on a wafer, to be able to test optionally both additional components arranged on horizontal boundary lines and on vertical boundary lines. The additional components arranged on horizontal boundary lines are tested in a first position of the wafer. For testing the additional components arranged on vertical boundary lines, the wafer is rotated about its vertical axis through 90° relative to the first position into a second position. The apparatus comprises a housing and, in the housing, at least one test probe for making contact with an electronic component, a chuck for moving the wafer and a rotatably mounted additional plate operatively connected to the chuck.

    摘要翻译: 提供了一种方法和装置,其使得当测试布置在晶片上的芯片时能够可选地测试布置在水平边界线上和垂直边界线上的两个附加组件。 布置在水平边界线上的附加部件在晶片的第一位置被测试。 为了测试布置在垂直边界线上的附加组件,晶片围绕其垂直轴线相对于第一位置旋转90°进入第二位置。 该装置包括壳体,并且在壳体中,用于与电子部件接触的至少一个测试探针,用于移动晶片的卡盘和可操作地连接到卡盘的可旋转地安装的附加板。

    PROCESS FOR THE INSPECTION OF A VARIETY OF REPETITIVE STRUCTURES
    4.
    发明申请
    PROCESS FOR THE INSPECTION OF A VARIETY OF REPETITIVE STRUCTURES 审中-公开
    检查多种重复结构的过程

    公开(公告)号:US20070064992A1

    公开(公告)日:2007-03-22

    申请号:US11470884

    申请日:2006-09-07

    IPC分类号: G06K9/00

    CPC分类号: G06T7/001

    摘要: A process is provided for inspection of a variety of structures on the basis of a golden template, that was attained by recording and statistical analysis of greyscale pictures and is compared to the greyscale picture of the structure to be evaluated based on position. The underlying task is to report any such inspection process, with which a positioning of the test structure relative to the golden template and a structure detection with sub-pixel accuracy is carried out. In positioning of each further structure to be recorded, which follows a first recorded structure, the further structure is fundamentally positioned in accordance with the first positioned structure, applicable characteristic values of the greyscale picture recorded in this position are determined and hence a degree of similarity is determined. On this basis, the position of further structures relative to the primary position are determined and corrected with sub-pixel accuracy, before a new greyscale picture is recorded, which forms the basis for further analysis.

    摘要翻译: 提供了一种基于黄色模板来检查各种结构的过程,这是通过记录和统计分析灰度图像而获得的,并且与基于位置的待评估结构的灰度图像进行比较。 基本任务是报告任何这样的检查过程,通过该过程,测试结构相对于黄金模板的定位和进行子像素精度的结构检测。 在按照第一记录结构进行记录的每个另外的结构的定位中,根据第一定位结构基本上定位另外的结构,确定记录在该位置的灰度图像的适用特征值,并因此确定相似度 决心,决意,决定。 在此基础上,在记录新的灰度图像之前,以子像素精度确定和校正进一步结构相对于主位置的位置,这是进一步分析的基础。

    Test apparatus for testing substrates at low temperatures
    5.
    发明授权
    Test apparatus for testing substrates at low temperatures 有权
    用于在低温下测试基板的测试装置

    公开(公告)号:US07046025B2

    公开(公告)日:2006-05-16

    申请号:US10677178

    申请日:2003-10-02

    IPC分类号: G01R31/02

    摘要: A test apparatuss for testing substrates at low temperatures has a chuck, which can be displaced in the working area by means of a chuck drive, the temperature of which can be controlled using heating and cooling means. The chuck has a receiving surface for receiving a test substrate and holding means for fixing a substrate carrier which receives the test substrate. Spatially and thermally defined test conditions are maintained with minimal energy and labor costs both at room temperatures and at low temperatures. This is achieved by providing a vacuum chamber which surrounds the working area of the chuck. The chuck is on one side thermally decoupled from the uncooled chuck drive and on the other side is thermally connected in a releasable manner to the test substrate. The cooled chuck and the cooled test substrate are shielded from the thermal radiation of the surrounding uncooled assemblies by means of a directly cooled thermal radiation shield.

    摘要翻译: 用于在低温下测试基板的测试装置具有卡盘,该卡盘可以通过卡盘驱动器在工作区域中移动,卡盘驱动器的温度可以使用加热和冷却装置来控制。 卡盘具有用于接收测试基板的接收表面和用于固定接收测试基板的基板载体的保持装置。 空间和热定义的测试条件在室温和低温下以最小的能量和劳动成本维持。 这通过提供围绕卡盘的工作区域的真空室来实现。 卡盘在一侧与非冷却的卡盘驱动器热分离,另一侧以可释放的方式热连接到测试基板。 通过直接冷却的热辐射屏蔽将冷却的卡盘和冷却的测试基板与周围的未冷却组件的热辐射隔离。

    Method for increasing the accuracy of the positioning of a first object relative to a second object
    6.
    发明授权
    Method for increasing the accuracy of the positioning of a first object relative to a second object 有权
    提高第一物体相对于第二物体的定位精度的方法

    公开(公告)号:US08094925B2

    公开(公告)日:2012-01-10

    申请号:US12619327

    申请日:2009-11-16

    IPC分类号: G06K9/00 G06K9/32

    CPC分类号: G06T7/74 G06T2207/30148

    摘要: A method is provided for increasing the accuracy of the positioning of a first object relative to a second object. The method overcomes the disadvantageous influence of thermal drift between a first and a second object during a positioning of a first object on a second object. The method finds applications in manufacturing, for example, in the manufacturing of semiconductor components. The method utilizes recognition of structures on the second object which have a minimum structure width. At a first instant, using one recognition procedure, the first object is positioned on the second object in a desired position. The relative displacement of the two objects is determined at the first instant and on at least one subsequent instant. A second recognition procedure may be used for this purpose. The second recognition procedure may have a resolution accuracy which is different than the resolution accuracy of the first resolution procedure. The second recognition procedure may be a pattern recognition method. The relative displacement determined at the second instant is used to correct the positioning of the first and second objects as necessary to maintain a desired position of the two objects.

    摘要翻译: 提供了一种用于增加第一物体相对于第二物体的定位精度的方法。 该方法克服了在将第一物体定位在第二物体上时第一和第二物体之间的热漂移的不利影响。 该方法在例如制造半导体部件的制造中得到应用。 该方法利用具有最小结构宽度的第二物体上的结构的识别。 在第一时刻,使用一个识别过程,第一个物体位于第二个物体上所需的位置上。 两个对象的相对位移在第一时刻和至少一个后续时刻确定。 为此目的可以使用第二识别程序。 第二识别程序可以具有与第一解析过程的分辨率精度不同的分辨率精度。 第二识别程序可以是模式识别方法。 在第二时刻确定的相对位移用于根据需要校正第一和第二物体的定位,以保持两个物体的期望位置。

    Method for measurement of a device under test
    8.
    发明授权
    Method for measurement of a device under test 有权
    被测设备的测量方法

    公开(公告)号:US07573283B2

    公开(公告)日:2009-08-11

    申请号:US11765019

    申请日:2007-06-19

    IPC分类号: G01R31/06

    CPC分类号: G01R31/2891

    摘要: A method is disclosed for measurement of wafers and other semiconductor components in a probe station, which serves for examination and testing of electronic components. The device under test is held by a chuck and at least one electric probe by a probe support and the device under test and the probe are selectively positioned relative to each other by a positioning device with electric drives and the device under test is contacted. The drive of the positioning device remains in a state of readiness until establishment of contact and is switched off after establishment of contact and before measurement of the device under test.

    摘要翻译: 公开了一种用于测量探针台中的晶片和其它半导体部件的方法,其用于电子部件的检查和测试。 被测器件由卡盘和至少一个电探头通过探针支架和被测器件保持,并且探针通过具有电驱动器的定位装置相对于彼此选择性地定位,并且被测器件被接触。 定位装置的驱动器保持在准备状态,直到建立接触并且在建立接触之后和在测试装置的测量之前被关闭。

    METHOD FOR MEASUREMENT OF A DEVICE UNDER TEST
    9.
    发明申请
    METHOD FOR MEASUREMENT OF A DEVICE UNDER TEST 有权
    测量装置的方法

    公开(公告)号:US20080315903A1

    公开(公告)日:2008-12-25

    申请号:US11765019

    申请日:2007-06-19

    IPC分类号: G01R31/02 G01R1/04

    CPC分类号: G01R31/2891

    摘要: A method is disclosed for measurement of wafers and other semiconductor components in a probe station, which serves for examination and testing of electronic components. The device under test is held by a chuck and at least one electric probe by a probe support and the device under test and the probe are selectively positioned relative to each other by a positioning device with electric drives and the device under test is contacted. The drive of the positioning device remains in a state of readiness until establishment of contact and is switched off after establishment of contact and before measurement of the device under test.

    摘要翻译: 公开了一种用于测量探针台中的晶片和其它半导体部件的方法,其用于电子部件的检查和测试。 被测器件由卡盘和至少一个电探头通过探针支架和被测器件保持,并且探针通过具有电驱动器的定位装置相对于彼此选择性地定位,并且被测器件被接触。 定位装置的驱动器保持在准备状态,直到建立接触并且在建立接触之后和在测试装置的测量之前被关闭。

    PROBE STATION AND METHOD FOR MEASUREMENTS OF SEMICONDUCTOR DEVICES UNDER DEFINED ATMOSPHERE
    10.
    发明申请
    PROBE STATION AND METHOD FOR MEASUREMENTS OF SEMICONDUCTOR DEVICES UNDER DEFINED ATMOSPHERE 有权
    探测台和定义大气半导体器件测量方法

    公开(公告)号:US20080143365A1

    公开(公告)日:2008-06-19

    申请号:US11943975

    申请日:2007-11-21

    IPC分类号: G01R31/26

    CPC分类号: G01R31/2881

    摘要: A prober is described that is suitable for testing of semiconductor substrates under atmospheric conditions that deviate from ambient conditions. The prober includes a chuck for mounting of a semiconductor substrate and a probe holder for mounting of test tips for electrical contacting of the semiconductor substrate. The semiconductor substrate and test tips are arranged within a housing sealed relative to the surrounding atmosphere. The housing comprises two housing parts joined with a seal. The seal can be inflated with two different pressures and is less deformable at higher pressure. For testing of the semiconductor substrate, coarse positioning of the semiconductor substrate relative to the test tips occurs under atmospheric conditions and then fine positioning with the sealed housing and deformable seal before the lower deformability of the seal is produced at higher pressure in the seal and the semiconductor substrate is contacted by the test tips and tested.

    摘要翻译: 描述了适用于在大气条件下偏离环境条件的半导体衬底的测试的探测器。 探测器包括用于安装半导体衬底的卡盘和用于安装用于半导体衬底的电接触的测试尖端的探针保持器。 半导体衬底和测试尖端布置在相对于周围大气密封的壳体内。 壳体包括与密封件连接的两个壳体部件。 密封件可以用两种不同的压力充气,并且在较高压力下可变形较小。 为了测试半导体衬底,半导体衬底相对于测试尖端的粗略定位发生在大气条件下,然后在密封件的较高压力下产生密封件的较低可变形性之前用密封壳体和可变形密封件进行精细定位, 半导体衬底被测试头接触并进行测试。