公开(公告)号：US20110027539A1

公开(公告)日：2011-02-03

申请号：US12304218

申请日：2007-06-13

Applicant: Carl B Wang ,  Michael Arnett Smith

Inventor： Carl B Wang ,  Michael Arnett Smith

IPC: B32B3/08 ,  B32B37/02 ,  B29C65/02 ,  B32B18/00

CPC classification number: H05K3/4611 ,  B32B18/00 ,  C03C3/064 ,  C03C3/068 ,  C03C3/091 ,  C03C3/19 ,  C03C3/21 ,  C03C8/14 ,  C04B2237/341 ,  C04B2237/343 ,  C04B2237/346 ,  C04B2237/348 ,  C04B2237/56 ,  C04B2237/62 ,  C04B2237/64 ,  C04B2237/66 ,  C04B2237/68 ,  H01L21/4807 ,  H01L21/4857 ,  H05K1/0306 ,  H05K3/0052 ,  H05K3/4629 ,  H05K2203/074 ,  H05K2203/308 ,  Y10T428/24628

Abstract: This invention relates to a process which produces crack-free, non-camber, distortion-free, zero-shrink, LTCC bodies, composites, modules or packages from precursor green (unfired) laminates of multilayer structure with one or more different dielectric tape chemistries that are patterned with co-fireable thick film circuitry materials such as conductor, via fill, capacitor, inductor, or resistor for each tape layer including both top and bottom surface tape layers in direct contact with the sacrificial release tape.

Abstract translation: 本发明涉及一种从具有一个或多个不同介质带化学物质的多层结构的前驱绿色（未烧制）层压体产生无裂纹，非弯曲，无变形，零收缩，LTCC体，复合材料，模块或封装的方法 图案化为可共同的厚膜电路材料，例如导体，通孔填充物，电容器，电感器或电阻器，用于每个带层，包括与牺牲剥离带直接接触的顶部和底部表面带层。