公开(公告)号：US20100136239A1

公开(公告)日：2010-06-03

申请号：US12696198

申请日：2010-01-29

Applicant: Carl B. Wang ,  Christopher J. Roach ,  Fong-Pei Chang

Inventor： Carl B. Wang ,  Christopher J. Roach ,  Fong-Pei Chang

IPC: B05D3/02 ,  H01J7/18

CPC classification number: H01L23/26 ,  B01J20/183 ,  B01J20/28026 ,  B01J20/2803 ,  B01J20/28033 ,  C03C8/02 ,  C03C8/04 ,  C03C8/10 ,  C03C8/24 ,  C03C8/245 ,  C03C27/06 ,  H01L51/5259 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/00

Abstract: The invention is directed to a process for making screen-printable getter composition comprising: (a) glass frit; and (b) pre-hydrated desiccant material; dispersed in (c) organic medium. The present invention further relates to a getter composition utilizing low-softening temperature glasses comprising, based on weight %, 1-50% SiO2, 0-80% B2O3, 0-90% Bi2O3, 0-90% PbO, 0-90% P2O5, 0-60% Li2O, 0-30% Al2O3, 0-10% K2O, 0-10% Na2O, and 0-30% MO where M is selected from Ba, Sr, Ca, Zn, Cu, Mg and mixtures thereof. The glasses described herein may contain several other oxide constituents that can substitute glass network-forming elements or modify glass structure.The desiccant material is pre-hydrated to reach its saturation level of moisture absorption. The process of pre-hydration can be done by exposing the desiccant in a normal temperature/humidity environment of for example, 25° C. and 50-60% RH. For 24 to 48 hours or up to the time when weight gain (due to moisture absorption) stops increasing. An accelerated hydration process in a chamber with higher than normal humidity level (i.e. 50% Relative Humidity) is also applicable to shorten the time of exposure to fully hydrate the desiccant material.

Abstract translation: 本发明涉及一种制备可印版吸气剂组合物的方法，包括：（a）玻璃料; 和（b）预水化干燥剂材料; 分散在（c）有机介质中。 本发明还涉及一种使用低软化温度的玻璃的吸气剂组合物，该组合物的重量百分数为1-50％SiO 2，0-80％B 2 O 3，0-90％Bi 2 O 3，0-90％PbO，0-90％ P 2 O 5，0-60％Li 2 O，0-30％Al 2 O 3，0-10％K 2 O，0-10％Na 2 O和0-30％MO，其中M选自Ba，Sr，Ca，Zn，Cu，Mg和混合物 其中。 本文所述的玻璃可以包含可以代替玻璃网络形成元件或改变玻璃结构的几种其它氧化物成分。 干燥剂材料预水合以达到其饱和吸湿水平。 预水合的过程可以通过在例如25℃和50-60％RH的常温/湿度环境中暴露干燥剂来进行。 24至48小时或直到体重增加（由于吸湿）停止增加的时间。 具有高于正常湿度水平（即50％相对湿度）的室中的加速水化过程也适用于缩短暴露于充分水合干燥剂材料的时间。

公开(公告)号：US07550319B2

公开(公告)日：2009-06-23

申请号：US11510170

申请日：2006-08-25

Applicant: Carl B. Wang ,  Shih-Ming Kao ,  Yu-Cheng Lin ,  Jaw-Shin Cheng

Inventor： Carl B. Wang ,  Shih-Ming Kao ,  Yu-Cheng Lin ,  Jaw-Shin Cheng

IPC: H01L21/44 ,  H01L21/48

CPC classification number: H01L33/486 ,  C03C8/02 ,  C03C8/10 ,  C04B35/10 ,  H01L25/0753 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01004 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01046 ,  H01L2924/01055 ,  H01L2924/01057 ,  H01L2924/01063 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19107 ,  H01L2924/3011 ,  H05K1/0306 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: The present invention provides LTCC (low temperature co-fired ceramic) tape compositions and demonstrates the use of said LTCC tape(s) in the formation of Light-Emitting Diode (LED) chip carriers and modules for various lighting applications. The present invention also provides for the use of (LTCC) tape and LED modules in the formation of lighting devices including, but not limited to, LED devices, High Brightness (HB) LED backlights, display-related light sources, automotive lighting, decorative lighting, signage and advertisement lighting, and information display lighting.

Abstract translation: 本发明提供了LTCC（低温共烧陶瓷）胶带组合物，并展示了所述LTCC胶带在形成用于各种照明应用的发光二极管（LED）芯片载体和模块中的用途。 本发明还提供了（LTCC）带和LED模块在形成照明装置中的应用，包括但不限于LED装置，高亮度（HB）LED背光，显示器相关光源，汽车照明，装饰 照明，标牌和广告照明，以及信息显示照明。

公开(公告)号：US07068492B2

公开(公告)日：2006-06-27

申请号：US10994423

申请日：2004-11-22

Applicant: Carl B. Wang ,  Kenneth Warren Hang ,  Christopher R. Needes

Inventor： Carl B. Wang ,  Kenneth Warren Hang ,  Christopher R. Needes

IPC: H01G4/06

CPC classification number: B32B18/00 ,  C03C14/002 ,  C03C2214/04 ,  C03C2214/30 ,  C04B2235/5436 ,  C04B2235/5445 ,  C04B2235/6025 ,  C04B2235/6562 ,  C04B2237/341 ,  C04B2237/345 ,  C04B2237/564 ,  H01L21/481 ,  H01L21/4857 ,  H01L23/15 ,  H01L23/49894 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K1/162 ,  H05K3/4629 ,  H05K3/4688 ,  H01L2924/00

Abstract: This invention relates to a process which produces flat, distortion-free, zero-shrink, low-temperature co-fired ceramic (LTCC) bodies, composites, modules or packages from precursor green (unfired) laminates of three or more different dielectric tape chemistries that are configured in an uniquely or pseudo-symmetrical arrangement in the z-axis of the laminate.

Abstract translation: 本发明涉及一种从三种或更多种不同介质带化学物质的前驱绿色（未烧制）层压板产生平坦，无变形，零收缩，低温共烧陶瓷（LTCC）体，复合材料，模块或封装的方法 其被配置为在层压体的z轴中的唯一或伪对称布置。

公开(公告)号：US07048993B2

公开(公告)日：2006-05-23

申请号：US10850878

申请日：2004-05-21

Applicant: Carl B. Wang ,  Kenneth Warren Hang ,  Christopher R. Needes

Inventor： Carl B. Wang ,  Kenneth Warren Hang ,  Christopher R. Needes

IPC: B32B3/00

CPC classification number: H01L23/49894 ,  C03B19/06 ,  C03C14/004 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K3/4629 ,  Y10T428/12618 ,  Y10T428/1476 ,  Y10T428/24926 ,  H01L2924/00

Abstract: A method to produce a distortion-free asymmetrical low-temperature co-fired ceramic structure comprising at least one layer of glass-containing internal constraining tape and at least one layer of glass-containing primary tape wherein the internal constraining tape and the primary tape are laminated to form an asymmetrical laminate and wherein a release layer is deposited on at least one surface of the laminate forming an assembly, wherein the surface is opposite the position of greatest asymmetry of the laminated layers and wherein the assembly is thermally processed producing a structure exhibiting an interactive suppression of x,y shrinkage.

Abstract translation: 一种产生无变形的不对称低温共烧陶瓷结构的方法，其包括至少一层含玻璃的内部约束带和至少一层含玻璃的主带，其中内部约束带和主带是 层压以形成不对称层压板，并且其中在形成组件的层压体的至少一个表面上沉积剥离层，其中所述表面与层压层的最大不对称位置相反，并且其中所述组件被热加工，产生显示 互相抑制x，y收缩。

公开(公告)号：US08323802B2

公开(公告)日：2012-12-04

申请号：US12491692

申请日：2009-06-25

Applicant: Meredith L. Dunbar ,  Yueh-Ling Lee ,  Carl B. Wang

Inventor： Meredith L. Dunbar ,  Yueh-Ling Lee ,  Carl B. Wang

IPC: B32B27/06

CPC classification number: C08L79/08 ,  C08G73/1046 ,  C08G73/105 ,  C08G73/1067 ,  C08G73/1071 ,  C08J5/18 ,  C08J2379/08 ,  C08K3/013 ,  C08K3/22 ,  H05K1/0346 ,  H05K1/036 ,  H05K1/0373 ,  H05K3/185 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2203/107 ,  Y10T428/31721 ,  Y10T428/31725

Abstract: The present invention relates generally to polyimide composites having dispersed in the polyimide base matrix, useful spinel crystal fillers wherein the composite has a visible-to-infrared light extinction coefficient between and including 0.05 and 0.60 microns−1. The composite polyimides formed therefrom are typically used to make circuits having fine electrically conductive pathways adjacent to the polyimide substrate. These fine electrically conductive pathways are typically formed on the substrate using an electro-less metal plating step. First, the surface of the polyimide composite is light activated, typically by using a laser beam, then the light activated portions are plated to form thin lines, or pathways, on the film's surface.

Abstract translation: 本发明一般涉及分散在聚酰亚胺基体中的聚酰亚胺复合材料，它是有用的尖晶石晶体填料，其中复合材料具有介于0.05和0.60微米-1之间的可见光到红外光消光系数。 由此形成的复合聚酰亚胺通常用于制造具有与聚酰亚胺基底相邻的精细导电路径的电路。 通常使用无电极金属电镀步骤在基板上形成这些精细的导电通路。 首先，聚酰亚胺复合材料的表面通常通过使用激光束进行光激活，然后将光活化部分电镀以在膜的表面上形成细线或路径。

公开(公告)号：US07808097B2

公开(公告)日：2010-10-05

申请号：US12467604

申请日：2009-07-28

Applicant: Carl B. Wang ,  Shih-Ming Kao ,  Yu-Cheng Lin ,  Jaw-Shin Cheng

Inventor： Carl B. Wang ,  Shih-Ming Kao ,  Yu-Cheng Lin ,  Jaw-Shin Cheng

IPC: H01L23/053 ,  H01L31/0232

CPC classification number: H01L33/486 ,  C03C8/02 ,  C03C8/10 ,  C04B35/10 ,  H01L25/0753 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01004 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01046 ,  H01L2924/01055 ,  H01L2924/01057 ,  H01L2924/01063 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19107 ,  H01L2924/3011 ,  H05K1/0306 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: The present invention provides LTCC (low temperature co-fired ceramic) tape compositions and demonstrates the use of said LTCC tape(s) in the formation of Light-Emitting Diode (LED) chip carriers and modules for various lighting applications. The present invention also provides for the use of (LTCC) tape and LED modules in the formation of lighting devices including, but not limited to, LED devices, High Brightness (HB) LED backlights, display-related light sources, automotive lighting, decorative lighting, signage and advertisement lighting, and information display lighting.

Abstract translation: 本发明提供了LTCC（低温共烧陶瓷）胶带组合物，并展示了所述LTCC胶带在形成用于各种照明应用的发光二极管（LED）芯片载体和模块中的用途。 本发明还提供了（LTCC）带和LED模块在形成照明装置中的应用，包括但不限于LED装置，高亮度（HB）LED背光，显示器相关光源，汽车照明，装饰 照明，标牌和广告照明，以及信息显示照明。

公开(公告)号：US20090278162A1

公开(公告)日：2009-11-12

申请号：US12467604

申请日：2009-07-28

Applicant: Carl B. Wang ,  Shih-Ming Kao ,  Yu-Cheng Lin ,  Jaw-Shin Cheng

Inventor： Carl B. Wang ,  Shih-Ming Kao ,  Yu-Cheng Lin ,  Jaw-Shin Cheng

IPC: H01L33/00 ,  C03C8/14

CPC classification number: H01L33/486 ,  C03C8/02 ,  C03C8/10 ,  C04B35/10 ,  H01L25/0753 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01004 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01046 ,  H01L2924/01055 ,  H01L2924/01057 ,  H01L2924/01063 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19107 ,  H01L2924/3011 ,  H05K1/0306 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: The present invention provides LTCC (low temperature co-fired ceramic) tape compositions and demonstrates the use of said LTCC tape(s) in the formation of Light-Emitting Diode (LED) chip carriers and modules for various lighting applications. The present invention also provides for the use of (LTCC) tape and LED modules in the formation of lighting devices including, but not limited to, LED devices, High Brightness (HB) LED backlights, display-related light sources, automotive lighting, decorative lighting, signage and advertisement lighting, and information display lighting.

Abstract translation: 本发明提供了LTCC（低温共烧陶瓷）胶带组合物，并展示了所述LTCC胶带在形成用于各种照明应用的发光二极管（LED）芯片载体和模块中的用途。 本发明还提供了（LTCC）带和LED模块在形成照明装置中的应用，包括但不限于LED装置，高亮度（HB）LED背光，显示器相关光源，汽车照明，装饰 照明，标牌和广告照明，以及信息显示照明。

公开(公告)号：US07547849B2

公开(公告)日：2009-06-16

申请号：US11153206

申请日：2005-06-15

Applicant: Yueh-Ling Lee ,  Meredith L. Dunbar ,  Harry Richard Zwicker ,  Carl B. Wang ,  Brian C. Auman ,  Shane Fang

Inventor： Yueh-Ling Lee ,  Meredith L. Dunbar ,  Harry Richard Zwicker ,  Carl B. Wang ,  Brian C. Auman ,  Shane Fang

IPC: H05K1/00 ,  B32B3/00

CPC classification number: H05K3/185 ,  C23C18/02 ,  C23C18/1216 ,  C23C18/1233 ,  C23C18/1295 ,  C23C18/204 ,  Y10T428/24917 ,  Y10T428/25 ,  Y10T428/31511 ,  Y10T428/3154 ,  Y10T428/31725 ,  Y10T428/31786

Abstract: A light-activatable polymer composition and polymer composite includes a polymer binder selected from epoxy resins, silica filled epoxy, bismaleimide resins, bismaleimide triazines, fluoropolymers, polyesters, polyphenylene oxide/polyphenylene ether resins, polybutadiene/polyisoprene crosslinkable resins (and copolymers), liquid crystal polymers, polyamides, cyanate esters, or combinations thereof, the polymer binder being present in an amount from 40, 45, 50, 55, 60, 65, 70, 75, 80, 85, 90, 95, 96, or 97 weight-percent of the total weight of the polymer composition; a spinel crystal filler present in an amount from 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 20, 25, 30, 35, 40, 45, 50, 55 and 60 weight-percent of the total weight of the polymer composition, and methods for making same are provided.

Abstract translation: 可光活化的聚合物组合物和聚合物复合材料包括选自环氧树脂，二氧化硅填充的环氧树脂，双马来酰亚胺树脂，双马来酰亚胺三嗪，含氟聚合物，聚酯，聚苯醚/聚苯醚树脂，聚丁二烯/聚异戊二烯交联树脂（和共聚物），液体 结晶聚合物，聚酰胺，氰酸酯或其组合，聚合物粘合剂的存在量为40,45,50,55,60,65,70,75,80,85,90,95,96或97重量 - 聚合物组合物的总重量; 存在量为3,4,5,6,7,8,9,10,11,12,13,14,15,20,25,30,35,40,45,50,55的尖晶石晶体填料 和60重量％的聚合物组合物的总重量，以及制备其的方法。

公开(公告)号：US07175724B2

公开(公告)日：2007-02-13

申请号：US10994507

申请日：2004-11-22

Applicant: Carl B. Wang ,  Kenneth Warren Hang ,  Christopher R. Needes

Inventor： Carl B. Wang ,  Kenneth Warren Hang ,  Christopher R. Needes

IPC: B32B37/18 ,  B32B37/06 ,  B32B3/00 ,  H01G4/06 ,  C03B29/00

CPC classification number: H05K3/4688 ,  C03C3/091 ,  C03C10/0045 ,  C03C10/0054 ,  H01L21/481 ,  H01L23/15 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K3/4629 ,  Y10T428/24926 ,  H01L2924/00

Abstract: This invention relates to a process which produces flat, distortion-free, zero-shrink, low-temperature co-fired ceramic (LTCC) bodies, composites, modules or packages from precursor green (unfired) laminates of three or more different dielectric tape chemistries that are configured in an uniquely or pseudo-symmetrical arrangement in the z-axis of the laminate.

Abstract translation: 本发明涉及一种从三种或更多种不同介质带化学物质的前驱绿色（未烧制）层压板产生平坦，无变形，零收缩，低温共烧陶瓷（LTCC）体，复合材料，模块或封装的方法 其被配置为在层压体的z轴中的唯一或伪对称布置。

公开(公告)号：US20090263639A1

公开(公告)日：2009-10-22

申请号：US12491692

申请日：2009-06-25

Applicant: MEREDITH L. DUNBAR ,  Yueh-Ling Lee ,  Carl B. Wang

Inventor： MEREDITH L. DUNBAR ,  Yueh-Ling Lee ,  Carl B. Wang

IPC: B32B27/06 ,  C08K3/22 ,  B28B1/14 ,  B05D3/06

CPC classification number: C08L79/08 ,  C08G73/1046 ,  C08G73/105 ,  C08G73/1067 ,  C08G73/1071 ,  C08J5/18 ,  C08J2379/08 ,  C08K3/013 ,  C08K3/22 ,  H05K1/0346 ,  H05K1/036 ,  H05K1/0373 ,  H05K3/185 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2203/107 ,  Y10T428/31721 ,  Y10T428/31725

Abstract: The present invention relates generally to polyimide composites having dispersed in the polyimide base matrix, useful spinel crystal fillers wherein the composite has a visible-to-infrared light extinction coefficient between and including 0.05 and 0.60 microns−1. The composite polyimides formed therefrom are typically used to make circuits having fine electrically conductive pathways adjacent to the polyimide substrate. These fine electrically conductive pathways are typically formed on the substrate using an electro-less metal plating step. First, the surface of the polyimide composite is light activated, typically by using a laser beam, then the light activated portions are plated to form thin lines, or pathways, on the film's surface.

Abstract translation: 本发明一般涉及分散在聚酰亚胺基体中的聚酰亚胺复合材料，它是有用的尖晶石晶体填料，其中复合材料具有介于0.05和0.60微米-1之间的可见光到红外光消光系数。 由此形成的复合聚酰亚胺通常用于制造具有与聚酰亚胺基底相邻的精细导电路径的电路。 通常使用无电极金属电镀步骤在基板上形成这些精细的导电通路。 首先，聚酰亚胺复合材料的表面通常通过使用激光束进行光激活，然后将光活化部分电镀以在膜的表面上形成细线或路径。