公开(公告)号：US20110027539A1

公开(公告)日：2011-02-03

申请号：US12304218

申请日：2007-06-13

Applicant: Carl B Wang ,  Michael Arnett Smith

Inventor： Carl B Wang ,  Michael Arnett Smith

IPC: B32B3/08 ,  B32B37/02 ,  B29C65/02 ,  B32B18/00

CPC classification number: H05K3/4611 ,  B32B18/00 ,  C03C3/064 ,  C03C3/068 ,  C03C3/091 ,  C03C3/19 ,  C03C3/21 ,  C03C8/14 ,  C04B2237/341 ,  C04B2237/343 ,  C04B2237/346 ,  C04B2237/348 ,  C04B2237/56 ,  C04B2237/62 ,  C04B2237/64 ,  C04B2237/66 ,  C04B2237/68 ,  H01L21/4807 ,  H01L21/4857 ,  H05K1/0306 ,  H05K3/0052 ,  H05K3/4629 ,  H05K2203/074 ,  H05K2203/308 ,  Y10T428/24628

Abstract: This invention relates to a process which produces crack-free, non-camber, distortion-free, zero-shrink, LTCC bodies, composites, modules or packages from precursor green (unfired) laminates of multilayer structure with one or more different dielectric tape chemistries that are patterned with co-fireable thick film circuitry materials such as conductor, via fill, capacitor, inductor, or resistor for each tape layer including both top and bottom surface tape layers in direct contact with the sacrificial release tape.

Abstract translation: 本发明涉及一种从具有一个或多个不同介质带化学物质的多层结构的前驱绿色（未烧制）层压体产生无裂纹，非弯曲，无变形，零收缩，LTCC体，复合材料，模块或封装的方法 图案化为可共同的厚膜电路材料，例如导体，通孔填充物，电容器，电感器或电阻器，用于每个带层，包括与牺牲剥离带直接接触的顶部和底部表面带层。

公开(公告)号：US08742262B2

公开(公告)日：2014-06-03

申请号：US13483837

申请日：2012-05-30

Applicant: Scott E. Gordon ,  Elizabeth D. Hughes ,  Joao Carlos Malerbi ,  Deepukumar M. Nair ,  Kumaran Manikantan Nair ,  James M. Parisi ,  Michael Arnett Smith ,  Ken E. Souders

Inventor： Scott E. Gordon ,  Elizabeth D. Hughes ,  Joao Carlos Malerbi ,  Deepukumar M. Nair ,  Kumaran Manikantan Nair ,  James M. Parisi ,  Michael Arnett Smith ,  Ken E. Souders

IPC: H05K1/09 ,  H05K1/00 ,  H05K1/03 ,  H05K3/02 ,  B05D5/12

CPC classification number: H01L23/15 ,  H01L23/49822 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/165 ,  H05K3/4061 ,  H05K3/4629 ,  H05K2201/0317 ,  H05K2201/0352 ,  H01L2924/00

Abstract: Disclosed herein is a multilayer low temperature co-fired ceramic (LTCC) structure comprising a multilayer low temperature co-fired ceramic comprising glass-ceramic dielectric layers with screen printed thick film inner conductors on portions of the layers and with thin film outer conductors deposited on the upper and lower outer surfaces of the LTCC. At least a portion of the thin film outer conductors is patterned in the form of lines and the spacings between the lines are less then 50 μm. Also disclosed is a process for making the LTCC structure.

Abstract translation: 本文公开了一种多层低温共烧陶瓷（LTCC）结构，其包括多层低温共烧陶瓷，​​其包含玻璃陶瓷电介质层，其中丝网印刷的厚膜内导体在层的部分上，并且薄膜外导体沉积在 LTCC的上下外表面。 薄膜外导体的至少一部分以线的形式图案化，并且线之间的间距小于50μm。 还公开了制造LTCC结构的方法。