公开(公告)号：USRE33197E

公开(公告)日：1990-04-10

申请号：US182479

申请日：1988-04-15

Applicant: Carlos A. Deambrosio

Inventor： Carlos A. Deambrosio

IPC: B23K3/06 ,  H05K3/34

CPC classification number: B23K3/0653 ,  B23K3/0661 ,  H05K3/3468

Abstract: Wave soldering process and apparatus for the soldering of elements such as, for example, printed circuit assemblies with surface mounted components and the like which yield improved soldering results by promoting the penetration of solder into narrow spaces between components, the filling of small holes in a board, filling crevices, filling corners adjacent to solder masks and all other areas where solder wetting is difficult to achieve with conventional machines. The process provides the steps of moving an element in a predetermined path, forming a solder wave beneath the path so that at least a portion of the element passes through the solder wave, and producing an oscillation in the solder wave during the passage of the element therethrough.

公开(公告)号：US4796558A

公开(公告)日：1989-01-10

申请号：US157959

申请日：1988-02-19

Applicant: Raymond J. Chartrand ,  Carlos A. Deambrosio

Inventor： Raymond J. Chartrand ,  Carlos A. Deambrosio

IPC: B23K35/14 ,  B23K3/00 ,  B23K3/08 ,  B05C5/02

CPC classification number: B23K3/082

Abstract: A foam fluxer for fluxing surface mounted devices on printed wiring boards is suitable for low solids content fluxes. The foam fluxer is for installation in an open tank containing liquid flux positioned under a conveyor path conveying the components. The fluxer comprises an aerator chimney housing with side walls and end walls for placement in and protruding above the open tank, the housing having a top foam outlet for positioning below the conveyor path, at least one vertical internal divider located in the housing below the foam outlet, the divider forming at least two chambers, and a porous aerator tube located in each chamber with connection means for a compressed gas supply to produce foam in each chamber, the foam from each chamber joining above the divider to exit upwards from the foam outlet.

公开(公告)号：US4684056A

公开(公告)日：1987-08-04

申请号：US830962

申请日：1986-02-19

Applicant: Carlos A. Deambrosio

Inventor： Carlos A. Deambrosio

IPC: B23K3/06 ,  H05K3/34 ,  B23K31/02

CPC classification number: B23K3/0653 ,  B23K3/0661 ,  B23K2201/42 ,  H05K3/3468

Abstract: Wave soldering process and apparatus for the soldering of elements such as, for example, printed circuit assemblies with surface mounted components and the like which yield improved soldering results by promoting the penetration of solder into narrow spaces between components, the filling of small holes in a board, filling crevices, filling corners adjacent to solder masks and all other areas where solder wetting is difficult to achieve with conventional machines. The process provides the steps of moving an element in a predetermined path, forming a solder wave beneath the path so that at least a portion of the element passes through the solder wave, and producing an oscillation in the solder wave during the passage of the element therethrough.

Abstract translation: 用于焊接元件的波峰焊工艺和装置，例如具有表面安装部件的印刷电路组件等，其通过促进焊料渗透到部件之间的狭窄空间中而产生改善的焊接结果，在 板，填充缝隙，填充与焊接掩模相邻的角落以及所有其他使用常规机器难以实现焊料润湿的区域。 该过程提供了在预定路径中移动元件的步骤，在路径下方形成焊波，使得元件的至少一部分穿过焊波，并且在元件通过期间在焊波中产生振荡 通过。

公开(公告)号：US5121874A

公开(公告)日：1992-06-16

申请号：US626728

申请日：1990-12-13

Applicant: Carlos A. Deambrosio ,  John Gileta

Inventor： Carlos A. Deambrosio ,  John Gileta

IPC: B23K1/008 ,  B23K1/08 ,  B23K3/06 ,  H05K3/34

CPC classification number: B23K1/008 ,  B23K1/085 ,  B23K3/0661 ,  H05K3/3415 ,  H05K3/3468

Abstract: A wave soldering apparatus and process occurs in an atomsphere which substantially excludes oxygen. By providing a gas blanket over the solder, reduction in dross occurs and improved soldering results avoiding the necessity of removing flux residues. Gas diffusers are provided on both sides of a solder wave in an enclosure, the diffusers are placed below the path of the element to be soldered and a further gas diffuser is positioned above the element to be soldered. The gas diffusers supply a calm gas blanket over the solder wave so no turbulent movement of gas occurs within the enclosure.

Abstract translation: 波峰焊装置和工艺发生在基本排除氧气的原子团中。 通过在焊料上提供气体覆盖层，减少浮渣发生，并改善焊接结果，避免了去除焊剂残留物的必要性。 气体扩散器设置在外壳中的焊波的两侧，扩散器被放置在要焊接的元件的路径下方，并且另外的气体扩散器位于要焊接的元件上方。 气体扩散器在焊波上提供平静的气体覆盖层，因此在外壳内不会发生气体的紊流。

公开(公告)号：US4802617A

公开(公告)日：1989-02-07

申请号：US158308

申请日：1988-02-19

Applicant: Carlos A. Deambrosio

Inventor： Carlos A. Deambrosio

IPC: B23K3/06

CPC classification number: B23K3/0653 ,  B23K2201/42

Abstract: An improved method and apparatus restricts or limits dross formation in a soldering apparatus where liquid solder overflows such as wave soldering and the like. The improvement comprises a solder receiving tray positioned beneath at least a portion of liquid solder falling from an overflow or solder wave to a reservoir and a level control means limits the maximum solder level in the tray above a dynamic solder level in the reservoir, the solder level in the tray being a predetermined distance below the overflow to limit dross formation thus restricting dross recirculation.

Abstract translation: 一种改进的方法和装置限制或限制了液体焊料如波峰焊等溢出的焊接装置中的浮渣形成。 该改进包括位于至少一部分从溢流或焊波下降到储存器的液态焊料下方的焊料接收托盘，并且液位控制装置将托盘中的最大焊料水平限制在储存器中的动态焊料水平面上方，焊料 托盘中的水平面是在溢流以下的预定距离以限制浮渣形成，从而限制浮渣再循环。

公开(公告)号：US5125556A

公开(公告)日：1992-06-30

申请号：US591118

申请日：1990-10-02

Applicant: Carlos A. Deambrosio

Inventor： Carlos A. Deambrosio

IPC: B23K1/008

CPC classification number: B23K1/008

Abstract: An infrared soldering machine has an inert gas atmosphere to prevent oxidation of the solder. Heaters positioned within the machine housing above a conveyor have through apertures and fans direct inert gas down through the heaters onto the conveyor. The forced convection assists in maintaining uniform temperature across the conveyor. In order to prevent leakage of ambient air into the housing where the fan shafts protrude for connection to electric motors, a gas seal is provided at each fan shaft. The seal extends between two spaced bearings rotatably securing the fan shaft. Each electric motor is mounted away from the heat of the machine and is connected to the respective fan shaft by means of a belt drive. A novel gas curtain, which may be clamped at different angles, improves the gas seal at entry and exit locations of the conveyor.

Abstract translation: 红外线焊接机具有惰性气体气氛以防止焊料氧化。 位于输送机上方的机器壳体内的加热器通过孔和风扇将惰性气体直接通过加热器引导到输送机上。 强制对流有助于保持整个输送机的均匀温度。 为了防止环境空气泄漏到风扇轴突出的壳体中，用于连接到电动机，在每个风扇轴处设置有气体密封。 密封件在可旋转地固定风扇轴的两个间隔开的轴承之间延伸。 每个电动机都远离机器的热量安装，并通过皮带传动装置连接到相应的风扇轴上。 可以以不同角度夹紧的新型气幕改善了输送机入口和出口处的气体密封。

公开(公告)号：US5044542A

公开(公告)日：1991-09-03

申请号：US441009

申请日：1989-11-22

Applicant: Carlos A. Deambrosio

Inventor： Carlos A. Deambrosio

IPC: B23K1/008 ,  B23K1/08 ,  B23K3/06 ,  H05K3/34

CPC classification number: B23K1/008 ,  B23K1/085 ,  B23K3/0661 ,  H05K3/3415 ,  H05K3/3468

Abstract: A wave soldering apparatus and process occurs in an atmosphere which substantially excludes oxygen. By providing a pressurized effect on an element to be soldered while passing through a solder wave, fluxless soldering is accomplished avoiding the necessity to remove flux residues. The element is preheated in a shield gas atmosphere substantially excluding oxygen, moved in a predetermined path so that at least a portion of the element passes through the solder wave which is oscillated while the element is in the solder wave and maintained in the shield gas until solder on the element has solidified.

Abstract translation: 波形焊接装置和工艺发生在基本排除氧气的气氛中。 通过在通过焊波时对要焊接的元件施加加压效应，实现无焊剂焊接，避免了去除焊剂残留物的必要性。 该元件在基本上不含氧的保护气体气氛中预热，在预定的路径中移动，使得元件的至少一部分通过在元件处于焊波中并振荡并保持在屏蔽气体中的焊波直到 元件上的焊料已凝固。