公开(公告)号：US09373533B2

公开(公告)日：2016-06-21

申请号：US14141812

申请日：2013-12-27

Applicant: Cascade Microtech, Inc.

Inventor： Frank Fehrmann ,  Botho Hirschfeld ,  Stojan Kanev

IPC: G01R31/20 ,  H01L21/677

CPC classification number: H01L21/67745 ,  H01L21/67775

Abstract: Systems and methods for providing wafer access in a wafer processing system are disclosed herein. The methods may include docking a first wafer cassette on the wafer processing system and removing a selected wafer from the first wafer cassette with the wafer processing system. The methods further may include performing a process operation on the selected wafer with the wafer processing system and undocking the first wafer cassette from the wafer processing system while performing the process operation. The methods also may include docking a second wafer cassette (which may be the same as or different from the first wafer cassette) on the wafer processing system, inventorying the second wafer cassette with the wafer processing system, and/or subsequently placing the selected wafer in the second wafer cassette. The systems may include wafer processing systems that include a controller that is programmed to perform at least a portion of the methods.

Abstract translation: 本文公开了在晶片处理系统中提供晶片访问的系统和方法。 所述方法可以包括将晶片处理系统上的第一晶片盒对接，并且利用晶片处理系统从第一晶片盒移除选定的晶片。 该方法还可以包括使用晶片处理系统在所选择的晶片上执行处理操作，并且在执行处理操作时从晶片处理系统脱离第一晶片盒。 所述方法还可以包括将第二晶片盒（其可以与第一晶片盒相同或不同）对准在晶片处理系统上，利用晶片处理系统盘存第二晶片盒，和/或随后将所选择的晶片 在第二晶片盒中。 系统可以包括晶片处理系统，其包括被编程为执行方法的至少一部分的控制器。

公开(公告)号：US20140186145A1

公开(公告)日：2014-07-03

申请号：US14141812

申请日：2013-12-27

Applicant: Cascade Microtech, Inc.

Inventor： Frank Fehrmann ,  Botho Hirschfeld ,  Stojan Kanev

IPC: H01L21/67

CPC classification number: H01L21/67745 ,  H01L21/67775

Abstract: Systems and methods for providing wafer access in a wafer processing system are disclosed herein. The methods may include docking a first wafer cassette on the wafer processing system and removing a selected wafer from the first wafer cassette with the wafer processing system. The methods further may include performing a process operation on the selected wafer with the wafer processing system and undocking the first wafer cassette from the wafer processing system while performing the process operation. The methods also may include docking a second wafer cassette (which may be the same as or different from the first wafer cassette) on the wafer processing system, inventorying the second wafer cassette with the wafer processing system, and/or subsequently placing the selected wafer in the second wafer cassette. The systems may include wafer processing systems that include a controller that is programmed to perform at least a portion of the methods.

Abstract translation: 本文公开了在晶片处理系统中提供晶片访问的系统和方法。 所述方法可以包括将晶片处理系统上的第一晶片盒对接，并且利用晶片处理系统从第一晶片盒移除选定的晶片。 该方法还可以包括使用晶片处理系统在所选择的晶片上执行处理操作，并且在执行处理操作时从晶片处理系统脱离第一晶片盒。 所述方法还可以包括将第二晶片盒（其可以与第一晶片盒相同或不同）对准在晶片处理系统上，利用晶片处理系统盘存第二晶片盒，和/或随后将所选择的晶片 在第二晶片盒中。 系统可以包括晶片处理系统，其包括被编程为执行方法的至少一部分的控制器。