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1.
公开(公告)号:US20170356957A1
公开(公告)日:2017-12-14
申请号:US15181909
申请日:2016-06-14
Applicant: Cascade Microtech, Inc.
Inventor: Timothy Allen McMullen , Brent Dale Harry , Eric James Wilcox , James J. Donlin
IPC: G01R31/28
CPC classification number: G01R31/2858 , G01R31/2818
Abstract: Systems and methods for electrically testing electromigration in an electromigration test structure are disclosed herein. The systems include a voltage control portion, a current control portion, and a current regulating structure. The systems further include an electric current detector, a first system connection, and a second system connection. The systems also include a voltage detector, and a controller. In some embodiments of the methods, a voltage control portion regulates a high-side signal electric current to maintain a voltage difference below a voltage setpoint while a current control portion maintains the high-side signal electric current below a threshold current value. In some embodiments of the methods, one of the voltage difference and a magnitude of the high-side signal electric current is selected as a primary control parameter while the other is selected as a compliant control parameter.
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2.
公开(公告)号:US10060963B2
公开(公告)日:2018-08-28
申请号:US15471199
申请日:2017-03-28
Applicant: Cascade Microtech, Inc.
Inventor: Timothy Allen McMullen , Jeffery Allan Shepler , Clint Vander Giessen
IPC: G01R31/00
CPC classification number: G01R31/003 , G01R31/2863 , G01R31/2874
Abstract: Probe systems, storage media, and methods for wafer-level testing over extended temperature ranges are disclosed herein. The methods are configured to test a plurality of devices under test (DUTs) present on a substrate. The probe systems are programmed to perform the methods. The storage media include computer-readable instructions that direct a probe system to perform the methods.
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3.
公开(公告)号:US10161994B2
公开(公告)日:2018-12-25
申请号:US15181909
申请日:2016-06-14
Applicant: Cascade Microtech, Inc.
Inventor: Timothy Allen McMullen , Brent Dale Harry , Eric James Wilcox , James J. Donlin
IPC: G01R31/28
Abstract: Systems and methods for electrically testing electromigration in an electromigration test structure are disclosed herein. The systems include a voltage control portion, a current control portion, and a current regulating structure. The systems further include an electric current detector, a first system connection, and a second system connection. The systems also include a voltage detector, and a controller. In some embodiments of the methods, a voltage control portion regulates a high-side signal electric current to maintain a voltage difference below a voltage setpoint while a current control portion maintains the high-side signal electric current below a threshold current value. In some embodiments of the methods, one of the voltage difference and a magnitude of the high-side signal electric current is selected as a primary control parameter while the other is selected as a compliant control parameter.
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4.
公开(公告)号:US20170285083A1
公开(公告)日:2017-10-05
申请号:US15471199
申请日:2017-03-28
Applicant: Cascade Microtech, Inc.
Inventor: Timothy Allen McMullen , Jeffery Allan Shepler , Clint Vander Giessen
IPC: G01R31/00
CPC classification number: G01R31/003 , G01R31/2863 , G01R31/2874
Abstract: Probe systems, storage media, and methods for wafer-level testing over extended temperature ranges are disclosed herein. The methods are configured to test a plurality of devices under test (DUTs) present on a substrate. The probe systems are programmed to perform the methods. The storage media include computer-readable instructions that direct a probe system to perform the methods.
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