公开(公告)号：US08421013B2

公开(公告)日：2013-04-16

申请号：US12659176

申请日：2010-02-26

申请人： Chan-wook Baik ,  Seung-ho Bak ,  Jong-min Kim ,  Gun-sik Park

发明人： Chan-wook Baik ,  Seung-ho Bak ,  Jong-min Kim ,  Gun-sik Park

IPC分类号： G01J1/00

CPC分类号： H01Q15/006

摘要： An electromagnetic wave transmission filter may include a substrate and one or more coils. The one or more coils may be at least partly disposed in an opening through the substrate. An electromagnetic camera may include an electromagnetic wave detector array, including a plurality of detector cells for detecting electromagnetic waves, and an electromagnetic wave transmission filter disposed in front of the electromagnetic wave detector array to provide each of the detector cells with an electromagnetic wave of a certain wavelength. The electromagnetic wave transmission filter may includes a substrate and a plurality of coils. At least one of the plurality of coils may be at least partly disposed in each of a plurality of openings through the substrate.

摘要翻译： 电磁波传输滤波器可以包括基板和一个或多个线圈。 一个或多个线圈可以至少部分地设置在通过基板的开口中。 电磁摄像机可以包括电磁波检测器阵列，其包括用于检测电磁波的多个检测器单元，以及设置在电磁波检测器阵列之前的电磁波传输滤波器，以向每个检测器单元提供电磁波 一定的波长。 电磁波传输滤波器可以包括基板和多个线圈。 多个线圈中的至少一个可以至少部分地设置在穿过基底的多个开口中的每一个中。

公开(公告)号：US20110090025A1

公开(公告)日：2011-04-21

申请号：US12659176

申请日：2010-02-26

申请人： Chan-wook Baik ,  Seung-ho Bak ,  Jong-min Kim ,  Gun-sik Park

发明人： Chan-wook Baik ,  Seung-ho Bak ,  Jong-min Kim ,  Gun-sik Park

IPC分类号： H03H5/00

CPC分类号： H01Q15/006

摘要： An electromagnetic wave transmission filter may include a substrate and one or more coils. The one or more coils may be at least partly disposed in an opening through the substrate. An electromagnetic camera may include an electromagnetic wave detector array, including a plurality of detector cells for detecting electromagnetic waves, and an electromagnetic wave transmission filter disposed in front of the electromagnetic wave detector array to provide each of the detector cells with an electromagnetic wave of a certain wavelength. The electromagnetic wave transmission filter may includes a substrate and a plurality of coils. At least one of the plurality of coils may be at least partly disposed in each of a plurality of openings through the substrate.

摘要翻译： 电磁波传输滤波器可以包括基板和一个或多个线圈。 一个或多个线圈可以至少部分地设置在通过基板的开口中。 电磁摄像机可以包括电磁波检测器阵列，其包括用于检测电磁波的多个检测器单元，以及设置在电磁波检测器阵列之前的电磁波传输滤波器，以向每个检测器单元提供电磁波 一定的波长。 电磁波传输滤波器可以包括基板和多个线圈。 多个线圈中的至少一个可以至少部分地设置在穿过基底的多个开口中的每一个中。

公开(公告)号：US07609805B2

公开(公告)日：2009-10-27

申请号：US11896273

申请日：2007-08-30

申请人： Chan-wook Baik ,  Yong-wan Jin ,  Gun-sik Park ,  Jong-min Kim ,  Young-min Shin ,  Jin-kyu So

发明人： Chan-wook Baik ,  Yong-wan Jin ,  Gun-sik Park ,  Jong-min Kim ,  Young-min Shin ,  Jin-kyu So

IPC分类号： G21K5/00

CPC分类号： G03F7/00 ,  G03F1/22 ,  G03F9/7053 ,  G03F9/7076

摘要： A mask used for a Lithographie, Galvanofomung, and Abformung (LIGA) process, a method for manufacturing the mask, and a method for manufacturing a microstructure using a LIGA process. The method for manufacturing the microstructure using the LIGA process contemplates forming a substrate for the microstructure, a plurality of photosensitive layers, each photosensitive layer having a plating hole and an aligning pinhole, and an aligning pin capable of being inserted into the aligning pinhole, with the aligning pinholes of the photosensitive layers being formed in corresponding positions, and repeating a process of stacking the photosensitive layer on the substrate for the microstructure and a process of forming a plating layer by plating the plating hole of the stacked photosensitive layer with a metal for a number of times corresponding to the number of the photosensitive layers, and when the photosensitive layers are stacked on the substrate for the structure, the photosensitive layers being aligned with one another by inserting the aligning pin into the aligning pinholes of all the photosensitive layers stacked on the substrate for the microstructure to penetrate all the photosensitive layers.

摘要翻译： 用于石版印刷，Galvanofomung和Abformung（LIGA）工艺的掩模，用于制造掩模的方法以及使用LIGA工艺制造微结构的方法。 使用LIGA方法制造微结构的方法考虑形成用于微结构的基底，多个感光层，每个感光层具有电镀孔和对准针孔，以及能够插入到对准针孔中的对准销， 感光层的对准针孔形成在相应的位置上，并且重复将用于微结构的基板上的感光层层叠的工艺和通过用金属镀覆层叠的感光层的电镀孔来形成镀层的工艺 对应于感光层的数量的次数，并且当感光层堆叠在用于结构的基板上时，感光层通过将对准销插入到所有感光层的对准针孔中而彼此对准 在基板上用于微结构穿透 感光层。

公开(公告)号：US20080166640A1

公开(公告)日：2008-07-10

申请号：US11896273

申请日：2007-08-30

申请人： Chan-wook Baik ,  Yong-wan Jin ,  Gun-sik Park ,  Jong-min Kim ,  Young-min Shin ,  Jin-kyu So

发明人： Chan-wook Baik ,  Yong-wan Jin ,  Gun-sik Park ,  Jong-min Kim ,  Young-min Shin ,  Jin-kyu So

IPC分类号： G03C5/00 ,  B05D5/06

CPC分类号： G03F7/00 ,  G03F1/22 ,  G03F9/7053 ,  G03F9/7076

摘要： A mask used for a Lithographie, Galvanofomung, and Abformung (LIGA) process, a method for manufacturing the mask, and a method for manufacturing a microstructure using a LIGA process. The method for manufacturing the microstructure using the LIGA process contemplates forming a substrate for the microstructure, a plurality of photosensitive layers, each photosensitive layer having a plating hole and an aligning pinhole, and an aligning pin capable of being inserted into the aligning pinhole, with the aligning pinholes of the photosensitive layers being formed in corresponding positions, and repeating a process of stacking the photosensitive layer on the substrate for the microstructure and a process of forming a plating layer by plating the plating hole of the stacked photosensitive layer with a metal for a number of times corresponding to the number of the photosensitive layers, and when the photosensitive layers are stacked on the substrate for the structure, the photosensitive layers being aligned with one another by inserting the aligning pin into the aligning pinholes of all the photosensitive layers stacked on the substrate for the microstructure to penetrate all the photosensitive layers.

摘要翻译： 用于石版印刷，Galvanofomung和Abformung（LIGA）工艺的掩模，用于制造掩模的方法以及使用LIGA工艺制造微结构的方法。 使用LIGA方法制造微结构的方法考虑形成用于微结构的基底，多个感光层，每个感光层具有电镀孔和对准针孔，以及能够插入到对准针孔中的对准销， 感光层的对准针孔形成在相应的位置上，并且重复将用于微结构的基板上的感光层层叠的工艺和通过用金属镀覆层叠的感光层的电镀孔来形成镀层的工艺 对应于感光层的数量的次数，并且当感光层堆叠在用于结构的基板上时，感光层通过将对准销插入到所有感光层的对准针孔中而彼此对准 在基板上用于微结构穿透 将感光层。