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公开(公告)号：US20080079448A1
公开(公告)日：2008-04-03
申请号：US11949325
申请日：2007-12-03
IPC分类号： G01R31/303
CPC分类号： G01R31/311
摘要： Methods and arrangements to enhance photon emissions responsive to a signal within an integrated circuit (IC) for observability of signal states utilizing, e.g., picosecond imaging circuit analysis (PICA), are disclosed. Embodiments attach a beacon to the signal of interest and apply a voltage across the beacon to enhance photon emissions responsive to the signal of interest. The voltage is greater than the operable circuit voltage, Vd, the enhance photon emissions with respect to intensity and energy. Thus, the photon emissions are more distinguishable from noise. In many embodiments, the beacon includes a transistor and, in several embodiments, the beacon includes an enablement device to enable and disable photon emissions from the beacon. Further, a PICA detector may capture photon emissions from the beacon and process the photons to generate time traces.
摘要翻译： 公开了利用例如皮秒成像电路分析（PICA）来增强响应于集成电路（IC）内的信号的信号状态的可观察性的光子发射的方法和装置。 实施例将信标连接到感兴趣的信号，并在信标之间施加电压以增强响应于感兴趣的信号的光子发射。 电压大于可操作电路电压Vd，相对于强度和能量增强光子发射。 因此，光子发射与噪声更为区别。 在许多实施例中，信标包括晶体管，并且在几个实施例中，信标包括启用和禁用来自信标的光子发射的启用装置。 此外，PICA检测器可以捕获来自信标的光子发射并处理光子以产生时间迹线。
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公开(公告)号：US20060028219A1
公开(公告)日：2006-02-09
申请号：US10912493
申请日：2004-08-05
CPC分类号： G01R31/311
摘要： Methods and arrangements to enhance photon emissions responsive to a signal within an integrated circuit (IC) for observability of signal states utilizing, e.g., picosecond imaging circuit analysis (PICA), are disclosed. Embodiments attach a beacon to the signal of interest and apply a voltage across the beacon to enhance photon emissions responsive to the signal of interest. The voltage is greater than the operable circuit voltage, Vdd, to enhance photon emissions with respect to intensity and energy. Thus, the photon emissions are more distinguishable from noise. In many embodiments, the beacon includes a transistor and, in several embodiments, the beacon includes an enablement device to enable and disable photon emissions from the beacon. Further, a PICA detector may capture photon emissions from the beacon and process the photons to generate time traces.
摘要翻译： 公开了利用例如皮秒成像电路分析（PICA）来增强响应于集成电路（IC）内的信号的信号状态的可观察性的光子发射的方法和装置。 实施例将信标连接到感兴趣的信号，并在信标之间施加电压以增强响应于感兴趣的信号的光子发射。 电压大于可操作电路电压Vdd，以增强相对于强度和能量的光子发射。 因此，光子发射与噪声更为区别。 在许多实施例中，信标包括晶体管，并且在几个实施例中，信标包括启用和禁用来自信标的光子发射的启用装置。 此外，PICA检测器可以捕获来自信标的光子发射并处理光子以产生时间迹线。
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3.发明申请Method and apparatus for diagnosing broken scan chain based on leakage light emission 失效基于泄漏光发射诊断断层扫描链的方法和装置公开(公告)号：US20050168228A1
公开(公告)日：2005-08-04
申请号：US10771218
申请日：2004-02-03
申请人： Peilin Song , Tian Xia , Alan Weger , Franco Stellari , Stanislav Polonsky
发明人： Peilin Song , Tian Xia , Alan Weger , Franco Stellari , Stanislav Polonsky
IPC分类号： G01R31/00 , G01R31/311 , G01R31/3185
CPC分类号： G01R31/318538 , G01R31/311
摘要： A mechanism for diagnosing broken scan chains based on leakage light emission is provided. An image capture mechanism detects light emission from leakage current in complementary metal oxide semiconductor (CMOS) devices. The diagnosis mechanism identifies devices with unexpected light emission. An unexpected amount of light emission may indicate that a transistor is turned off when it should be turned on or vice versa. All possible inputs may be tested to determine whether a problem exists with transistors in latches or with transistors in clock buffers. Broken points in the scan chain may then be determined based on the locations of unexpected light emission.
摘要翻译： 提供了一种基于泄漏光发射来诊断断层扫描链的机构。 图像捕获机构检测互补金属氧化物半导体（CMOS）器件中的泄漏电流的发光。 诊断机制识别具有意外发光的设备。 意外的发光量可能表明当它应该被打开时晶体管被关闭，反之亦然。 可以测试所有可能的输入以确定锁存器中的晶体管或时钟缓冲器中的晶体管是否存在问题。 然后可以基于意外光发射的位置来确定扫描链中的断点。
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4.发明申请Constructing Variability Maps by Correlating Off-State Leakage Emission Images to Layout Information 失效通过将非状态泄漏图像关联到布局信息来构建变异图公开(公告)号：US20100080445A1
公开(公告)日：2010-04-01
申请号：US12241926
申请日：2008-09-30
IPC分类号： G06K9/00
CPC分类号： G06T7/001 , G06T2207/30148
摘要： Improved techniques are disclosed for monitoring or sensing process variations in integrated circuit designs. Such techniques provide such improvements by constructing variability maps correlating leakage emission images to layout information. By way of example, a method for monitoring one or more manufacturing process variations associated with a device under test (e.g., integrated circuit) comprises the following steps. An emission image representing an energy emission associated with a leakage current of the device under test is obtained. The emission image is correlated with a layout of the device under test to form a cross emission image. Common structures on the cross emission image are selected and identified as regions of interest. One or more variability measures (e.g., figures of merit) are calculated based on the energy emissions associated with the regions of interest. A variability map is created based on the calculated variability measures, wherein the variability map is useable to monitor the one or more manufacturing process variations associated with the device under test.
摘要翻译： 公开了用于监测或感测集成电路设计中的工艺变化的改进的技术。 这样的技术通过构建将泄漏发射图像与布局信息相关联的可变性图来提供这样的改进。 作为示例，用于监测与被测器件（例如，集成电路）相关联的一个或多个制造工艺变化的方法包括以下步骤。 获得表示与被测设备的泄漏电流相关联的能量发射的发射图像。 发射图像与待测器件的布局相关，以形成交叉发射图像。 选择交叉发射图像上的共同结构并将其识别为感兴趣的区域。 基于与感兴趣区域相关联的能量排放来计算一个或多个可变性度量（例如，品质因素）。 基于所计算的变异性度量创建变异性图，其中可变性图可用于监测与被测设备相关联的一个或多个制造过程变化。
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公开(公告)号：US07355419B2
公开(公告)日：2008-04-08
申请号：US10912493
申请日：2004-08-05
IPC分类号： G01R31/302
CPC分类号： G01R31/311
摘要： Methods and arrangements to enhance photon emissions responsive to a signal within an integrated circuit (IC) for observability of signal states utilizing, e.g., picosecond imaging circuit analysis (PICA), are disclosed. Embodiments attach a beacon to the signal of interest and apply a voltage across the beacon to enhance photon emissions responsive to the signal of interest. The voltage is greater than the operable circuit voltage, Vdd, to enhance photon emissions with respect to intensity and energy. Thus, the photon emissions are more distinguishable from noise. In many embodiments, the beacon includes a transistor and, in several embodiments, the beacon includes an enablement device to enable and disable photon emissions from the beacon. Further, a PICA detector may capture photon emissions from the beacon and process the photons to generate time traces.
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6.发明授权Constructing variability maps by correlating off-state leakage emission images to layout information 失效通过将非状态泄漏图像与布局信息相关联来构建变异性图公开(公告)号：US08131056B2
公开(公告)日：2012-03-06
申请号：US12241926
申请日：2008-09-30
IPC分类号： G06K9/00
CPC分类号： G06T7/001 , G06T2207/30148
摘要： Improved techniques are disclosed for monitoring or sensing process variations in integrated circuit designs. Such techniques provide such improvements by constructing variability maps correlating leakage emission images to layout information. By way of example, a method for monitoring one or more manufacturing process variations associated with a device under test (e.g., integrated circuit) comprises the following steps. An emission image representing an energy emission associated with a leakage current of the device under test is obtained. The emission image is correlated with a layout of the device under test to form a cross emission image. Common structures on the cross emission image are selected and identified as regions of interest. One or more variability measures (e.g., figures of merit) are calculated based on the energy emissions associated with the regions of interest. A variability map is created based on the calculated variability measures, wherein the variability map is useable to monitor the one or more manufacturing process variations associated with the device under test.
摘要翻译： 公开了用于监测或感测集成电路设计中的工艺变化的改进的技术。 这样的技术通过构建将泄漏发射图像与布局信息相关联的可变性图来提供这样的改进。 作为示例，用于监测与被测器件（例如，集成电路）相关联的一个或多个制造工艺变化的方法包括以下步骤。 获得表示与被测设备的泄漏电流相关联的能量发射的发射图像。 发射图像与待测器件的布局相关，以形成交叉发射图像。 选择交叉发射图像上的共同结构并将其识别为感兴趣的区域。 基于与感兴趣区域相关联的能量排放来计算一个或多个可变性度量（例如，品质因素）。 基于所计算的变异性度量创建变异性图，其中可变性图可用于监测与被测设备相关联的一个或多个制造过程变化。
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公开(公告)号：US07446550B2
公开(公告)日：2008-11-04
申请号：US11949325
申请日：2007-12-03
IPC分类号： G01R31/02
CPC分类号： G01R31/311
摘要： Methods and arrangements to enhance photon emissions responsive to a signal within an integrated circuit (IC) for observability of signal states utilizing, e.g., picosecond imaging circuit analysis (PICA), are disclosed. Embodiments attach a beacon to the signal of interest and apply a voltage across the beacon to enhance photon emissions responsive to the signal of interest. The voltage is greater than the operable circuit voltage, Vdd, to enhance photon emissions with respect to intensity and energy. Thus, the photon emissions are more distinguishable from noise. In many embodiments, the beacon includes a transistor and, in several embodiments, the beacon includes an enablement device to enable and disable photon emissions from the beacon. Further, a PICA detector may capture photon emissions from the beacon and process the photons to generate time traces.
摘要翻译： 公开了利用例如皮秒成像电路分析（PICA）来增强响应于集成电路（IC）内的信号的信号状态的可观察性的光子发射的方法和装置。 实施例将信标连接到感兴趣的信号，并在信标之间施加电压以增强响应于感兴趣的信号的光子发射。 电压大于可操作电路电压Vdd，以增强相对于强度和能量的光子发射。 因此，光子发射与噪声更为区别。 在许多实施例中，信标包括晶体管，并且在几个实施例中，信标包括启用和禁用来自信标的光子发射的启用装置。 此外，PICA检测器可以捕获来自信标的光子发射并处理光子以产生时间迹线。
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8.发明授权公开(公告)号：US08193009B2
公开(公告)日：2012-06-05
申请号：US12534592
申请日：2009-08-03
申请人： Alberto Tosi , Franco Stellari , Peilin Song
发明人： Alberto Tosi , Franco Stellari , Peilin Song
IPC分类号： H01L21/66
CPC分类号： G01R31/311 , G01R1/0408 , H01L25/16 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2924/00011 , H01L2924/00014 , H01L2924/3011 , H01L2224/0401
摘要： Apparatus and methods are provided for packaging IC (integrated circuit) chips to enable both optical access to the back side of an IC chip and electrical access to the front side of the IC chip.
摘要翻译： 提供了用于封装IC（集成电路）芯片的装置和方法，以使得能够对IC芯片的背侧进行光学接入和对IC芯片的前侧的电接入。
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9.发明申请公开(公告)号：US20090286353A1
公开(公告)日：2009-11-19
申请号：US12534592
申请日：2009-08-03
申请人： Alberto Tosi , Franco Stellari , Peilin Song
发明人： Alberto Tosi , Franco Stellari , Peilin Song
IPC分类号： H01L21/52
CPC分类号： G01R31/311 , G01R1/0408 , H01L25/16 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2924/00011 , H01L2924/00014 , H01L2924/3011 , H01L2224/0401
摘要： Apparatus and methods are provided for packaging IC (integrated circuit) chips to enable both optical access to the back side of an IC chip and electrical access to the front side of the IC chip.
摘要翻译： 提供了用于封装IC（集成电路）芯片的装置和方法，以使得能够对IC芯片的背侧进行光学接入和对IC芯片的前侧的电接入。
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公开(公告)号：US20060220664A1
公开(公告)日：2006-10-05
申请号：US11098850
申请日：2005-04-05
申请人： Franco Stellari , Peilin Song
发明人： Franco Stellari , Peilin Song
IPC分类号： G01R31/302
CPC分类号： G01R31/31709 , G01R31/311
摘要： Optical triggering system and method for synchronizing a test of an integrated circuit chip with its operation. An optical triggering system includes a testing mechanism, such as a PICA testing mechanism, for testing an integrated circuit chip. An optical trigger mechanism generates an optical trigger signal for synchronizing a test of the integrated circuit chip with its operation. The optical trigger mechanism provides an optical trigger signal having reduced jitter and a higher frequency rate than an electrical trigger signal resulting in a more accurate test of the integrated circuit chip.
摘要翻译： 用于使集成电路芯片的测试与其操作同步的光触发系统和方法。 光触发系统包括用于测试集成电路芯片的诸如PICA测试机构的测试机构。 光学触发机构产生用于使集成电路芯片的测试与其操作同步的光学触发信号。 光学触发机构提供具有比电触发信号更少的抖动和更高频率的光学触发信号，导致集成电路芯片的更准确的测试。
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