QUALITY CONTROL OF THE FRIT FOR OLED SEALING
    1.
    发明申请
    QUALITY CONTROL OF THE FRIT FOR OLED SEALING 审中-公开
    OLED密封件的质量控制

    公开(公告)号:US20100118912A1

    公开(公告)日:2010-05-13

    申请号:US12267737

    申请日:2008-11-10

    IPC分类号: G01N25/18

    CPC分类号: G01N25/72 H01L51/5246

    摘要: A method of finding defects in sealing material formed as a frame line on a glass plate includes irradiating the frame line of sealing material. A temperature of the irradiated sealing material is measured and a change of the temperature caused by a nonuniformity in sealing material is detected. Another aspect features a method of hermetically sealing a thin film device between glass plates. Sealing material is dispensed on a cover glass plate in the form of a frame line cell. The sealing material is pre-sintered onto the cover glass plate and cooled. A laser beam is moved around the frame line on the sealing material. A temperature of the sealing material contacted with the laser beam is measured. A change in the temperature (ΔT) caused by a nonuniformity in the sealing material is measured. Further aspects include a feedback process, infrared imaging and use of delta temperature data to increase sensitivity of temperature measurement data.

    摘要翻译: 在玻璃板上形成为框线的密封材料中发现缺陷的方法包括照射密封材料的框线。 测量照射的密封材料的温度,并检测由密封材料不均匀引起的温度变化。 另一方面的特征在于在玻璃板之间气密密封薄膜装置的方法。 密封材料以框线形电池的形式分配在盖玻璃板上。 将密封材料预先烧结到盖玻璃板上并冷却。 激光束围绕密封材料上的框架线移动。 测量与激光束接触的密封材料的温度。 测量由密封材料不均匀引起的温度变化(&Dgr; T)。 其他方面包括反馈过程,红外成像和使用增量温度数据以增加温度测量数据的灵敏度。

    Glass packages and methods of controlling laser beam characteristics for sealing them
    2.
    发明申请
    Glass packages and methods of controlling laser beam characteristics for sealing them 审中-公开
    玻璃包装和控制激光束特性的方法进行密封

    公开(公告)号:US20090295277A1

    公开(公告)日:2009-12-03

    申请号:US12154878

    申请日:2008-05-28

    IPC分类号: H01J9/26 H01J1/62 H01T21/06

    摘要: A display device (10) including a first substrate (12), a second substrate (16), an OLED element (18), and a wall (14) that contains glass. A sealed portion (6) is formed in the wall and between the first substrate and the second substrate so as to produce a hermetic seal. The sealed portion is disposed in the wall so that unsealed portions (7,8) are disposed on opposite sides of the sealed portion. A width (3) of the sealed portion is from about 35% to about 77.3% of a width (2) of the wall. The sealed portion may be formed by heating the wall with a laser beam (32) so that a thickness (1) of the wall lies within the depth of focus (34) of the laser beam. Further, the width (36) of the laser beam can be less than or equal to the width of the wall.

    摘要翻译: 一种显示装置(10),包括第一基板(12),第二基板(16),OLED元件(18)和包含玻璃的壁(14)。 密封部分(6)形成在壁中并且在第一基板和第二基板之间,以产生气密密封。 密封部分设置在壁中,使得未密封部分(7,8)设置在密封部分的相对侧上。 密封部分的宽度(3)为壁宽度(2)的约35%至约77.3%。 密封部分可以通过用激光束(32)加热壁来形成,使得壁的厚度(1)位于激光束的焦深(34)内。 此外,激光束的宽度(36)可以小于或等于壁的宽度。

    Methods and apparatus for packaging electronic components

    公开(公告)号:US08552642B2

    公开(公告)日:2013-10-08

    申请号:US12884335

    申请日:2010-09-17

    IPC分类号: H01J1/62 H01J63/04

    CPC分类号: H01L51/5246

    摘要: Packages for elements, e.g., OLEDs, that are temperature sensitive are provided. The packages have a first glass substrate (12), a second glass substrate (16), and a wall (14) that separates the first and second substrates (12,16) and hermetically seals at least one temperature sensitive element (18,28,36) between the substrates (12,16). The wall (14) comprises a sintered frit and at least a portion of the wall is laser sealed to the second substrate (16) by melting a glass component of the sintered frit. The minimum width (40) of the laser-sealed portion of the wall (14) at any location along the wall (14) is greater than or equal to 2 millimeters so as to provide greater hermeticity and strength to the package. The laser sealing is performed without substantially degrading the temperature sensitive element(s) (18,28,36) housed in the package.

    METHODS AND APPARATUS FOR PACKAGING ELECTRONIC COMPONENTS
    4.
    发明申请
    METHODS AND APPARATUS FOR PACKAGING ELECTRONIC COMPONENTS 有权
    包装电子元件的方法和装置

    公开(公告)号:US20110037383A1

    公开(公告)日:2011-02-17

    申请号:US12884335

    申请日:2010-09-17

    IPC分类号: H01J1/62

    CPC分类号: H01L51/5246

    摘要: Packages for elements, e.g., OLEDs, that are temperature sensitive are provided. The packages have a first glass substrate (12), a second glass substrate (16), and a wall (14) that separates the first and second substrates (12,16) and hermetically seals at least one temperature sensitive element (18,28,36) between the substrates (12,16). The wall (14) comprises a sintered frit and at least a portion of the wall is laser sealed to the second substrate (16) by melting a glass component of the sintered frit. The minimum width (40) of the laser-sealed portion of the wall (14) at any location along the wall (14) is greater than or equal to 2 millimeters so as to provide greater hermeticity and strength to the package. The laser sealing is performed without substantially degrading the temperature sensitive element(s) (18,28,36) housed in the package.

    摘要翻译: 提供了对温度敏感的元件(例如OLED)的包装。 包装件具有第一玻璃基板(12),第二玻璃基板(16)和分隔第一和第二基板(12,16)并将气密密封至少一个温度敏感元件(18,28)的壁(14) ,36)之间。 所述壁(14)包括烧结的玻璃料,并且所述壁的至少一部分通过熔化所述烧结玻璃料的玻璃组分而激光密封到所述第二基板(16)。 在壁(14)的任何位置处的壁(14)的激光密封部分的最小宽度(40)大于或等于2毫米,以便为包装提供更大的气密性和强度。 执行激光密封而基本上不降低容纳在包装中的温度敏感元件(18,28,36)。

    Methods and apparatus for packaging electronic components
    5.
    发明授权
    Methods and apparatus for packaging electronic components 有权
    电子元件包装方法和装置

    公开(公告)号:US07815480B2

    公开(公告)日:2010-10-19

    申请号:US11998600

    申请日:2007-11-30

    IPC分类号: H01J9/26 H01J9/32

    CPC分类号: H01L51/5246

    摘要: Packages for elements, e.g., OLEDs, that are temperature sensitive are provided. The packages have a first glass substrate (12), a second glass substrate (16), and a wall (14) that separates the first and second substrates (12,16) and hermetically seals at least one temperature sensitive element (18,28,36) between the substrates (12,16). The wall (14) comprises a sintered frit and at least a portion of the wall is laser sealed to the second substrate (16) by melting a glass component of the sintered frit. The minimum width (40) of the laser-sealed portion of the wall (14) at any location along the wall (14) is greater than or equal to 2 millimeters so as to provide greater hermeticity and strength to the package. The laser sealing is performed without substantially degrading the temperature sensitive element(s) (18,28,36) housed in the package.

    摘要翻译: 提供了对温度敏感的元件(例如OLED)的包装。 包装件具有第一玻璃基板(12),第二玻璃基板(16)和分隔第一和第二基板(12,16)并将气密密封至少一个温度敏感元件(18,28)的壁(14) ,36)之间。 所述壁(14)包括烧结的玻璃料,并且所述壁的至少一部分通过熔化所述烧结玻璃料的玻璃组分而激光密封到所述第二基板(16)。 在壁(14)的任何位置处的壁(14)的激光密封部分的最小宽度(40)大于或等于2毫米,以便为包装提供更大的气密性和强度。 执行激光密封而基本上不降低容纳在包装中的温度敏感元件(18,28,36)。

    Methods and apparatus for packaging electronic components
    6.
    发明申请
    Methods and apparatus for packaging electronic components 有权
    电子元件包装方法和装置

    公开(公告)号:US20090142984A1

    公开(公告)日:2009-06-04

    申请号:US11998600

    申请日:2007-11-30

    CPC分类号: H01L51/5246

    摘要: Packages for elements, e.g., OLEDs, that are temperature sensitive are provided. The packages have a first glass substrate (12), a second glass substrate (16), and a wall (14) that separates the first and second substrates (12,16) and hermetically seals at least one temperature sensitive element (18,28,36) between the substrates (12,16). The wall (14) comprises a sintered frit and at least a portion of the wall is laser sealed to the second substrate (16) by melting a glass component of the sintered frit. The minimum width (40) of the laser-sealed portion of the wall (14) at any location along the wall (14) is greater than or equal to 2 millimeters so as to provide greater hermeticity and strength to the package. The laser sealing is performed without substantially degrading the temperature sensitive element(s) (18,28,36) housed in the package.

    摘要翻译: 提供了对温度敏感的元件(例如OLED)的包装。 包装件具有第一玻璃基板(12),第二玻璃基板(16)和分隔第一和第二基板(12,16)并将气密密封至少一个温度敏感元件(18,28)的壁(14) ,36)之间。 所述壁(14)包括烧结的玻璃料,并且所述壁的至少一部分通过熔化所述烧结玻璃料的玻璃组分而激光密封到所述第二基板(16)。 在壁(14)的任何位置处的壁(14)的激光密封部分的最小宽度(40)大于或等于2毫米,以便为包装提供更大的气密性和强度。 执行激光密封而基本上不降低容纳在包装中的温度敏感元件(18,28,36)。

    Systems and methods for coupling light into a transparent sheet
    10.
    发明授权
    Systems and methods for coupling light into a transparent sheet 有权
    将光耦合到透明片中的系统和方法

    公开(公告)号:US08787717B2

    公开(公告)日:2014-07-22

    申请号:US13094221

    申请日:2011-04-26

    摘要: Systems and methods for coupling light into a transparent sheet. The systems include a light source and a light-diffusing optical fiber optically coupled to the light source. The light-diffusing optical fiber has a core, a cladding and a length, with at least a portion of the core comprising randomly arranged voids configured to provide substantially continuous light emission from the core and out of the cladding along at least a portion of the length, and into the transparent sheet.

    摘要翻译: 将光耦合到透明片中的系统和方法。 该系统包括与光源光学耦合的光源和光漫射光纤。 光扩散光纤具有芯,包层和长度,其中芯的至少一部分包括随机排列的空隙,其被配置为提供基本上连续的从芯的发射并沿着至少一部分 长度,并进入透明片。