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    Packaged MEMS device assembly
    1.
    发明授权
    Packaged MEMS device assembly 失效
    封装的MEMS器件组件

    公开(公告)号：US07723811B2

    公开(公告)日：2010-05-25

    申请号：US11416709

    申请日：2006-05-03

    申请人： Charles C Haluzak ,  Jeffrey R Pollard ,  Kirby Sand ,  John R Sterner ,  Henry Kang ,  Chien-Hua Chen ,  James Denning Smith

    发明人： Charles C Haluzak ,  Jeffrey R Pollard ,  Kirby Sand ,  John R Sterner ,  Henry Kang ,  Chien-Hua Chen ,  James Denning Smith

    IPC分类号： H01L29/82

    CPC分类号： B81C3/001 ,  H01L21/67092 ,  H01L25/0657 ,  H01L25/50 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A packaged micro-electromechanical systems (MEMS) device assembly includes a MEMS device, a substrate within which the MEMS device is disposed, and a lid disposed over the substrate. The assembly may include one or more first cavities within the lid having a predetermined volume satisfying packaging specifications for the packaged MEMS device assembly. The assembly may include one or more second cavities within the lid and one or more corresponding overflow areas within the lid, where each second cavity contains a material and each corresponding overflow area is adapted to catch overflow of the material. The assembly may include one or more third cavities within the lid and one or more channels within one of the substrate and the lid to fluidically connect the MEMS device to the third cavities.

    摘要翻译： 封装的微机电系统（MEMS）设备组件包括MEMS器件，其中设置MEMS器件的衬底以及设置在衬底上的盖子。 组件可以包括盖内的一个或多个第一空腔，其具有满足封装的MEMS装置组件的包装规格的预定体积。 组件可以包括盖内的一个或多个第二空腔和盖内的一个或多个对应的溢流区域，其中每个第二空腔包含材料，并且每个相应的溢流区域适于捕获材料的溢流。 组件可以包括盖内的一个或多个第三空腔和衬底和盖子之一内的一个或多个通道，以将MEMS器件流体连接到第三腔。

    Microelectronic device
    3.
    发明授权
    Microelectronic device 有权
    微电子器件

    公开(公告)号：US08043880B2

    公开(公告)日：2011-10-25

    申请号：US11192701

    申请日：2005-07-28

    申请人： Charles C Haluzak ,  John R Sterner ,  Kirby Sand

    发明人： Charles C Haluzak ,  John R Sterner ,  Kirby Sand

    IPC分类号： H01L21/00

    CPC分类号： B81C1/00285

    摘要： One embodiment of a microelectronic component system includes a base adapted for supporting a microelectronic component, a membrane sealed to the base, and a glass lid built-up on the membrane and hermetically sealing the membrane.

    摘要翻译： 微电子部件系统的一个实施例包括适于支撑微电子部件的基座，密封到基座的膜和积聚在膜上的玻璃盖，并且密封膜。

    Microfluidic device and a fluid ejection device incorporating the same
    4.
    发明授权
    Microfluidic device and a fluid ejection device incorporating the same 有权
    微流体装置和包含该微流体装置的流体喷射装置

    公开(公告)号：US08007078B2

    公开(公告)日：2011-08-30

    申请号：US12896980

    申请日：2010-10-04

    申请人： Charles C Haluzak ,  Chien-Hua Chen ,  Kirby Sand

    发明人： Charles C Haluzak ,  Chien-Hua Chen ,  Kirby Sand

    IPC分类号： B41J2/05

    CPC分类号： B41J2/16 ,  B41J2/1623 ,  B41J2/1628 ,  B41J2/1632 ,  B41J2/1637

    摘要： A microfluidic device includes first and second substrates bonded together. The first substrate has first and second opposed surfaces. A die pocket is formed in the first opposed surface, and a through slot extends from the die pocket to the second opposed surface. The second substrate is bonded to the second opposed surface of the first substrate whereby an outlet of a channel formed in the second substrate substantially aligns with the through slot. The channel of the second substrate has an inlet that is larger than the outlet.

    摘要翻译： 微流体装置包括粘合在一起的第一和第二基底。 第一基板具有第一和第二相对表面。 模具袋形成在第一相对表面中，并且通孔从模腔延伸到第二相对表面。 第二基板结合到第一基板的第二相对表面，由此形成在第二基板中的通道的出口基本上与通孔对准。 第二基板的通道具有比出口大的入口。

    Method of forming a device package having edge interconnect pad
    7.
    发明授权
    Method of forming a device package having edge interconnect pad 失效
    形成具有边缘互连焊盘的器件封装的方法

    公开(公告)号：US07541209B2

    公开(公告)日：2009-06-02

    申请号：US11251412

    申请日：2005-10-14

    申请人： Charles C Haluzak ,  Chien-Hua Chen ,  David M Craig

    发明人： Charles C Haluzak ,  Chien-Hua Chen ,  David M Craig

    IPC分类号： H01L21/00

    CPC分类号： B81C1/00301 ,  B81B2207/092 ,  H05K3/3442 ,  H05K2201/10454 ,  H05K2201/1053 ,  Y02P70/613

    摘要： A method of forming a device package having an edge interconnect pad includes forming an array of MEMS devices overlaying at least one conductive via that electrically connects to an underlying layer. The method continues with depositing, by way of a damascene process, a conductive material on a substrate that is coplanar with the array of MEMS devices, the conductive material coupling to the at least one conductive via. The method also includes covering the array of MEMS devices and the conductive material with a passivation layer.

    摘要翻译： 形成具有边缘互连焊盘的器件封装的方法包括形成覆盖至少一个电连接到下层的导电通孔的MEMS器件的阵列。 该方法继续通过镶嵌工艺沉积与MEMS器件阵列共面的衬底上的导电材料，该导电材料耦合到至少一个导电通孔。 该方法还包括用钝化层覆盖MEMS器件阵列和导电材料。