公开(公告)号：US20060229481A1

公开(公告)日：2006-10-12

申请号：US11104315

申请日：2005-04-12

申请人： Charles Yarbrough ,  Vijay Swarup ,  Patrick Maher ,  Albert Hu ,  Michael Bedell

发明人： Charles Yarbrough ,  Vijay Swarup ,  Patrick Maher ,  Albert Hu ,  Michael Bedell

IPC分类号： C07C1/207

CPC分类号： C07C1/24 ,  C07C1/213 ,  C10G3/40 ,  C10G3/49 ,  C10G3/57 ,  C10G3/62 ,  C10G2300/1037 ,  C10G2300/202 ,  C10G2300/4093 ,  C10G2400/20 ,  C10G2400/28

摘要： This invention relates to a method of making an olefin from a dialkyl ether comprising (a) introducing an ether having a formula CxH2x+1CyH2y+1 into a thermal or catalytic cracking unit processing a hydrocarbon feedstock; and (b) decomposing at least a portion of the ether to form an olefin having a formula CxH2x and/or CyH2y and an alcohol having a formula CxH2x+1 and/or CyH2y+1OH, wherein x and y independently range from about 1 to about 30. This invention also relates to a method of reducing coking in a thermal or catalytic cracking unit comprising (a) introducing an ether, having a formula CxH2x+1OCyH2y+1, into the cracking unit processing a hydrocarbon feedstock in an amount effective to reduce coke formation relative to processing the hydrocarbon feedstock in the absence of the ether, wherein x and y independently range from about 1 to about 30.

摘要翻译： 本发明涉及一种由二烷基醚制备烯烃的方法，该方法包括：（a）引入具有式C x 2 H 2 x + 1 C y的醚， / 2＆gt; 2y + 1＆lt; / 2＆gt;到处理烃原料的热或催化裂化装置; 和（b）分解至少一部分醚以形成具有式C x H 2 H 2和/或C y H的烯烃 2y和具有式C x H 2 x + 1和/或C y y H的醇， 2y + 1H OH，其中x和y独立地在约1至约30的范围内。本发明还涉及在热或催化裂化单元中还原焦化的方法，其包括（a）引入具有式 C x 2 x + 1 O 2 H 2 y + 1 N，进入裂化装置中处理烃原料 相对于在不存在醚的情况下相对于处理烃原料而有效降低焦炭形成的量，其中x和y独立地为约1至约30。

公开(公告)号：US6146249A

公开(公告)日：2000-11-14

申请号：US177089

申请日：1998-10-22

申请人： Albert Hu ,  Burford J. Furman ,  Mohamed Abushaban

发明人： Albert Hu ,  Burford J. Furman ,  Mohamed Abushaban

IPC分类号： B24B21/06 ,  B24B21/12 ,  B24B37/04 ,  G11B5/84 ,  B24B1/00

CPC分类号： B24B21/12 ,  B24B21/06 ,  B24B37/04 ,  G11B5/84 ,  G11B5/8404

摘要： The present invention relates to an apparatus and method of Chemical Mechanical Planarization ("CMP") for wafer, flat panel display (FPD), and hard drive disk (HDD). The preferred apparatus comprises a looped belt spatially oriented in a vertical direction with respect to a ground floor. A polishing pad is glued to an outer surface of the belt. At an inner surface of the belt, there are a plurality of wafer supports to support the wafers while they are in polishing process. Wafers are loaded from a wafer station to a wafer head using a handling structure before polishing and are unloaded from the wafer head to the wafer station after polishing. An electric motor or equivalent is used to drive the looped belt running over two pulleys. An adjustment means is used to adjust the tension and position of the belt for smooth running. This new CMP machine can be mounted in multiple orientations to save manufacturing space.

公开(公告)号：US5957764A

公开(公告)日：1999-09-28

申请号：US964930

申请日：1997-11-05

申请人： H. Alexander Anderson ,  Linh X. Can ,  Tsungnan Cheng ,  Garry K. Kwong ,  Albert Hu ,  David Chen ,  Shu-Wong S. Lee

发明人： H. Alexander Anderson ,  Linh X. Can ,  Tsungnan Cheng ,  Garry K. Kwong ,  Albert Hu ,  David Chen ,  Shu-Wong S. Lee

IPC分类号： B24B21/04 ,  B24B37/04 ,  B24B5/00 ,  B24B29/00

CPC分类号： B24B21/04 ,  B24B37/04

摘要： A wafer polishing apparatus includes a module frame; a continuous belt rotatable with respect to the frame, the belt having at least one vertically-oriented belt transverse portion including a polishing pad assembly; and at least one pivotable wafer-holding head drive within the frame and having a distal end portion movable to a vertical first position parallel and juxtaposed to the belt transverse portion. The head drive includes a wafer carrier for holding a wafer on the distal end portion of the head drive, while a drive moves the distal end portion and a held wafer into a vertical polishing position abutting the belt transverse portion and pressure is applied to the held-wafer against the polishing pad assembly while the wafer-holding distal end portion is rotated and swept side-by-side. After polishing the drive is reversed and the head drive is pivoted away from the belt transverse portion to a horizontal or other orientation and the then polished wafer removed. Multiple modules may be placed end-to-end or side-by-side with a robot pathway therebetween to load unpolished wafers and to unload polished wafers to a buffing station, to a cassette or other processing station.

摘要翻译： 晶片抛光装置包括模块框架; 相对于框架可旋转的连续带，所述带具有包括抛光垫组件的至少一个垂直定向的带横向部分; 以及在所述框架内的至少一个可枢转的晶片保持头驱动器，并且具有可移动到平行并并列到所述带横向部分的垂直第一位置的远端部分。 头驱动器包括用于将晶片保持在头驱动器的远端部分的晶片载体，同时驱动器将远端部分和保持的晶片移动到邻近带横向部分的垂直抛光位置，并且压力施加到保持的 - 在晶片保持前端部分旋转并且并排扫掠的同时，抵靠抛光垫组件。 在抛光之后，驱动器被反转并且头驱动器从带横向部分转动到水平或其它方向，并且然后抛光晶片。 多个模块可以端对端或并排地放置在其间的机器人通路以加载未抛光的晶片并将抛光的晶片卸载到抛光台，到盒或其它处理站。

公开(公告)号：US5999799A

公开(公告)日：1999-12-07

申请号：US638620

申请日：1996-04-26

申请人： Albert Hu ,  Shen-Yang Chen

发明人： Albert Hu ,  Shen-Yang Chen

IPC分类号： G08B13/14 ,  G08B21/24 ,  G08C17/00 ,  H04B1/16 ,  H04B17/00

CPC分类号： G08C17/00 ,  G08B13/1427 ,  G08B21/0216 ,  G08B21/24 ,  H04B17/18 ,  H04B17/23 ,  H04B1/1615

摘要： A method and apparatus for preventing the loss of a remote control input device used with a stationary device provides the stationary device with a transmitter and a signal generator that generates signals transmitted by the transmitter. The remote control input device communicates wirelessly with the stationary device, and has a wireless signal receiver that receives the signals from the signal generator, and a distance warning circuit. A distance warning output signal is produced by the distance warning circuit when the input device is beyond a specified distance from the stationary device, as a function of the signals received by the wireless signal receiver. The remote control input device also has an indicator that produces a human-perceptible distance warning signal in response to the production of the distance warning output signal by the distance warning circuit. This alerts a person carrying the remote control input device beyond a specified distance from the stationary device that the remote control input device is being moved out of range of the stationary device, and thereby helps to prevent the permanent loss of the remote control input device.

摘要翻译： 用于防止与固定设备一起使用的遥控输入设备的丢失的方法和装置为固定设备提供发射机和信号发生器，该信号发生器产生由发射机发送的信号。 遥控输入装置与固定装置进行无线通信，并具有从信号发生器接收信号的无线信号接收机和距离警告电路。 根据由无线信号接收机接收到的信号，距离警告电路产生远距离警告输出信号，当输入设备超出与固定设备相距规定距离时。 远程控制输入装置还具有响应于由距离警告电路产生距离警告输出信号而产生人感知距离警告信号的指示器。 这样，远程控制输入装置移动超出固定装置的范围的距离远离固定装置超过指定距离的人员，从而有助于防止遥控输入装置的永久性损失。

公开(公告)号：US6059643A

公开(公告)日：2000-05-09

申请号：US803623

申请日：1997-02-21

申请人： Albert Hu ,  Burford J. Furman ,  Mohamed Abushaban

发明人： Albert Hu ,  Burford J. Furman ,  Mohamed Abushaban

IPC分类号： B24B21/06 ,  B24B21/12 ,  B24B37/04 ,  G11B5/84 ,  B24B21/04

CPC分类号： B24B21/12 ,  B24B21/06 ,  B24B37/04 ,  G11B5/84 ,  G11B5/8404

摘要： The present invention relates to an apparatus and method of Chemical Mechanical Planarization ("CMP") for wafer, flat panel display (FPD), and hard drive disk (HDD). The preferred apparatus comprises a looped belt spatially oriented in a vertical direction with respect to a ground floor. A polishing pad is glued to an outer surface of the belt. At an inner surface of the belt, there are a plurality of wafer supports to support the wafers while they are in polishing process. Wafers are loaded from a wafer station to a wafer head using a handling structure before polishing and are unloaded from the wafer head to the wafer station after polishing. An electric motor or equivalent is used to drive the looped belt running over two pulleys. An adjustment means is used to adjust the tension and position of the belt for smooth running. This new CMP machine can be mounted in multiple orientations to save manufacturing space.

摘要翻译： 本发明涉及一种用于晶片，平板显示器（FPD）和硬盘驱动盘（HDD）的化学机械平面化（“CMP”）的设备和方法。 优选的装置包括相对于底层在垂直方向上空间取向的环状带。 抛光垫胶合到带的外表面。 在带的内表面上，存在多个晶片支撑件，以在抛光过程中支撑晶片。 在抛光之前，使用处理结构将晶片从晶圆台装载到晶片头，并且在抛光之后从晶片头卸载到晶片台。 使用电动机或等效物来驱动环形带运行在两个滑轮上。 调节装置用于调节皮带的张力和位置，以使其平稳运行。 这种新的CMP机器可以安装在多个方向，以节省制造空间。