Diluent free epoxy resin formulation
    1.
    发明申请
    Diluent free epoxy resin formulation 审中-公开
    稀释剂自由环氧树脂配方

    公开(公告)号:US20080051549A1

    公开(公告)日:2008-02-28

    申请号:US11826942

    申请日:2007-07-19

    摘要: An epoxy resin formulation is disclosed. Such a formulation is suitable for the use as coil insulation material, wherein the formulation includes (a) a purified grade of at least one diglycidyl ether of a bisphenol compound or at least one cycloaliphatic diglycidyl ether compound or a mixture of such compounds, wherein the compounds have an epoxy equivalent weight not exceeding 10% of the minimum epoxy equivalent weight calculated for each compound; and (b) the formation optionally includes up to 50% by weight of a diglycidyl ether of a bisphenol compound or of a cycloaliphatic diglycidyl ether compound or a novolac epoxy or a mixture of such compounds, wherein the compounds have an epoxy equivalent weight exceeding 10% of the minimum epoxy equivalent weight calculated for each compound; and (c) a polymerization catalyst.

    摘要翻译: 公开了一种环氧树脂配方。 这种制剂适合用作线圈绝缘材料,其中制剂包括(a)纯化级别的双酚化合物的至少一种二缩水甘油醚或至少一种脂环族二缩水甘油醚化合物或这些化合物的混合物,其中 化合物的环氧当量不得超过为每种化合物计算的最小环氧当量的10%; 和(b)所述形成物任选地包含至多50重量%的双酚化合物或脂环族二缩水甘油醚化合物或酚醛清漆环氧树脂的二缩水甘油醚或这些化合物的混合物,其中所述化合物的环氧当量超过10 为每种化合物计算的最小环氧当量的%; 和(c)聚合催化剂。