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    ASSEMBLY FOR MOUNTING ELECTRONIC COMPONENTS, METHODS OF USE AND MANUFACTURE THEREOF
    1.
    发明申请
    ASSEMBLY FOR MOUNTING ELECTRONIC COMPONENTS, METHODS OF USE AND MANUFACTURE THEREOF 有权
    组装电子元件安装方法及其使用及其制造方法

    公开(公告)号：US20080025813A1

    公开(公告)日：2008-01-31

    申请号：US11828467

    申请日：2007-07-26

    申请人： Chi Wu ,  Liu Lei ,  Thomas Socci ,  Douglas Nobbs ,  George Watchko

    发明人： Chi Wu ,  Liu Lei ,  Thomas Socci ,  Douglas Nobbs ,  George Watchko

    IPC分类号： F16B21/18

    CPC分类号： H05K7/1407

    摘要： An assembly for mounting electronic components includes a face plate comprising a thermoplastic material. The face plate includes a retaining element for securing a captive screw and spring assembly for mounting an electronic printed circuit board. The retaining element includes one or more slots adapted to expand the element to permit insertion of the screw and deformation of the hole upon insertion of the screw, while locking the screw to retain the screw in place. This arrangement permits the elimination of the metal standoff frequently used in similar devices. Methods for preparing the assembly and mounting the printed circuit boards are also described.

    摘要翻译： 用于安装电子部件的组件包括包含热塑性材料的面板。 面板包括用于固定用于安装电子印刷电路板的固定螺钉和弹簧组件的保持元件。 保持元件包括适于膨胀元件以允许螺钉插入和插入螺钉时孔的变形的一个或多个槽，同时锁定螺钉以将螺钉保持在适当位置。 这种布置允许消除在类似装置中经常使用的金属支架。 还描述了制备组装和​​安装印刷电路板的方法。

    Board level shielding module
    2.
    发明申请
    Board level shielding module 有权
    板级屏蔽模块

    公开(公告)号：US20060260839A1

    公开(公告)日：2006-11-23

    申请号：US11404704

    申请日：2006-04-14

    申请人： Eric Krohto ,  Lawrence Denefrio ,  Peter Jones ,  John Ariel ,  Matthew Gagnon ,  Douglas Nobbs ,  George Watchko ,  Marc LaRosse

    发明人： Eric Krohto ,  Lawrence Denefrio ,  Peter Jones ,  John Ariel ,  Matthew Gagnon ,  Douglas Nobbs ,  George Watchko ,  Marc LaRosse

    IPC分类号： H05K9/00

    CPC分类号： H05K9/003

    摘要： An apparatus for providing board level shielding of Electromagnetic Interference in a printed circuit board is disclosed. The apparatus includes a plastic part, a metal conformal coating and a form-in-place Electromagnetic Interference gasket. The plastic part is configured in one or more compartments to provide an enclosure, and is attached to the printed circuit board. The metal conformal coating is applied continuously to one or more surfaces of the plastic part. The form-in-place Electromagnetic Interference gasket is applied on top of the metal conformal coating in an area of a part flange.

    摘要翻译： 公开了一种用于在印刷电路板中提供电磁干扰的电路板级屏蔽的装置。 该设备包括塑料部件，金属保形涂层和就地电磁干扰垫片。 塑料部件配置在一个或多个隔间中以提供外壳，并且附接到印刷电路板。 金属保形涂层连续施加到塑料部件的一个或多个表面。 现场电磁干扰垫片应用在部件法兰区域的金属保形涂层的顶部。

    Assembly for mounting electronic components, methods of use and manufacture thereof
    3.
    发明授权
    Assembly for mounting electronic components, methods of use and manufacture thereof 有权
    用于安装电子部件的组件，其使用方法和制造方法

    公开(公告)号：US08439615B2

    公开(公告)日：2013-05-14

    申请号：US11828467

    申请日：2007-07-26

    申请人： Chi H. Wu ,  Liu C. Lei ,  Thomas J. Socci ,  Douglas Nobbs ,  George R. Watchko

    发明人： Chi H. Wu ,  Liu C. Lei ,  Thomas J. Socci ,  Douglas Nobbs ,  George R. Watchko

    IPC分类号： F16B35/04

    CPC分类号： H05K7/1407

    摘要： An assembly for mounting electronic components includes a face plate comprising a thermoplastic material. The face plate includes a retaining element for securing a captive screw and spring assembly for mounting an electronic printed circuit board. The retaining element includes one or more slots adapted to expand the element to permit insertion of the screw and deformation of the hole upon insertion of the screw, while locking the screw to retain the screw in place. This arrangement permits the elimination of the metal standoff frequently used in similar devices. Methods for preparing the assembly and mounting the printed circuit boards are also described.

    摘要翻译： 用于安装电子部件的组件包括包含热塑性材料的面板。 面板包括用于固定用于安装电子印刷电路板的固定螺钉和弹簧组件的保持元件。 保持元件包括适于膨胀元件以允许螺钉插入和插入螺钉时孔的变形的一个或多个槽，同时锁定螺钉以将螺钉保持在适当位置。 这种布置允许消除在类似装置中经常使用的金属支架。 还描述了制备组装和​​安装印刷电路板的方法。

    Composite polymeric material for EMI shielding
    5.
    发明申请
    Composite polymeric material for EMI shielding 有权
    用于EMI屏蔽的复合聚合材料

    公开(公告)号：US20070056769A1

    公开(公告)日：2007-03-15

    申请号：US11519345

    申请日：2006-09-12

    申请人： Christopher Severance ,  Douglas Nobbs ,  John Reynolds

    发明人： Christopher Severance ,  Douglas Nobbs ,  John Reynolds

    IPC分类号： H05K9/00

    CPC分类号： H05K9/0083 ,  H05K9/0015 ,  Y10T428/25 ,  Y10T428/256

    摘要： An EMI shielding material is provided for making EMI shielding gaskets, coating and other articles. The EMI shielding material includes a non-conductive polymer, an inherently conductive polymer and a conductive metal powder. These components are intimately combined to prepare EMI shielding materials having superior electrical and mechanical performance when used in applications such as housings for electronic components.

    摘要翻译： 提供EMI屏蔽材料用于制造EMI屏蔽垫片，涂层和其他物品。 EMI屏蔽材料包括非导电聚合物，固有导电聚合物和导电金属粉末。 当用于诸如电子部件的外壳的应用中时，将这些部件紧密组合以制备具有优异电气和机械性能的EMI屏蔽材料。

    Method for manufacturing an automobile trim component by blow molding and injection molding
    7.
    发明授权
    Method for manufacturing an automobile trim component by blow molding and injection molding 失效
    通过吹塑和注射成型制造汽车装饰件的方法

    公开(公告)号：US5328651A

    公开(公告)日：1994-07-12

    申请号：US26773

    申请日：1993-03-05

    申请人： Michael J. Gallagher ,  Douglas Nobbs

    发明人： Michael J. Gallagher ,  Douglas Nobbs

    IPC分类号： B29C44/06 ,  B29C44/14 ,  B29C45/14 ,  B29C49/04 ,  B29C49/22 ,  B29C67/22

    CPC分类号： B29C44/146 ,  B29C44/06 ,  B29C45/14811 ,  B29C49/22 ,  B29C2793/00 ,  B29C49/04 ,  B29C49/041 ,  B29K2105/04 ,  B29L2031/3005

    摘要： A method for manufacturing an automobile trim component includes the step of coextruding a plastic unfoamed material and foamed material into a multilayer parison, which is thereafter blow molded to a desired form. After the layers are cured, the article is removed from the blow mold and sectioned into multilayer skin halves, and one skin is placed in an injection mold. The core resin, either thermoplastic or thermoset in nature, is then injected into the injection mold and onto the skin, and then compresses the resin against the skin to produce a shell comprising a resin core layer, intermediate foam layer, and decorative outer layer.

    摘要翻译： 一种制造汽车装饰部件的方法包括将塑料未发泡材料和发泡材料共挤出成多层型坯的步骤，随后将其吹塑成所需的形状。 在层被固化之后，将物品从吹塑模具中取出并分成多层皮肤半部，并将一个皮肤放置在注射模具中。 然后将本质上为热塑性或热固性材料的核心树脂注射到注射模具和皮肤上，然后将树脂压在皮肤上，以产生包含树脂芯层，中间泡沫层和装饰外层的外壳。

    Composite EMI shield
    8.
    发明授权
    Composite EMI shield 有权
    复合EMI屏蔽

    公开(公告)号：US07005573B2

    公开(公告)日：2006-02-28

    申请号：US10777331

    申请日：2004-02-12

    申请人： William G. Lionetta ,  Louis M. Yantosca, Jr. ,  Daniel S. Ventura ,  Christopher L. Severance ,  Douglas Nobbs ,  Robert E. Stiffler ,  David C. Rich

    发明人： William G. Lionetta ,  Louis M. Yantosca, Jr. ,  Daniel S. Ventura ,  Christopher L. Severance ,  Douglas Nobbs ,  Robert E. Stiffler ,  David C. Rich

    IPC分类号： H05K9/00

    CPC分类号： H05K9/0032

    摘要： An EMI shield having at least one compartment for enclosing circuitry of an electronic device. The shield includes a first member formed of a first material such as a thin metal sheet or screen, or a metal-plated fabric or other electrically-conductive mesh, and a second member formed of a second material different than the first material which second material is an admixture of a plastic or other polymeric component and an electrically-conductive particulate filler component. The second member is integrally joined to the first member, and has at least one wall which extends from the first member and which together with the first member defines at least a portion of the compartment.

    摘要翻译： 一种具有至少一个用于封闭电子设备的电路的隔间的EMI屏蔽。 屏蔽包括由诸如薄金属片或屏幕的第一材料或金属镀层织物或其它导电网形成的第一构件，以及由不同于第一材料的第二材料形成的第二构件，第二材料 是塑料或其它聚合物组分和导电颗粒填料组分的混合物。 第二构件与第一构件一体地接合，并且具有至少一个从第一构件延伸的壁，并且与第一构件一起限定隔室的至少一部分。

    Composite polymeric material for EMI shielding
    9.
    发明授权
    Composite polymeric material for EMI shielding 有权
    用于EMI屏蔽的复合聚合材料

    公开(公告)号：US07589284B2

    公开(公告)日：2009-09-15

    申请号：US11519345

    申请日：2006-09-12

    申请人： Christopher L. Severance ,  Douglas Nobbs ,  John D. Reynolds

    发明人： Christopher L. Severance ,  Douglas Nobbs ,  John D. Reynolds

    IPC分类号： H05K9/00

    CPC分类号： H05K9/0083 ,  H05K9/0015 ,  Y10T428/25 ,  Y10T428/256

    摘要： An EMI shielding material is provided for making EMI shielding gaskets, coating and other articles. The EMI shielding material includes a non-conductive polymer, an inherently conductive polymer and a conductive metal powder. These components are intimately combined to prepare EMI shielding materials having superior electrical and mechanical performance when used in applications such as housings for electronic components.

    摘要翻译： 提供EMI屏蔽材料用于制造EMI屏蔽垫片，涂层和其他物品。 EMI屏蔽材料包括非导电聚合物，固有导电聚合物和导电金属粉末。 当用于诸如电子部件的外壳的应用中时，将这些部件紧密组合以制备具有优异电气和机械性能的EMI屏蔽材料。

    Electrically conductive article
    10.
    发明申请
    Electrically conductive article 审中-公开
    导电制品

    公开(公告)号：US20080121848A1

    公开(公告)日：2008-05-29

    申请号：US11729534

    申请日：2007-03-29

    申请人： Douglas Nobbs

    发明人： Douglas Nobbs

    IPC分类号： H01B1/02 ,  H01B1/04 ,  B29C70/88

    CPC分类号： C08K3/04 ,  C08K3/08 ,  C08K7/06 ,  C08L101/12

    摘要： The present invention relates to an electrically conductive article. The electrically conductive article is made of an injection moldable polymer. An electrically conductive material is embedded in the injection moldable polymer, and a carbon based material is also embedded in the injection moldable polymer. The electrically conductive article may be in the form of a pellet or a plate, and may be used as an EMI shield.

    摘要翻译： 本发明涉及一种导电制品。 导电制品由注射成型聚合物制成。 导电材料嵌入可注射成型聚合物中，碳基材料也嵌入可注射成型聚合物中。 导电制品可以是丸粒或板的形式，并且可以用作EMI屏蔽。