PLANAR ANTENNA
    1.
    发明申请
    PLANAR ANTENNA 有权
    平面天线

    公开(公告)号:US20080158068A1

    公开(公告)日:2008-07-03

    申请号:US11945711

    申请日:2007-11-27

    CPC classification number: H01Q9/42 H01Q1/243 H01Q9/0414 H01Q9/0421 H01Q21/28

    Abstract: The present invention provides a wireless transmit/receive unit, comprising a feeding connecting line, a first radiating line, a second radiating line, a third radiating line and a fourth radiating line, wherein the third radiating line is longer than the first radiating line and the first radiating line is longer than the second radiating line that provides different current paths for getting a broader bandwidth. The first, second and third radiating lines are connected parallel for enhancing an antenna pattern being perpendicular thereto, and form a series capacity between the first and the third radiating lines. The fourth radiating line vertically connects between the third radiating line and a grounding line for forming a grounding capacity. The printed antenna can be reduced in size by the effect of the two capacities. The wireless transmit/receive unit can provide a better isolation with others by the direction enforced pattern and the reduced size.

    Abstract translation: 本发明提供了一种无线发射/接收单元,包括馈电连接线,第一辐射线,第二辐射线,第三辐射线和第四辐射线,其中第三辐射线比第一辐射线长, 第一辐射线比提供用于获得更宽带宽的不同电流路径的第二辐射线更长。 第一,第二和第三辐射线并联连接以增强与其垂直的天线图案,并且在第一和第三辐射线之间形成串联容量。 第四辐射线在第三辐射线和用于形成接地能力的接地线之间垂直连接。 印刷天线可以通过两种容量的作用而减小尺寸。 无线发射/接收单元可以通过方向强制模式和减小的尺寸与其他方式提供更好的隔离。

    Planar antenna
    2.
    发明授权
    Planar antenna 有权
    平面天线

    公开(公告)号:US07884774B2

    公开(公告)日:2011-02-08

    申请号:US11945711

    申请日:2007-11-27

    CPC classification number: H01Q9/42 H01Q1/243 H01Q9/0414 H01Q9/0421 H01Q21/28

    Abstract: The present invention provides a wireless transmit/receive unit, comprising a feeding connecting line, a first radiating line, a second radiating line, a third radiating line and a fourth radiating line, wherein the third radiating line is longer than the first radiating line and the first radiating line is longer than the second radiating line that provides different current paths for getting a broader bandwidth. The first, second and third radiating lines are connected parallel for enhancing an antenna pattern being perpendicular thereto, and form a series capacity between the first and the third radiating lines. The fourth radiating line vertically connects between the third radiating line and a grounding line for forming a grounding capacity. The printed antenna can be reduced in size by the effect of the two capacities. The wireless transmit/receive unit can provide a better isolation with others by the direction enforced pattern and the reduced size.

    Abstract translation: 本发明提供了一种无线发射/接收单元,包括馈电连接线,第一辐射线,第二辐射线,第三辐射线和第四辐射线,其中第三辐射线比第一辐射线长, 第一辐射线比提供用于获得更宽带宽的不同电流路径的第二辐射线更长。 第一,第二和第三辐射线并联连接以增强与其垂直的天线图案,并且在第一和第三辐射线之间形成串联容量。 第四辐射线在第三辐射线和用于形成接地能力的接地线之间垂直连接。 印刷天线可以通过两种容量的作用而减小尺寸。 无线发射/接收单元可以通过方向强制模式和减小的尺寸与其他方式提供更好的隔离。

    NAND MEMORY CELLS AND MANUFACTURING METHOD THEREOF
    3.
    发明申请
    NAND MEMORY CELLS AND MANUFACTURING METHOD THEREOF 有权
    NAND存储器及其制造方法

    公开(公告)号:US20100200905A1

    公开(公告)日:2010-08-12

    申请号:US12368223

    申请日:2009-02-09

    Abstract: A method for manufacturing NAND memory cells includes providing a substrate having a first doped region formed therein; sequentially forming a first dielectric layer, a storage layer and a patterned hard mask on the substrate; forming a STI defining a plurality of recesses in the substrate through the patterned hard mask; sequentially forming a second dielectric layer and a first conductive layer filling the recesses on the substrate; and performing a planarization process to remove a portion of the first conductive layer and the second dielectric layer to form a plurality of self-aligned islanding gate structures.

    Abstract translation: 一种用于制造NAND存储器单元的方法包括提供其中形成有第一掺杂区的衬底; 在基板上依次形成第一介电层,存储层和图案化的硬掩模; 通过图案化的硬掩模形成在衬底中限定多个凹槽的STI; 顺序地形成第二电介质层和填充衬底上的凹部的第一导电层; 以及执行平坦化处理以去除所述第一导电层和所述第二介电层的一部分以形成多个自对准岛状栅极结构。

    Semiconductor device and method for fabricating semiconductor device
    4.
    发明授权
    Semiconductor device and method for fabricating semiconductor device 有权
    半导体装置及其制造方法

    公开(公告)号:US08629025B2

    公开(公告)日:2014-01-14

    申请号:US13403591

    申请日:2012-02-23

    Abstract: A method for fabricating a semiconductor device is described. A stacked gate dielectric is formed over a substrate, including a first dielectric layer, a second dielectric layer and a third dielectric layer from bottom to top. A conductive layer is formed on the stacked gate dielectric and then patterned to form a gate conductor. The exposed portion of the third and the second dielectric layers are removed with a selective wet cleaning step. S/D extension regions are formed in the substrate with the gate conductor as a mask. A first spacer is formed on the sidewall of the gate conductor and a portion of the first dielectric layer exposed by the first spacer is removed. S/D regions are formed in the substrate at both sides of the first spacer. A metal silicide layer is formed on the S/D regions.

    Abstract translation: 对半导体装置的制造方法进行说明。 堆叠的栅极电介质形成在衬底上,包括从底部到顶部的第一介电层,第二电介质层和第三电介质层。 在堆叠的栅极电介质上形成导电层,然后将其图案化以形成栅极导体。 通过选择性湿式清洗步骤除去第三和第二介电层的暴露部分。 在栅极导体作为掩模的基板中形成S / D延伸区域。 在栅极导体的侧壁上形成第一间隔物,并且去除由第一间隔物露出的第一电介质层的一部分。 在第一间隔物的两侧的基板中形成S / D区域。 在S / D区域上形成金属硅化物层。

    SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
    5.
    发明申请
    SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE 有权
    用于制造半导体器件的半导体器件和方法

    公开(公告)号:US20130221424A1

    公开(公告)日:2013-08-29

    申请号:US13403591

    申请日:2012-02-23

    Abstract: A method for fabricating a semiconductor device is described. A stacked gate dielectric is formed over a substrate, including a first dielectric layer, a second dielectric layer and a third dielectric layer from bottom to top. A conductive layer is formed on the stacked gate dielectric and then patterned to form a gate conductor. The exposed portion of the third and the second dielectric layers are removed with a selective wet cleaning step. S/D extension regions are formed in the substrate with the gate conductor as a mask. A first spacer is formed on the sidewall of the gate conductor and a portion of the first dielectric layer exposed by the first spacer is removed. S/D regions are formed in the substrate at both sides of the first spacer. A metal silicide layer is formed on the S/D regions.

    Abstract translation: 对半导体装置的制造方法进行说明。 堆叠的栅极电介质形成在衬底上,包括从底部到顶部的第一介电层,第二电介质层和第三电介质层。 在堆叠的栅极电介质上形成导电层,然后将其图案化以形成栅极导体。 通过选择性湿式清洗步骤除去第三和第二介电层的暴露部分。 在栅极导体作为掩模的基板中形成S / D延伸区域。 在栅极导体的侧壁上形成第一间隔物,并且去除由第一间隔物露出的第一电介质层的一部分。 在第一间隔物的两侧的基板中形成S / D区域。 在S / D区域上形成金属硅化物层。

    Antenna and antenna set with lower height
    6.
    发明授权
    Antenna and antenna set with lower height 有权
    天线和天线设置较低的高度

    公开(公告)号:US07956811B2

    公开(公告)日:2011-06-07

    申请号:US12166086

    申请日:2008-07-01

    Inventor: Chi-Cheng Huang

    CPC classification number: H01Q9/0421 H01Q9/36 H01Q9/40 H01Q9/42

    Abstract: An antenna and an antenna set are provided. The antenna is composed of a horseshoe sheet member and two rectangular sheet members. The horseshoe sheet member and the two rectangular sheet members are all made of a metal material. The antenna is made of a metal material, such as tinplate, and the antenna is adapted for receiving or emitting wireless signals of vertical polarization and horizontal polarization. The antenna set includes three antennae as above disposed on a substrate. The antenna set is adapted for polarization diversity, pattern diversity, and space diversity. Comparing with the conventional antenna and antenna set, the antenna and the antenna set according to the present invention have lower costs and lower heights, and can be designed as embedded antennae or hidden antennae.

    Abstract translation: 提供天线和天线组。 天线由马蹄片构件和两个矩形片构件组成。 马蹄板构件和两个矩形片构件均由金属材料制成。 天线由诸如马口铁的金属材料制成,天线适于接收或发射垂直极化和水平极化的无线信号。 天线组包括如上设置在基板上的三个天线。 天线组适用于极化分集,模式分集和空间分集。 与传统天线和天线组相比,根据本发明的天线和天线组具有较低的成本和较低的高度,并且可以被设计为嵌入式天线或隐藏天线。

    INTEGRATED CIRCUIT AND METHOD FOR FABRICATING THE SAME
    8.
    发明申请
    INTEGRATED CIRCUIT AND METHOD FOR FABRICATING THE SAME 审中-公开
    集成电路及其制造方法

    公开(公告)号:US20130234252A1

    公开(公告)日:2013-09-12

    申请号:US13412714

    申请日:2012-03-06

    Abstract: An integrated circuit includes a substrate, a first semiconductor device, a second semiconductor device and an interlayer dielectric layer. At least one isolation structure has been formed in the he substrate so as to separate the substrate into a first active region and a second active region. The first semiconductor device disposed on the first active region of the substrate includes a first gate insulating layer and a poly-silicon gate stacked on the substrate sequentially. The second semiconductor device disposed on the second active region of the substrate includes a second gate insulating layer and a metal gate stacked on the substrate sequentially. The material of the second gate insulating layer is different from that of the first gate insulating layer. The thickness of the metal gate is greater than that of the poly-silicon gate. The interlayer dielectric layer is disposed on the substrate and covering the first semiconductor device.

    Abstract translation: 集成电路包括衬底,第一半导体器件,第二半导体器件和层间电介质层。 在衬底中形成至少一个隔离结构,以将衬底分离成第一有源区和第二有源区。 设置在基板的第一有源区上的第一半导体器件包括依次层叠在基板上的第一栅极绝缘层和多晶硅栅极。 设置在基板的第二有源区上的第二半导体器件包括依次层叠在基板上的第二栅极绝缘层和金属栅极。 第二栅极绝缘层的材料与第一栅极绝缘层的材料不同。 金属栅极的厚度大于多晶硅栅极的厚度。 层间介质层设置在基板上并覆盖第一半导体器件。

    NAND memory cells
    10.
    发明授权
    NAND memory cells 有权
    NAND存储器单元

    公开(公告)号:US07973353B2

    公开(公告)日:2011-07-05

    申请号:US12368223

    申请日:2009-02-09

    Abstract: A method for manufacturing NAND memory cells includes providing a substrate having a first doped region formed therein; sequentially forming a first dielectric layer, a storage layer and a patterned hard mask on the substrate; forming a STI defining a plurality of recesses in the substrate through the patterned hard mask; sequentially forming a second dielectric layer and a first conductive layer filling the recesses on the substrate; and performing a planarization process to remove a portion of the first conductive layer and the second dielectric layer to form a plurality of self-aligned islanding gate structures.

    Abstract translation: 一种用于制造NAND存储器单元的方法包括提供其中形成有第一掺杂区的衬底; 在基板上依次形成第一介电层,存储层和图案化的硬掩模; 通过图案化的硬掩模形成在衬底中限定多个凹槽的STI; 顺序地形成第二电介质层和填充衬底上的凹部的第一导电层; 以及执行平坦化处理以去除所述第一导电层和所述第二介电层的一部分以形成多个自对准岛状栅极结构。

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