Abstract:
The present invention provides a wireless transmit/receive unit, comprising a feeding connecting line, a first radiating line, a second radiating line, a third radiating line and a fourth radiating line, wherein the third radiating line is longer than the first radiating line and the first radiating line is longer than the second radiating line that provides different current paths for getting a broader bandwidth. The first, second and third radiating lines are connected parallel for enhancing an antenna pattern being perpendicular thereto, and form a series capacity between the first and the third radiating lines. The fourth radiating line vertically connects between the third radiating line and a grounding line for forming a grounding capacity. The printed antenna can be reduced in size by the effect of the two capacities. The wireless transmit/receive unit can provide a better isolation with others by the direction enforced pattern and the reduced size.
Abstract:
The present invention provides a wireless transmit/receive unit, comprising a feeding connecting line, a first radiating line, a second radiating line, a third radiating line and a fourth radiating line, wherein the third radiating line is longer than the first radiating line and the first radiating line is longer than the second radiating line that provides different current paths for getting a broader bandwidth. The first, second and third radiating lines are connected parallel for enhancing an antenna pattern being perpendicular thereto, and form a series capacity between the first and the third radiating lines. The fourth radiating line vertically connects between the third radiating line and a grounding line for forming a grounding capacity. The printed antenna can be reduced in size by the effect of the two capacities. The wireless transmit/receive unit can provide a better isolation with others by the direction enforced pattern and the reduced size.
Abstract:
A method for manufacturing NAND memory cells includes providing a substrate having a first doped region formed therein; sequentially forming a first dielectric layer, a storage layer and a patterned hard mask on the substrate; forming a STI defining a plurality of recesses in the substrate through the patterned hard mask; sequentially forming a second dielectric layer and a first conductive layer filling the recesses on the substrate; and performing a planarization process to remove a portion of the first conductive layer and the second dielectric layer to form a plurality of self-aligned islanding gate structures.
Abstract:
A method for fabricating a semiconductor device is described. A stacked gate dielectric is formed over a substrate, including a first dielectric layer, a second dielectric layer and a third dielectric layer from bottom to top. A conductive layer is formed on the stacked gate dielectric and then patterned to form a gate conductor. The exposed portion of the third and the second dielectric layers are removed with a selective wet cleaning step. S/D extension regions are formed in the substrate with the gate conductor as a mask. A first spacer is formed on the sidewall of the gate conductor and a portion of the first dielectric layer exposed by the first spacer is removed. S/D regions are formed in the substrate at both sides of the first spacer. A metal silicide layer is formed on the S/D regions.
Abstract:
A method for fabricating a semiconductor device is described. A stacked gate dielectric is formed over a substrate, including a first dielectric layer, a second dielectric layer and a third dielectric layer from bottom to top. A conductive layer is formed on the stacked gate dielectric and then patterned to form a gate conductor. The exposed portion of the third and the second dielectric layers are removed with a selective wet cleaning step. S/D extension regions are formed in the substrate with the gate conductor as a mask. A first spacer is formed on the sidewall of the gate conductor and a portion of the first dielectric layer exposed by the first spacer is removed. S/D regions are formed in the substrate at both sides of the first spacer. A metal silicide layer is formed on the S/D regions.
Abstract:
An antenna and an antenna set are provided. The antenna is composed of a horseshoe sheet member and two rectangular sheet members. The horseshoe sheet member and the two rectangular sheet members are all made of a metal material. The antenna is made of a metal material, such as tinplate, and the antenna is adapted for receiving or emitting wireless signals of vertical polarization and horizontal polarization. The antenna set includes three antennae as above disposed on a substrate. The antenna set is adapted for polarization diversity, pattern diversity, and space diversity. Comparing with the conventional antenna and antenna set, the antenna and the antenna set according to the present invention have lower costs and lower heights, and can be designed as embedded antennae or hidden antennae.
Abstract:
A non-volatile memory cell includes a substrate, two charge trapping structures, a gate oxide layer, a gate and two doping regions. The charge trapping structures are disposed on the substrate separately. The gate oxide layer is disposed on the substrate between the two charge trapping structures. The gate is disposed on the gate oxide layer and the charge trapping structures, wherein the charge trapping structures protrude from two sides of the gate. The doping regions are disposed in the substrate at two sides of the gate.
Abstract:
An integrated circuit includes a substrate, a first semiconductor device, a second semiconductor device and an interlayer dielectric layer. At least one isolation structure has been formed in the he substrate so as to separate the substrate into a first active region and a second active region. The first semiconductor device disposed on the first active region of the substrate includes a first gate insulating layer and a poly-silicon gate stacked on the substrate sequentially. The second semiconductor device disposed on the second active region of the substrate includes a second gate insulating layer and a metal gate stacked on the substrate sequentially. The material of the second gate insulating layer is different from that of the first gate insulating layer. The thickness of the metal gate is greater than that of the poly-silicon gate. The interlayer dielectric layer is disposed on the substrate and covering the first semiconductor device.
Abstract:
A non-volatile memory cell includes a substrate, two charge trapping structures, a gate oxide layer, a gate and two doping regions. The charge trapping structures are disposed on the substrate separately. The gate oxide layer is disposed on the substrate between the two charge trapping structures. The gate is disposed on the gate oxide layer and the charge trapping structures, wherein the charge trapping structures protrude from two sides of the gate. The doping regions are disposed in the substrate at two sides of the gate.
Abstract:
A method for manufacturing NAND memory cells includes providing a substrate having a first doped region formed therein; sequentially forming a first dielectric layer, a storage layer and a patterned hard mask on the substrate; forming a STI defining a plurality of recesses in the substrate through the patterned hard mask; sequentially forming a second dielectric layer and a first conductive layer filling the recesses on the substrate; and performing a planarization process to remove a portion of the first conductive layer and the second dielectric layer to form a plurality of self-aligned islanding gate structures.