公开(公告)号：US08787002B2

公开(公告)日：2014-07-22

申请号：US13612816

申请日：2012-09-12

申请人： Ching-Feng Lin ,  Chi-Hao Chiu ,  Kun-Huang Chang

发明人： Ching-Feng Lin ,  Chi-Hao Chiu ,  Kun-Huang Chang

IPC分类号： H01G4/32

CPC分类号： H01G9/151 ,  H01G9/012 ,  H01G9/08

摘要： A winding-type solid electrolytic capacitor package structure includes a capacitor unit, a package unit and a conductive unit. The conductive unit includes a winding-type capacitor having a first conductive pin and a second conductive pin. The package unit includes a package body for enclosing the capacitor unit. The conductive unit includes a first conductive terminal electrically connected to the first conductive pin and a second conductive terminal electrically connected to the second conductive pin. The first conductive terminal has a first embedded portion contacting the first conductive pin and enclosed by the package body and a first exposed portion connected to the first embedded portion and exposed from the package body. The second conductive terminal has a second embedded portion contacting the second conductive pin and enclosed by the package body and a second exposed portion connected to the second embedded portion and exposed from the package body.

摘要翻译： 卷绕式固体电解电容器封装结构包括电容器单元，封装单元和导电单元。 导电单元包括具有第一导电引脚和第二导电引脚的绕组型电容器。 封装单元包括用于封闭电容器单元的封装体。 导电单元包括电连接到第一导电引脚的第一导电端子和电连接到第二导电引脚的第二导电端子。 所述第一导电端子具有接触所述第一导电针并被所述封装主体封闭的第一嵌入部分，以及连接到所述第一嵌入部分并从所述封装主体露出的第一暴露部分。 第二导电端子具有接触第二导电引脚并被封装体包围的第二嵌入部分，以及连接到第二嵌入部分并从封装主体露出的第二暴露部分。

公开(公告)号：US08755171B2

公开(公告)日：2014-06-17

申请号：US13613098

申请日：2012-09-13

申请人： Ching-Feng Lin ,  Chi-Hao Chiu ,  Kun-Huang Chang

发明人： Ching-Feng Lin ,  Chi-Hao Chiu ,  Kun-Huang Chang

IPC分类号： H01G2/10 ,  H01G9/08

CPC分类号： H01G9/012 ,  H01G9/08 ,  H01G9/15

摘要： A stacked-type solid electrolytic capacitor package structure includes a capacitor unit, a package unit and a conductive unit. The capacitor unit includes a plurality of capacitors stacked on top of one another. The package unit includes a package body enclosing the capacitors. The package body has a top surface defining a package length, a package width and an effective package, and the package width is substantially between 85% and 95% of the package length. The conductive unit includes a first conductive terminal electrically connected to the positive portion of the capacitor and a second conductive terminal electrically connected to the negative portion of the capacitor. One part of the first conductive terminal and one part of the second conductive terminal are enclosed by the package body, and another part of the first conductive terminal and another part of the second conductive terminal are exposed from the package body.

摘要翻译： 叠层型固体电解电容器封装结构包括电容器单元，封装单元和导电单元。 电容器单元包括堆叠在彼此顶部的多个电容器。 封装单元包括封装电容器的封装体。 包装体具有限定包装长度，包装宽度和有效包装的顶表面，并且包装宽度基本上在包装长度的85％至95％之间。 导电单元包括电连接到电容器的正部分的第一导电端子和电连接到电容器的负极部分的第二导电端子。 第一导电端子的一部分和第二导电端子的一部分被封装体包围，并且第一导电端子的另一部分和第二导电端子的另一部分从封装体露出。

公开(公告)号：US08654511B2

公开(公告)日：2014-02-18

申请号：US13178464

申请日：2011-07-07

申请人： Chi-Hao Chiu ,  Ching-Feng Lin ,  Kun-Huang Chang

发明人： Chi-Hao Chiu ,  Ching-Feng Lin ,  Kun-Huang Chang

IPC分类号： H01G5/38

CPC分类号： H01G9/012 ,  H01G9/10 ,  H01G9/14 ,  H01G9/15

摘要： A capacitance unit includes an anode portion, an insulating portion, a cathode portion and a colloid portion. The front end of the anode portion extends to from an anode terminal. The insulating portion surrounds the anode portion and covers a first partial surface of the anode portion. The cathode portion is disposed next to the insulating portion, and the cathode portion covers a second partial surface of the anode portion. The colloid portion is disposed next to the insulating portion, and the colloid portion surrounds the cathode portion and covers a partial surface of the cathode portion.

摘要翻译： 电容单元包括阳极部分，绝缘部分，阴极部分和胶体部分。 阳极部分的前端从阳极端子延伸。 绝缘部分包围阳极部分并且覆盖阳极部分的第一部分表面。 阴极部分靠近绝缘部分设置，阴极部分覆盖阳极部分的第二部分表面。 胶体部分靠近绝缘部分设置，胶体部分包围阴极部分并覆盖阴极部分的部分表面。

公开(公告)号：US08369066B2

公开(公告)日：2013-02-05

申请号：US12713398

申请日：2010-02-26

申请人： Ching-Feng Lin ,  Yui-Hsin Fran ,  Chi-Hao Chiu ,  Ming-Tsung Chen ,  Cheng-Wei Lai ,  Chun-Chia Huang

发明人： Ching-Feng Lin ,  Yui-Hsin Fran ,  Chi-Hao Chiu ,  Ming-Tsung Chen ,  Cheng-Wei Lai ,  Chun-Chia Huang

IPC分类号： H01G9/00

CPC分类号： H01G9/012 ,  H01G2/06 ,  H01G9/15

摘要： A lamellar stacked solid electrolytic capacitor includes a plurality of capacitor units, a substrate unit and a package unit. Each capacitor unit is composed of a negative foil, an isolation paper with conductive polymer substance, a positive foil, an isolation paper with conductive polymer substance and a negative foil that are stacked onto each other in sequence, the positive foils of the capacitor units are electrically connected to each other, the negative foils of the capacitor units are electrically connected to each other, and the positive foils and the negative foils are insulated from each other. The substrate unit has a positive guiding substrate electrically connected to the positive foils of the capacitor units and a negative guiding substrate electrically connected to the negative foils of the capacitor units. The package unit covers the capacitor units and one part of the substrate unit.

摘要翻译： 片状堆叠固体电解电容器包括多个电容器单元，基板单元和封装单元。 每个电容器单元由负箔，具有导电聚合物物质的隔离纸，正箔，具有导电聚合物物质的隔离纸和负箔依次堆叠组成，电容器单元的正箔是 彼此电连接，电容器单元的负箔彼此电连接，并且正箔和负箔彼此绝缘。 基板单元具有电连接到电容器单元的正箔的正引导基板和电连接到电容器单元的负箔的负引导基板。 封装单元覆盖电容器单元和衬底单元的一部分。

公开(公告)号：US08310814B2

公开(公告)日：2012-11-13

申请号：US12588186

申请日：2009-10-07

申请人： Chi-Hao Chiu ,  Yui-Hsin Fran ,  Ching-Feng Lin ,  Chun-Chia Huang

发明人： Chi-Hao Chiu ,  Yui-Hsin Fran ,  Ching-Feng Lin ,  Chun-Chia Huang

IPC分类号： H01G9/00 ,  H01G5/38 ,  H01G4/30 ,  H01G4/228

CPC分类号： H01G9/26 ,  H01G9/008 ,  H01G9/08

摘要： A stacked capacitor with positive multi-pin structure includes a plurality of capacitor units, a substrate unit and a package unit. Each capacitor unit has a positive electrode that has a positive pin extended outwards therefrom. The positive pins of the capacitor units are divided into a plurality of positive pin units that are separated from each other, and the positive pins of each positive pin unit are electrically stacked onto each other. Each capacitor unit has a negative electrode, and the negative electrodes of the capacitor units are electrically stacked onto each other. The substrate unit has a positive guiding substrate electrically connected to the positive pins of the capacitor units and a negative guiding substrate electrically connected to the negative electrodes of the capacitor units. The package unit covers the capacitor units and one part of the substrate unit.

摘要翻译： 具有正多引脚结构的堆叠电容器包括多个电容器单元，基板单元和封装单元。 每个电容器单元具有正极，其具有从其向外延伸的正极销。 电容器单元的正极引脚被分成多个彼此分离的正极引脚单元，并且每个正极引脚单元的正极引脚彼此电叠置。 每个电容器单元具有负电极，并且电容器单元的负电极彼此电叠置。 基板单元具有电连接到电容器单元的正极的正引导基板和电连接到电容器单元的负极的负引导基板。 封装单元覆盖电容器单元和衬底单元的一部分。

公开(公告)号：US20110122544A1

公开(公告)日：2011-05-26

申请号：US12813980

申请日：2010-06-11

申请人： Chi-Hao CHIU ,  Ching-Feng Lin ,  Chun-Chia Huang ,  Chien-Ting Liu

发明人： Chi-Hao CHIU ,  Ching-Feng Lin ,  Chun-Chia Huang ,  Chien-Ting Liu

IPC分类号： H01G9/00

CPC分类号： H01G9/012 ,  H01G9/26 ,  Y10T29/417

摘要： A stacked solid electrolytic capacitor and a method for manufacturing the same are disclosed. The stacked solid electrolytic capacitor includes two capacitor sets, a positive electrode conducting device, a negative electrode conducting device, and a package unit. Each capacitor set includes at least one capacitor unit. The front side of the positive electrode portion of the capacitor set extends to form a positive electrode pin. The positive electrode conducting device has at least one first positive electrode conducting lead frame and at least one second positive electrode conducting lead frame. The first positive electrode conducting lead frame is electrically connected with the second positive electrode conducting lead frame. The negative electrode conducting device has at least one negative electrode conducting lead frame, and is electrically connected with the negative electrode of the two capacitor sets by using metal conductive material.

摘要翻译： 公开了层叠固体电解电容器及其制造方法。 堆叠的固体电解电容器包括两个电容器组，正极导电装置，负极导电装置和封装单元。 每个电容器组包括至少一个电容器单元。 电容器组的正极部分的前侧延伸形成正极销。 正极导电装置具有至少一个第一正极导电引线框架和至少一个第二正极导电引线框架。 第一正极导电引线框架与第二正极导电引线框架电连接。 负极导电装置具有至少一个负极导电引线框架，并且通过使用金属导电材料与两个电容器组的负极电连接。

公开(公告)号：US08390991B2

公开(公告)日：2013-03-05

申请号：US12833421

申请日：2010-07-09

申请人： Chi-Hao Chiu ,  Yui-Shin Fran ,  Ching-Feng Lin ,  Chun-Chia Huang ,  Chun-Hung Lin ,  Wen-Yen Huang

发明人： Chi-Hao Chiu ,  Yui-Shin Fran ,  Ching-Feng Lin ,  Chun-Chia Huang ,  Chun-Hung Lin ,  Wen-Yen Huang

IPC分类号： H01G9/04 ,  H01G9/15 ,  H01G4/228

CPC分类号： H01G9/00

摘要： A stacked solid state solid electrolytic capacitor includes a plurality of capacitor units, a substrate unit and a package unit. The substrate unit includes a positive guiding substrate and a negative guiding substrate. The positive guiding substrate has a positive exposed end integrally extended therefrom along a first predetermined direction. The negative guiding substrate has a first negative exposed end integrally extended therefrom along a second predetermined direction, a second negative exposed end integrally extended therefrom along a third predetermined direction, and a third negative exposed end integrally extended therefrom along a fourth predetermined direction. The first, the second, the third and the fourth predetermined directions are different. The capacitor units are stacked on top of one another and disposed on the negative guiding substrate. The package unit encloses the capacitor units, one part of the positive and one part of the negative guiding substrate.

摘要翻译： 堆叠的固态固体电解电容器包括多个电容器单元，基板单元和封装单元。 基板单元包括正引导基板和负引导基板。 正引导基板具有沿着第一预定方向从其一体延伸的正露出端。 负引导基板具有沿着第二预定方向从其一体地延伸的第一负外露端，沿着第三预定方向从其一体地延伸的第二负外露端，以及沿着第四预定方向从其一体地延伸的第三负外露端。 第一，第二，第三和第四预定方向是不同的。 电容器单元堆叠在彼此的顶部并且设置在负引导基板上。 封装单元包围电容器单元，正极的一部分和负引导基板的一部分。

公开(公告)号：US08305735B2

公开(公告)日：2012-11-06

申请号：US12627576

申请日：2009-11-30

申请人： Yui-Shin Fran ,  Ching-Feng Lin ,  Chi-Hao Chiu ,  Chun-Chia Huang ,  Wen-Yen Huang

发明人： Yui-Shin Fran ,  Ching-Feng Lin ,  Chi-Hao Chiu ,  Chun-Chia Huang ,  Wen-Yen Huang

IPC分类号： H01G4/228 ,  H01G5/38 ,  H01G9/00

CPC分类号： H01G9/15 ,  H01G2/06 ,  H01G9/012 ,  Y02T10/7022

摘要： A stacked solid electrolytic capacitor with positive multi-pin structure includes a plurality of capacitor units, a substrate unit and a package unit. The positive electrode of each capacitor unit has a positive pin extended outwards therefrom. The positive pins are divided into a plurality of positive pin units that are separated from each other and electrically stacked onto each other. The negative electrode of each capacitor unit has a negative pin extended outwards therefrom. The negative pins are divided into a plurality of negative pin units. The negative pin units are separated from each other and the negative pins of each negative pin unit are electrically stacked onto each other. The substrate unit has a positive guiding substrate electrically connected to the positive pins and a negative guiding substrate electrically connected to the negative pins. The package unit covers the capacitor units and one part of the substrate unit.

摘要翻译： 具有正多引脚结构的堆叠固体电解电容器包括多个电容器单元，基板单元和封装单元。 每个电容器单元的正电极具有从其向外延伸的正极销。 正极引脚分为多个彼此分离并彼此电叠置的正极引脚单元。 每个电容器单元的负极具有从其向外延伸的负极销。 负引脚分为多个负引脚单元。 负引脚单元彼此分离，并且每个负引脚单元的负引脚彼此电叠置。 基板单元具有与正极引脚电连接的正引导基板和与负引脚电连接的负引导基板。 封装单元覆盖电容器单元和衬底单元的一部分。

公开(公告)号：US20110007451A1

公开(公告)日：2011-01-13

申请号：US12627576

申请日：2009-11-30

申请人： Yui-Shin Fran ,  Ching-Feng Lin ,  Chi-Hao Chiu ,  Chun-Chia Huang ,  Wen-Yen Huang

发明人： Yui-Shin Fran ,  Ching-Feng Lin ,  Chi-Hao Chiu ,  Chun-Chia Huang ,  Wen-Yen Huang

IPC分类号： H01G9/00

CPC分类号： H01G9/15 ,  H01G2/06 ,  H01G9/012 ,  Y02T10/7022

摘要： A stacked solid electrolytic capacitor with positive multi-pin structure includes a plurality of capacitor units, a substrate unit and a package unit. The positive electrode of each capacitor unit has a positive pin extended outwards therefrom. The positive pins are divided into a plurality of positive pin units that are separated from each other and electrically stacked onto each other. The negative electrode of each capacitor unit has a negative pin extended outwards therefrom. The negative pins are divided into a plurality of negative pin units. The negative pin units are separated from each other and the negative pins of each negative pin unit are electrically stacked onto each other. The substrate unit has a positive guiding substrate electrically connected to the positive pins and a negative guiding substrate electrically connected to the negative pins. The package unit covers the capacitor units and one part of the substrate unit.

摘要翻译： 具有正多引脚结构的堆叠固体电解电容器包括多个电容器单元，基板单元和封装单元。 每个电容器单元的正电极具有从其向外延伸的正极销。 正极引脚分为多个彼此分离并彼此电叠置的正极引脚单元。 每个电容器单元的负极具有从其向外延伸的负极销。 负引脚分为多个负引脚单元。 负引脚单元彼此分离，并且每个负引脚单元的负引脚彼此电叠置。 基板单元具有与正极引脚电连接的正引导基板和与负引脚电连接的负引导基板。 封装单元覆盖电容器单元和衬底单元的一部分。

公开(公告)号：US20110002087A1

公开(公告)日：2011-01-06

申请号：US12588186

申请日：2009-10-07

申请人： Chi-Hao Chiu ,  Yui-Hsin Fran ,  Ching-Feng Lin ,  Chun-Chia Huang

发明人： Chi-Hao Chiu ,  Yui-Hsin Fran ,  Ching-Feng Lin ,  Chun-Chia Huang

IPC分类号： H01G9/00

CPC分类号： H01G9/26 ,  H01G9/008 ,  H01G9/08

摘要： A stacked capacitor with positive multi-pin structure includes a plurality of capacitor units, a substrate unit and a package unit. Each capacitor unit has a positive electrode that has a positive pin extended outwards therefrom. The positive pins of the capacitor units are divided into a plurality of positive pin units that are separated from each other, and the positive pins of each positive pin unit are electrically stacked onto each other. Each capacitor unit has a negative electrode, and the negative electrodes of the capacitor units are electrically stacked onto each other. The substrate unit has a positive guiding substrate electrically connected to the positive pins of the capacitor units and a negative guiding substrate electrically connected to the negative electrodes of the capacitor units. The package unit covers the capacitor units and one part of the substrate unit.

摘要翻译： 具有正多引脚结构的堆叠电容器包括多个电容器单元，基板单元和封装单元。 每个电容器单元具有正极，其具有从其向外延伸的正极销。 电容器单元的正极引脚被分成多个彼此分离的正极引脚单元，并且每个正极引脚单元的正极引脚彼此电叠置。 每个电容器单元具有负电极，并且电容器单元的负电极彼此电叠置。 基板单元具有电连接到电容器单元的正极的正引导基板和电连接到电容器单元的负极的负引导基板。 封装单元覆盖电容器单元和衬底单元的一部分。