摘要:
A winding-type solid electrolytic capacitor package structure includes a capacitor unit, a package unit and a conductive unit. The conductive unit includes a winding-type capacitor having a first conductive pin and a second conductive pin. The package unit includes a package body for enclosing the capacitor unit. The conductive unit includes a first conductive terminal electrically connected to the first conductive pin and a second conductive terminal electrically connected to the second conductive pin. The first conductive terminal has a first embedded portion contacting the first conductive pin and enclosed by the package body and a first exposed portion connected to the first embedded portion and exposed from the package body. The second conductive terminal has a second embedded portion contacting the second conductive pin and enclosed by the package body and a second exposed portion connected to the second embedded portion and exposed from the package body.
摘要:
A stacked-type solid electrolytic capacitor package structure includes a capacitor unit, a package unit and a conductive unit. The capacitor unit includes a plurality of capacitors stacked on top of one another. The package unit includes a package body enclosing the capacitors. The package body has a top surface defining a package length, a package width and an effective package, and the package width is substantially between 85% and 95% of the package length. The conductive unit includes a first conductive terminal electrically connected to the positive portion of the capacitor and a second conductive terminal electrically connected to the negative portion of the capacitor. One part of the first conductive terminal and one part of the second conductive terminal are enclosed by the package body, and another part of the first conductive terminal and another part of the second conductive terminal are exposed from the package body.
摘要:
A capacitance unit includes an anode portion, an insulating portion, a cathode portion and a colloid portion. The front end of the anode portion extends to from an anode terminal. The insulating portion surrounds the anode portion and covers a first partial surface of the anode portion. The cathode portion is disposed next to the insulating portion, and the cathode portion covers a second partial surface of the anode portion. The colloid portion is disposed next to the insulating portion, and the colloid portion surrounds the cathode portion and covers a partial surface of the cathode portion.
摘要:
The invention relates to resettable chip-type over-current protection devices and methods of making the same, characterized by directly forming upper and lower electrode conductor and connection electrode conductor on a PPTC substrate so as to constitute a simplified three-layer structure of “electrode conductor-PPTC substrate-electrode conductor.”
摘要:
This invention is novel structure of an over-current protection device and manufacturing method thereof. The over-current protection device is formed with a main body with a lead frame and a ceramic fiber lead wound by a metal wire exteriorly, by coating the exterior of the whole lead with a thermally-insulating material, and then cladding the lead with a flame retardation material having an electrical insulation characteristic.
摘要:
A method of making foam material includes a process of impregnating comminuted particles of a previously formed foam material with a first foaming reaction solution made up of polyol, catalyst and additives and with a second foaming reaction solution containing diisocyanate. The comminuted particles are also subjected to a rolling pressure when they are being impregnated with the first foaming reaction solution. The impregnated particles are transferred to a forming area provided with steam serving to accelerate the foaming reaction of the impregnated particles. The foam material so produced is provided with excellent properties.
摘要:
The present invention is an electrostatic discharge protection device having a low trigger voltage. The device can utilize a process of manufacturing a PCB to minimize costs and manufacturing time. The device comprises: a discharge area, which is essentially a space within the device and can be filled by a material having a desired breakdown voltage, and at least two electrode areas, wherein the two electrode areas are substantially electrically isolated from each other and simultaneously adjacent to or within the discharge area. When an electric potential difference between the electrode areas exceeds a predetermined value, a conductive path between the electrode areas will be created by discharging through the discharge area. The device is characterized in that each of the two electrodes is a part of a conductive plate, and the two conductive plates become a part of the device by pressing or adhering so that a gap for electric isolation exists between the two electrode areas.
摘要:
An over-current protective device is characterized by comprising: a fuse cover, a fusible body disposed therein, and a first electrode and a second electrode respectively extending from the two ends of the fusible body. A method for fabricating the over-current protective device comprises the following steps: stamping a conductive metal sheet to form a frame with a base having two ends respectively extending as a supporting plate, and soldering a fusible unit containing the fusible body between the supporting plates; disposing the frame having the soldered fusible unit into a mold, putting a polymeric material into the mold for covering the fusible body and the supporting plates, and molding the fusible body into a required shape; taking out the frame covered by the polymeric material and cutting the base off so as to obtain an over-current protective device having two electrode plates extending from two ends thereof.
摘要:
A method of recycling waste plastic foam materials firstly is to smash a waste material including polyurethane foam into fine particles so as to obtain a first starting material. The first starting material is then crisped and followingly milled into powder so as to obtain a second starting material. The second starting material is then placed into a mixer to mix with a first foaming reaction solution including polyol, catalyst and additives injected into the mixer so as to form a semi-treated foaming material. And then, the semi-treated foaming material is mixed with a second foaming reaction solution including diisocyanate injected into the mixer so as to obtain a completed-treated foaming material. Lastly, the completed-treated foaming material is poured into a mold and then water vapor is uniformly introduced into the mold so as to induce the completed-treated foaming material to proceed foaming reaction.
摘要:
The invention relates to resettable chip-type over-current protection devices and methods of making the same, characterized by directly forming upper and lower electrode conductor and connection electrode conductor on a PPTC substrate so as to constitute a simplified three-layer structure of “electrode conductor-PPTC substrate-electrode conductor.”