摘要:
The invention discloses a double-layer PCB of a low power wireless sensing system and a manufacturing method thereof. The low power wireless sensing system includes a first layer and a second layer. The first layer comprises a wireless communication module, a power amplifying module, a USB module, a balun module, an antenna module, a low-frequency oscillator and a high-frequency oscillator. According to the double-layer PCB of the low power wireless sensing system and the manufacturing method thereof, a circuit layout can be performed on the double-layer PCB to reduce volume of the PCB.
摘要:
A low power wireless sensing system includes: a sensing device senses a peripheral environment to generate sensing data; a transmission device, coupled to the sensing device, is connected to an external network through a communication protocol to establish a wireless sensing network; a storage device stores the sensing data or first firmware; and a microprocessing device generates a control signal to control operations of the sensing device, transmission device and storage device according to the sensing data or a RF signal of the external network. The microprocessing device determines to read the first firmware according to the RF signal, so that second firmware built in the microprocessing device is updated and the control signal is adjusted correspondingly. The microprocessing device makes the transmission device enter a sleep state or perform reconnecting according to the RF signal.