公开(公告)号：US20070194465A1

公开(公告)日：2007-08-23

申请号：US11309041

申请日：2006-06-13

申请人： Ming-Ji Dai ,  Chun-Kai Liu ,  Chih-Kuang Yu

发明人： Ming-Ji Dai ,  Chun-Kai Liu ,  Chih-Kuang Yu

IPC分类号： H01L23/29

CPC分类号： H01L33/645 ,  F21K9/00 ,  H01L25/167 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

摘要： A light emitting diode (LED) package structure including a first substrate, an LED chip, a second substrate, and a thermoelectric cooling device is provided. The first substrate has a first surface and a corresponding second surface. The LED chip suitable for emitting a light is arranged on the first surface of the first substrate, and is electrically connected to the first substrate. The second substrate is below the first substrate, and has a third surface and a corresponding fourth surface. The third surface faces the second surface. The thermoelectric cooling device is arranged between the second surface of the first substrate and the third surface of the second substrate for conducting heat generated by the LED chip during operation.

摘要翻译： 提供了包括第一基板，LED芯片，第二基板和热电冷却装置的发光二极管（LED）封装结构。 第一基板具有第一表面和相应的第二表面。 适于发光的LED芯片布置在第一基板的第一表面上，并与第一基板电连接。 第二基板在第一基板的下面，并且具有第三表面和相应的第四表面。 第三表面面向第二表面。 热电冷却装置设置在第一基板的第二表面和第二基板的第三表面之间，用于在操作期间传导由LED芯片产生的热量。

公开(公告)号：US08222728B2

公开(公告)日：2012-07-17

申请号：US12336320

申请日：2008-12-16

申请人： Chih-Kuang Yu ,  Chun-Kai Liu ,  Ming-Ji Dai ,  Chih-Yuan Cheng

发明人： Chih-Kuang Yu ,  Chun-Kai Liu ,  Ming-Ji Dai ,  Chih-Yuan Cheng

IPC分类号： H01L23/10 ,  H01L23/34

CPC分类号： H01L27/16 ,  H01L23/38 ,  H01L2924/0002 ,  H01S3/04 ,  H01S5/024 ,  H01S5/02476 ,  H01L2924/00

摘要： An active solid heatsink device and fabricating method thereof is related to a high-effective solid cooling device, where heat generated by a heat source with a small area and a high heat-generating density diffuses to a whole substrate using a heat conduction characteristic of hot electrons of a thermionic (TI) structure, and the thermionic (TI) structure and a thermo-electric (TE) structure share the substrate where the heat diffuses to. Further, the shared substrate serves as a cold end of the TE structure, and the heat diffusing to the shared substrate is pumped to another substrate of the TE structure serving as a hot end of the TE structure.

摘要翻译： 一种活性固体散热装置及其制造方法涉及一种高效固体冷却装置，其中由具有小面积和高发热密度的热源产生的热量使用热的热传导特性扩散到整个基板 热电子（TI）结构的电子和热电子（TI）结构和热电（TE）结构共享热扩散到的衬底。 此外，共用衬底用作TE结构的冷端，并且向共享衬底的扩散的热量被泵送到TE结构的热端的另一个TE结构的衬底。

公开(公告)号：US07517114B2

公开(公告)日：2009-04-14

申请号：US11769630

申请日：2007-06-27

申请人： Ra-Min Tain ,  Shyi-Ching Liau ,  Chun-Kai Liu ,  Ming-Ji Dai ,  Chih-Kuang Yu ,  Wei-Kuo Han

发明人： Ra-Min Tain ,  Shyi-Ching Liau ,  Chun-Kai Liu ,  Ming-Ji Dai ,  Chih-Kuang Yu ,  Wei-Kuo Han

IPC分类号： F21V29/00

CPC分类号： H01L33/645 ,  F21V29/00 ,  Y10S257/93 ,  Y10S362/80

摘要： Lighting devices are provided. A lighting device includes a first substrate, a second substrate, a light source and a thermoelectric cooling chip set disposed between the first and second substrates. The first substrate includes a core, a first circuit layer, and a second circuit layer, wherein the first and second circuit layers are disposed on opposite sides of the core. The second substrate comprises a third circuit layer. The light source is disposed on the first substrate and electrically connected to the first circuit layer. The thermoelectric cooling chip set is electrically connected to the second and third circuit layers, to dissipate heat from the light source.

摘要翻译： 提供照明设备。 照明装置包括第一基板，第二基板，光源和设置在第一和第二基板之间的热电冷却芯片组。 第一基板包括芯，第一电路层和第二电路层，其中第一和第二电路层设置在芯的相对侧上。 第二基板包括第三电路层。 光源设置在第一基板上并电连接到第一电路层。 热电冷却芯片组电连接到第二和第三电路层，以散发来自光源的热量。

公开(公告)号：US20080013320A1

公开(公告)日：2008-01-17

申请号：US11769630

申请日：2007-06-27

申请人： Ra-Min Tain ,  Shyi-Ching Liau ,  Chun-Kai Liu ,  Ming-Ji Dai ,  Chih-Kuang Yu ,  Wei-Kuo Han

发明人： Ra-Min Tain ,  Shyi-Ching Liau ,  Chun-Kai Liu ,  Ming-Ji Dai ,  Chih-Kuang Yu ,  Wei-Kuo Han

IPC分类号： F21V29/00 ,  F21V7/10

CPC分类号： H01L33/645 ,  F21V29/00 ,  Y10S257/93 ,  Y10S362/80

摘要： Lighting devices are provided. A lighting device includes a first substrate, a second substrate, a light source and a thermoelectric cooling chip set disposed between the first and second substrates. The first substrate includes a core, a first circuit layer, and a second circuit layer, wherein the first and second circuit layers are disposed on opposite sides of the core. The second substrate comprises a third circuit layer. The light source is disposed on the first substrate and electrically connected to the first circuit layer. The thermoelectric cooling chip set is electrically connected to the second and third circuit layers, to dissipate heat from the light source.

摘要翻译： 提供照明设备。 照明装置包括第一基板，第二基板，光源和设置在第一和第二基板之间的热电冷却芯片组。 第一基板包括芯，第一电路层和第二电路层，其中第一和第二电路层设置在芯的相对侧上。 第二基板包括第三电路层。 光源设置在第一基板上并电连接到第一电路层。 热电冷却芯片组电连接到第二和第三电路层，以散发来自光源的热量。

公开(公告)号：US20070187815A1

公开(公告)日：2007-08-16

申请号：US11392721

申请日：2006-03-30

申请人： Ming-Ji Dai ,  Chun-Kai Liu ,  Chih-Kuang Yu ,  Shih-Hsien Wu

发明人： Ming-Ji Dai ,  Chun-Kai Liu ,  Chih-Kuang Yu ,  Shih-Hsien Wu

IPC分类号： H01L23/34

CPC分类号： H01L25/167 ,  H01L33/645 ,  H01L35/32 ,  H01L35/34 ,  H01L2224/48091 ,  H01L2224/85385 ,  H05K1/0203 ,  H01L2924/00014

摘要： The invention discloses an encapsulation comprising a metal substrate, a PCB on the metal substrate, a thermo-electric element in and/or on the PCB, and an LED on the thermo-electric element. Encapsulating methods are also provided by the invention.

摘要翻译： 本发明公开了一种包括金属基底，金属基底上的PCB，PCB中和/或PCB上的热电元件以及热电元件上的LED的封装。 封装方法也由本发明提供。

公开(公告)号：US08008573B2

公开(公告)日：2011-08-30

申请号：US11956325

申请日：2007-12-13

申请人： Ming-Ji Dai ,  Chun-Kai Liu ,  Chih-Kuang Yu ,  Cheng-Ta Ko ,  Tsung-Chieh Cheng

发明人： Ming-Ji Dai ,  Chun-Kai Liu ,  Chih-Kuang Yu ,  Cheng-Ta Ko ,  Tsung-Chieh Cheng

IPC分类号： H01L31/024 ,  H01L31/058

CPC分类号： H01L35/30 ,  H01L35/32 ,  H02S10/10

摘要： An integrated package structure having a solar cell and a thermoelectric element includes a substrate, a first solar cell and a thermoelectric element. The substrate has a first surface. The first solar cell has a second surface, a first electrode disposed on the second surface and a second electrode disposed on the second surface. The second surface faces the first surface. The thermoelectric element has a third electrode and a fourth electrode. The thermoelectric element is disposed between the first surface and the second surface. The first electrode and the second electrode are electrically connected to the third electrode and the fourth electrode respectively. A method of fabricating the integrated package structure having the solar cell and the thermoelectric element is also provided.

摘要翻译： 具有太阳能电池和热电元件的集成封装结构包括衬底，第一太阳能电池和热电元件。 衬底具有第一表面。 第一太阳能电池具有第二表面，设置在第二表面上的第一电极和设置在第二表面上的第二电极。 第二表面面向第一表面。 热电元件具有第三电极和第四电极。 热电元件设置在第一表面和第二表面之间。 第一电极和第二电极分别电连接到第三电极和第四电极。 还提供了一种制造具有太阳能电池和热电元件的集成封装结构的方法。

公开(公告)号：US07972877B2

公开(公告)日：2011-07-05

申请号：US12489445

申请日：2009-06-23

申请人： Ming-Ji Dai ,  Chun-Kai Liu ,  Chih-Kuang Yu

发明人： Ming-Ji Dai ,  Chun-Kai Liu ,  Chih-Kuang Yu

IPC分类号： H01L21/00

CPC分类号： H01L33/645 ,  F21K9/00 ,  H01L25/167 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

摘要： A method of fabricating a light emitting diode package structure is provided. First, a first circuit substrate having a first surface and a corresponding second surface and a second circuit substrate having a third surface and a corresponding fourth surface are provided. The second surface and the third surface respectively have a plurality of electrodes. Then, a plurality of N-type semiconductor materials and a plurality of P-type semiconductor materials alternatively arranged on the electrodes are formed. Then, the first circuit substrate and the second circuit substrate are assembled. The two type semiconductor materials are located between the electrodes of the first circuit substrate and the second circuit substrate. The two type semiconductor materials are electrically connected to the first circuit substrate and the second circuit substrate through the electrodes. Finally, an LED chip is arranged on the first surface and electrically connected to the first circuit substrate.

摘要翻译： 提供一种制造发光二极管封装结构的方法。 首先，提供具有第一表面和对应的第二表面的第一电路基板和具有第三表面和相应的第四表面的第二电路基板。 第二表面和第三表面分别具有多个电极。 然后，形成交替布置在电极上的多个N型半导体材料和多个P型半导体材料。 然后，组装第一电路基板和第二电路基板。 两种类型的半导体材料位于第一电路基板和第二电路基板的电极之间。 两种类型的半导体材料通过电极电连接到第一电路基板和第二电路基板。 最后，LED芯片布置在第一表面上并电连接到第一电路基板。

公开(公告)号：US07855396B2

公开(公告)日：2010-12-21

申请号：US11861294

申请日：2007-09-26

申请人： Ming-Ji Dai ,  Chun-Kai Liu ,  Chih-Kuang Yu

发明人： Ming-Ji Dai ,  Chun-Kai Liu ,  Chih-Kuang Yu

IPC分类号： H01L33/00

CPC分类号： H01L25/167 ,  H01L25/0753 ,  H01L33/645 ,  H01L2224/48227 ,  Y10S257/93 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A light emitting diode (LED) package structure including a first substrate, one or more LED chips, a second substrate, and a thermoelectric cooling device is provided. The first substrate has a first surface and a corresponding second surface. The LED chip suitable for emitting a light is arranged on the first surface of the first substrate, and is electrically connected to the first substrate. The second substrate is below the first substrate, and has a third surface and a corresponding fourth surface. The third surface faces the second surface. The thermoelectric cooling device is arranged between the second surface of the first substrate and the third surface of the second substrate for conducting heat generated by the LED chip during operation.

摘要翻译： 提供了包括第一基板，一个或多个LED芯片，第二基板和热电冷却装置的发光二极管（LED）封装结构。 第一基板具有第一表面和相应的第二表面。 适于发光的LED芯片布置在第一基板的第一表面上，并与第一基板电连接。 第二基板在第一基板的下面，并且具有第三表面和相应的第四表面。 第三表面面向第二表面。 热电冷却装置设置在第一基板的第二表面和第二基板的第三表面之间，用于在操作期间传导由LED芯片产生的热量。

公开(公告)号：US20090014046A1

公开(公告)日：2009-01-15

申请号：US11964712

申请日：2007-12-27

申请人： Chih-Kuang Yu ,  Chun-Kai Liu ,  Ming-Ji Dai

发明人： Chih-Kuang Yu ,  Chun-Kai Liu ,  Ming-Ji Dai

IPC分类号： H01L35/02 ,  B29C43/02

CPC分类号： H01L35/34 ,  B29C43/18 ,  H01L35/32

摘要： A flexible thermoelectric device and a manufacturing method thereof are provided. Flexible substrates are formed by using LIGA process, micro-electro-mechanical process or electroforming technique. The flexible substrates are used to produce thermoelectric device. The structure and the material property of the substrates offer flexible property and tensile property to the thermoelectric device. Thermal transfer enhancement structures such as thermal via or metal diffusion layer are formed on the flexible substrates to overcome the low thermal transfer property of the flexible substrates.

摘要翻译： 提供了一种柔性热电装置及其制造方法。 柔性基板通过使用LIGA工艺，微机电工艺或电铸技术形成。 柔性基板用于制造热电装置。 基板的结构和材料特性为热电装置提供了灵活的性能和拉伸性能。 在柔性基板上形成诸如热通孔或金属扩散层的热转移增强结构，以克服柔性基板的低热传递性能。

公开(公告)号：US08193625B2

公开(公告)日：2012-06-05

申请号：US12583725

申请日：2009-08-24

申请人： Chun-Kai Liu ,  Chih-Kuang Yu ,  Ming-Ji Dai ,  Ming-Che Hsieh

发明人： Chun-Kai Liu ,  Chih-Kuang Yu ,  Ming-Ji Dai ,  Ming-Che Hsieh

IPC分类号： H01L23/02

CPC分类号： H01L23/36 ,  H01L23/3128 ,  H01L23/481 ,  H01L25/0657 ,  H01L2224/0554 ,  H01L2224/05573 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A stacked-chip packaging structure includes chip sets, a heat sink, a substrate, a circuit board, and solder balls. The chip sets are stacked together, each of which has a heat-dissipation structure and a chip. The heat-dissipation structure has a chip recess, through holes arranged in the chip recess, and an extending portion extending from the chip recess. The chip disposed in the chip recess has bumps. Each bump on the chip is correspondingly disposed in one of the through holes of the heat-dissipation structure. The extending portion of the heat-dissipation structure of each chip set contacts that of the neighboring chip set. The heat sink and the substrate are disposed at two opposite sides of the chip sets, respectively. The circuit board is below the substrate. The solder balls are between the circuit board and the substrate.

摘要翻译： 堆叠式芯片封装结构包括芯片组，散热器，基板，电路板和焊球。 芯片组堆叠在一起，每个芯片组具有散热结构和芯片。 散热结构具有芯片凹部，布置在芯片凹部中的通孔和从芯片凹部延伸的延伸部分。 设置在芯片凹槽中的芯片具有凸起。 芯片上的每个凸块相应地设置在散热结构的一个通孔中。 每个芯片组的散热结构的延伸部分接触相邻芯片组的散热结构的延伸部分。 散热器和基板分别设置在芯片组的两个相对侧。 电路板位于基板之下。 焊球位于电路板和基板之间。