公开(公告)号：US20110000509A1

公开(公告)日：2011-01-06

申请号：US12259152

申请日：2008-10-27

申请人： Chin Yu Chen ,  Kin Mun Choong ,  Chun Chi Chen ,  Wei Zhu

发明人： Chin Yu Chen ,  Kin Mun Choong ,  Chun Chi Chen ,  Wei Zhu

IPC分类号： B08B9/093

CPC分类号： H01L21/67051 ,  G03F7/162

摘要： A cup wash disk jig employed to clean photoresist from a spin-on chamber, receives cleaning solvent from both the bottom and the top, enhancing cleaning effectiveness. The cup wash disk includes a first set of channels allowing fluid communication between a hole positioned in a top surface of the cup wash disk jig, and a plurality of orifices distributed about the edge of the jig. Solvent is applied to the top surface of the jig, for example from an existing reduce resist control (RRC) nozzle normally utilized to dispense resist material. The solvent is flowed through these channels and ejected from the disk sides through the orifice, thereby facilitating removal of resist residue from coater cup portions of the chamber. Solvent may also be applied to an opening in a bottom surface of the jig, for example from a back rinse nozzle, to flow through a second set of channels and be ejected through different jig edge orifices.

摘要翻译： 用于从旋涂室清洁光致抗蚀剂的杯式洗涤盘夹具从底部和顶部接收清洁溶剂，提高清洁效果。 杯洗盘包括第一组通道，允许位于杯洗盘盘夹具顶表面的孔和围绕夹具边缘分布的多个孔之间的流体连通。 溶剂被施加到夹具的顶表面，例如通常用于分配抗蚀剂材料的现有的抗蚀剂控制（RRC）喷嘴。 溶剂流过这些通道并从盘侧通过孔排出，从而有助于从室的涂覆杯部分去除抗蚀剂残留物。 溶剂也可以施加到夹具的底表面中的开口，例如来自后冲洗喷嘴，以流过第二组通道并通过不同的夹具边缘孔喷射。

公开(公告)号：US20110279797A1

公开(公告)日：2011-11-17

申请号：US12891738

申请日：2010-09-27

申请人： CHUN CHI CHEN ,  Sai Hung Lam ,  Wei Zhu ,  Chin Yu Chen

发明人： CHUN CHI CHEN ,  Sai Hung Lam ,  Wei Zhu ,  Chin Yu Chen

IPC分类号： G03B27/42

CPC分类号： H01L21/67253 ,  G03F7/70516 ,  H01L23/544 ,  H01L2223/54433 ,  H01L2924/0002 ,  H01L2924/00

摘要： A calibration wafer may bear one or more different mark types to facilitate inspection of a lithography process. A first mark type may be located on the outer peripheral portion of the wafer to indicate the desired boundary of an edge bead removal (EBR) region. A second mark type may be located on an outer peripheral portion of the wafer to indicate the desired boundary of a wafer edge expose region (WEE). A third mark type may indicate the border of a portion of the wafer expected to bear a wafer identification mark. A fourth mark type may be located at the center of the wafer to allow for precise and uniform application of liquid photoresist material to the calibration wafer. The calibration wafer may be employed in methods of rapidly and easily assessing the accuracy of various phases of photolithography processes.

摘要翻译： 校准晶片可以承载一种或多种不同的标记类型，以便于光刻工艺的检查。 第一标记类型可以位于晶片的外周部分上，以指示边缘珠去除（EBR）区域的期望边界。 第二标记类型可以位于晶片的外周部分上，以指示晶片边缘曝光区域（WEE）的期望边界。 第三标记类型可以指示期望承载晶片识别标记的晶片的一部分的边界。 第四标记类型可以位于晶片的中心，以允许液体光致抗蚀剂材料精确和均匀地施加到校准晶片。 校准晶片可以用于快速且容易地评估光刻工艺的各个阶段的精度的方法。

公开(公告)号：US09293354B2

公开(公告)日：2016-03-22

申请号：US12891738

申请日：2010-09-27

申请人： Sai Hung Lam ,  Wei Zhu ,  Chin Yu Chen

发明人： Chun Chi Chen ,  Sai Hung Lam ,  Wei Zhu ,  Chin Yu Chen

IPC分类号： G03B27/42 ,  H01L21/67 ,  G03F7/20 ,  H01L23/544

CPC分类号： H01L21/67253 ,  G03F7/70516 ,  H01L23/544 ,  H01L2223/54433 ,  H01L2924/0002 ,  H01L2924/00

摘要： A calibration wafer may bear one or more different mark types to facilitate inspection of a lithography process. A first mark type may be located on the outer peripheral portion of the wafer to indicate the desired boundary of an edge bead removal (EBR) region. A second mark type may be located on an outer peripheral portion of the wafer to indicate the desired boundary of a wafer edge expose region (WEE). A third mark type may indicate the border of a portion of the wafer expected to bear a wafer identification mark. A fourth mark type may be located at the center of the wafer to allow for precise and uniform application of liquid photoresist material to the calibration wafer. The calibration wafer may be employed in methods of rapidly and easily assessing the accuracy of various phases of photolithography processes.

摘要翻译： 校准晶片可以承载一种或多种不同的标记类型，以便于光刻工艺的检查。 第一标记类型可以位于晶片的外周部分上，以指示边缘珠去除（EBR）区域的期望边界。 第二标记类型可以位于晶片的外周部分上，以指示晶片边缘曝光区域（WEE）的期望边界。 第三标记类型可以指示期望承载晶片识别标记的晶片的一部分的边界。 第四标记类型可以位于晶片的中心，以允许液体光致抗蚀剂材料精确和均匀地施加到校准晶片。 校准晶片可以用于快速且容易地评估光刻工艺的各个阶段的精度的方法。

公开(公告)号：US08444428B2

公开(公告)日：2013-05-21

申请号：US13302269

申请日：2011-11-22

申请人： Chin Yu Chen

发明人： Chin Yu Chen

IPC分类号： H01R13/62

CPC分类号： H01R12/721 ,  H01R12/7029

摘要： A card-edge connector is provided for securing and electrically connecting an electronic card to a circuit board. The card-edge connector includes an insulating housing a pair of arms, and a pair of card-latching members. The insulating housing includes a receiving wall defining a slot there within. Each arm extends from ends of the receiving wall. A supporting base is disposed on and extending along a first side of each arm, and a guiding rail disposed on a second side of each arm. Furthermore, a fastener receiving passageway is disposed on each of an upper surface and a lower surface of each of the pair of arms.

摘要翻译： 提供了一种卡缘连接器，用于将电子卡固定和电连接到电路板。 卡缘连接器包括绝缘壳体，一对臂和一对卡锁定构件。 绝缘壳体包括在其内限定槽的接收壁。 每个臂从接收壁的端部延伸。 支撑基座设置在每个臂的第一侧并且沿着每个臂的第一侧延伸，以及设置在每个臂的第二侧上的导轨。 此外，一对紧固件接收通道设置在每对臂的上表面和下表面中的每一个上。

公开(公告)号：US20120129377A1

公开(公告)日：2012-05-24

申请号：US13302269

申请日：2011-11-22

申请人： Chin Yu Chen

发明人： Chin Yu Chen

IPC分类号： H01R13/62

CPC分类号： H01R12/721 ,  H01R12/7029

摘要： A card-edge connector is provided for securing and electrically connecting an electronic card to a circuit board. The card-edge connector includes an insulating housing a pair of arms, and a pair of card-latching members. The insulating housing includes a receiving wall defining a slot there within. Each arm extends from ends of the receiving wall. A supporting base is disposed on and extending along a first side of each arm, and a guiding rail disposed on a second side of each arm. Furthermore, a fastener receiving passageway is disposed on each of an upper surface and a lower surface of each of the pair of arms.

摘要翻译： 提供了一种卡缘连接器，用于将电子卡固定和电连接到电路板。 卡缘连接器包括绝缘壳体，一对臂和一对卡锁定构件。 绝缘壳体包括在其内限定槽的接收壁。 每个臂从接收壁的端部延伸。 支撑基座设置在每个臂的第一侧并且沿着每个臂的第一侧延伸，以及设置在每个臂的第二侧上的导轨。 此外，一对紧固件接收通道设置在每对臂的上表面和下表面中的每一个上。

公开(公告)号：US20080106708A1

公开(公告)日：2008-05-08

申请号：US11512662

申请日：2006-08-29

申请人： Chin Yu Chen ,  Hsu Sheng Chang ,  Sai Hung Lam ,  Zheng Long Tang

发明人： Chin Yu Chen ,  Hsu Sheng Chang ,  Sai Hung Lam ,  Zheng Long Tang

IPC分类号： G03B27/42 ,  G03C5/00

CPC分类号： G03B27/42 ,  G03F7/70908

摘要： A method and apparatus to eliminate contaminants in a lithography process for fabrication of integrated circuit devices. The method includes depositing a photoresist material on surface of a semiconductor substrate. A purge gas flow is provided proximate to an optical element to prevent a vapor from the exposed photoresist material from coming into contact with the optical element. In one embodiment, the purge gas flows into a perforated and open ended enclosure in which the optical element is provided in the form of a lens. One open end of the enclosure is coupled to the lens and the other open end is positioned above the surface of the semiconductor substrate. Perforation of the enclosure facilitates movement of purge gas thereto, eliminating contact with the vapor from the developed resist and unwanted deposition of a solid contamination on the lens.

摘要翻译： 一种消除用于制造集成电路器件的光刻工艺中的污染物的方法和装置。 该方法包括在半导体衬底的表面上沉积光致抗蚀剂材料。 在光学元件附近提供净化气流，以防止暴露的光致抗蚀剂材料的蒸汽与光学元件接触。 在一个实施例中，吹扫气体流入穿孔和开放式封闭体，其中以透镜的形式提供光学元件。 外壳的一个开口端连接到透镜，另一个开口端位于半导体衬底的表面上方。 外壳的穿孔有利于清洗气体向其移动，消除了与显影抗蚀剂的蒸汽的接触以及透镜上不必要的固体污染物的沉积。

公开(公告)号：US07701549B2

公开(公告)日：2010-04-20

申请号：US11512662

申请日：2006-08-29

申请人： Chin Yu Chen ,  Hsu Sheng Chang ,  Sai Hung Lam ,  Zheng Long Tang

发明人： Chin Yu Chen ,  Hsu Sheng Chang ,  Sai Hung Lam ,  Zheng Long Tang

IPC分类号： G03B27/52

CPC分类号： G03B27/42 ,  G03F7/70908

摘要： A method and apparatus to eliminate contaminants in a lithography process for fabrication of integrated circuit devices. The method includes depositing a photoresist material on surface of a semiconductor substrate. A purge gas flow is provided proximate to an optical element to prevent a vapor from the exposed photoresist material from coming into contact with the optical element. In one embodiment, the purge gas flows into a perforated and open ended enclosure in which the optical element is provided in the form of a lens. One open end of the enclosure is coupled to the lens and the other open end is positioned above the surface of the semiconductor substrate. Perforation of the enclosure facilitates movement of purge gas thereto, eliminating contact with the vapor from the developed resist and unwanted deposition of a solid contamination on the lens.

摘要翻译： 一种消除用于制造集成电路器件的光刻工艺中的污染物的方法和装置。 该方法包括在半导体衬底的表面上沉积光致抗蚀剂材料。 在光学元件附近提供净化气流，以防止暴露的光致抗蚀剂材料的蒸汽与光学元件接触。 在一个实施例中，吹扫气体流入穿孔和开放式封闭体，其中以透镜的形式提供光学元件。 外壳的一个开口端连接到透镜，另一个开口端位于半导体衬底的表面上方。 外壳的穿孔有利于清洗气体向其移动，消除了与显影抗蚀剂的蒸汽的接触以及透镜上不必要的固体污染物的沉积。