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公开(公告)号：US08354598B2
公开(公告)日：2013-01-15
申请号：US12731480
申请日：2010-03-25
Applicant: Chin-Ming Liu
Inventor： Chin-Ming Liu
IPC: H05K1/03
CPC classification number: H05K13/00 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2924/00014 , H01L2924/15174 , H01L2924/15311 , H05K3/0097 , H05K3/4682 , H05K2203/0152 , H05K2203/1536 , Y10T156/10 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
Abstract: A method for fabricating a packaging substrate includes: stacking two metal layers; encapsulating the two metal layers with assistant dielectric layers; forming built-up structures on the assistant dielectric layers, respectively; and separating the built-up structures along the interface between the two metal layers so as to form two packaging substrates. Owing to the adhesive characteristic of the assistant dielectric layers, the two metal layers are unlikely to separate from each other during formation of the built-up structures. But after portions of the dielectric layer around the periphery of the metal layers are cut and removed, the two metal layers can be readily separated from each other. The two metal layers can be patterned to form wiring layers, metal bumps, or supporting structures to avoid waste of materials. A packaging substrate and a fabrication method thereof are provided.
Abstract translation: 一种用于制造封装衬底的方法包括：堆叠两个金属层; 用辅助电介质层封装两个金属层; 分别在辅助电介质层上形成堆积结构; 并且沿着两个金属层之间的界面分离堆积结构，以形成两个封装基板。 由于辅助电介质层的粘合特性，在形成构造结构期间，两个金属层不可能彼此分离。 但是，在金属层周围的电介质层的部分被切割和去除之后，两个金属层可以容易地彼此分离。 可以将两个金属层图案化以形成布线层，金属凸块或支撑结构，以避免材料浪费。 提供了一种封装基板及其制造方法。
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公开(公告)号：US08168513B2
公开(公告)日：2012-05-01
申请号：US12780439
申请日：2010-05-14
Applicant: Chin-Ming Liu
Inventor： Chin-Ming Liu
IPC: H01L21/336
CPC classification number: H01L21/6835 , H01L21/4857
Abstract: A method for fabricating a packaging substrate includes: providing a base having a release film with two opposite surfaces, two first auxiliary dielectric layers enclosing the release film, and two metal layers disposed on the two first auxiliary dielectric layers, therewith an effective area defined on the two metal layers; forming an inner wiring layer from the two metal layers; forming on each of the two first auxiliary dielectric layers and the inner wiring layers a built-up structure having first conductive pads so as for two initial substrates to be formed on the opposite surfaces of the release film; removing whatever is otherwise lying outside the effective area; removing the release film; and forming dielectric layer openings in the two first auxiliary dielectric layers so as for two substrate bodies to be formed from the initial substrates, wherein a portion of the inner wiring layers are exposed to thereby function as second conductive pads.
Abstract translation: 一种用于制造封装衬底的方法，包括：提供具有两个相对表面的剥离膜的基底，包围隔离膜的两个第一辅助电介质层和设置在两个第一辅助介电层上的两个金属层，其中限定在 两层金属层; 从所述两个金属层形成内部布线层; 在两个第一辅助介电层和内部布线层中的每一个上形成具有第一导电焊盘的组合结构，以便形成在剥离膜的相对表面上的两个初始基板; 除去在有效区域之外的任何东西; 去除脱模膜; 以及在两个第一辅助电介质层中形成电介质层开口，以便由初始衬底形成两个衬底体，其中一部分内部配线层被暴露，从而起第二导电焊盘的作用。
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公开(公告)号：US20100319966A1
公开(公告)日：2010-12-23
申请号：US12731480
申请日：2010-03-25
Applicant: Chin-Ming Liu
Inventor： Chin-Ming Liu
CPC classification number: H05K13/00 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2924/00014 , H01L2924/15174 , H01L2924/15311 , H05K3/0097 , H05K3/4682 , H05K2203/0152 , H05K2203/1536 , Y10T156/10 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
Abstract: A method for fabricating a packaging substrate includes: stacking two metal layers; encapsulating the two metal layers with assistant dielectric layers; forming built-up structures on the assistant dielectric layers, respectively; and separating the built-up structures along the interface between the two metal layers so as to form two packaging substrates. Owing to the adhesive characteristic of the assistant dielectric layers, the two metal layers are unlikely to separate from each other during formation of the built-up structures. But after portions of the dielectric layer around the periphery of the metal layers are cut and removed, the two metal layers can be readily separated from each other. The two metal layers can be patterned to form wiring layers, metal bumps, or supporting structures to avoid waste of materials. A packaging substrate and a fabrication method thereof are provided.
Abstract translation: 一种用于制造封装衬底的方法包括：堆叠两个金属层; 用辅助电介质层封装两个金属层; 分别在辅助电介质层上形成堆积结构; 并且沿着两个金属层之间的界面分离堆积结构，以形成两个封装基板。 由于辅助电介质层的粘合特性，在形成构造结构期间，两个金属层不可能彼此分离。 但是，在金属层周围的电介质层的部分被切割和去除之后，两个金属层可以容易地彼此分离。 可以将两个金属层图案化以形成布线层，金属凸块或支撑结构，以避免材料浪费。 提供了一种封装基板及其制造方法。
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公开(公告)号：US20100314037A1
公开(公告)日：2010-12-16
申请号：US12780439
申请日：2010-05-14
Applicant: Chin-Ming Liu
Inventor： Chin-Ming Liu
CPC classification number: H01L21/6835 , H01L21/4857
Abstract: A method for fabricating a packaging substrate includes: providing a base having a release film with two opposite surfaces, two first auxiliary dielectric layers enclosing the release film, and two metal layers disposed on the two first auxiliary dielectric layers, therewith an effective area defined on the two metal layers; forming an inner wiring layer from the two metal layers; forming on each of the two first auxiliary dielectric layers and the inner wiring layers a built-up structure having first conductive pads so as for two initial substrates to be formed on the opposite surfaces of the release film; removing whatever is otherwise lying outside the effective area; removing the release film; and forming dielectric layer openings in the two first auxiliary dielectric layers so as for two substrate bodies to be formed from the initial substrates, wherein a portion of the inner wiring layers are exposed to thereby function as second conductive pads.
Abstract translation: 一种用于制造封装衬底的方法，包括：提供具有两个相对表面的剥离膜的基底，包围隔离膜的两个第一辅助电介质层和设置在两个第一辅助介电层上的两个金属层，其中限定在 两层金属层; 从所述两个金属层形成内部布线层; 在两个第一辅助介电层和内部布线层中的每一个上形成具有第一导电焊盘的组合结构，以便形成在剥离膜的相对表面上的两个初始基板; 除去在有效区域之外的任何东西; 去除脱模膜; 以及在两个第一辅助电介质层中形成电介质层开口，以便由初始衬底形成两个衬底体，其中一部分内部配线层被暴露，从而起第二导电焊盘的作用。
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