公开(公告)号：US20070133184A1

公开(公告)日：2007-06-14

申请号：US11564955

申请日：2006-11-30

Applicant: Chin-Wei Ho

Inventor： Chin-Wei Ho

IPC: H05K7/00

CPC classification number: H05K1/115 ,  H05K3/423 ,  H05K3/4602 ,  H05K3/4617 ,  H05K2201/0394 ,  H05K2201/09627 ,  H05K2203/0733 ,  Y10T29/49165

Abstract: A printed circuit board and manufacturing method thereof is disclosed. First, a conductive layer disposed on an insulation layer is provided. The conductive layer is patterned to form at least a conductive layer opening and the insulation layer is drilled throughout to form a via at a position corresponding to the conductive layer opening. The via is then loaded with a conductive material. A plurality of substrates are formed through the steps above and are bonded to form a multi-layer printed circuit board.

Abstract translation: 公开了一种印刷电路板及其制造方法。 首先，设置在绝缘层上的导电层。 导电层被图案化以形成至少导电层开口，并且绝缘层被贯穿整个以在对应于导电层开口的位置处形成通孔。 然后通孔用导电材料加载。 通过上述步骤形成多个基板，并结合以形成多层印刷电路板。

公开(公告)号：US08897488B2

公开(公告)日：2014-11-25

申请号：US13004091

申请日：2011-01-11

Applicant: Chao-Lieh Chen ,  Chueh-Han Lo ,  Chin-Wei Ho

Inventor： Chao-Lieh Chen ,  Chueh-Han Lo ,  Chin-Wei Ho

IPC: G06K9/00 ,  G06F3/042 ,  G06F3/0488 ,  G06F3/01

CPC classification number: G06K9/00342 ,  G06F3/017 ,  G06F3/042 ,  G06F3/0488

Abstract: A body gesture control system for operating electrical and electronic devices includes an image sensor device and an image processor device to process body gesture images captured by the image sensor device for recognizing the body gesture. The image processor device includes an image calculation unit and a gesture change detection unit electrically connected therewith. The image calculation unit is used to calculate gesture regions of the captured body gesture images and the gesture change detection unit is operated to detect changes of the captured body gesture images and to thereby determine a body gesture recognition signal.

Abstract translation: 用于操作电气和电子设备的人体手势控制系统包括图像传感器设备和图像处理器设备，用于处理由图像传感器设备拍摄以识别人体姿态的身体姿势图像。 图像处理器装置包括与其电连接的图像计算单元和手势改变检测单元。 图像计算单元用于计算所捕获的身体姿势图像的手势区域，并且操作手势变化检测单元以检测所捕获的身体姿势图像的变化，从而确定身体手势识别信号。

公开(公告)号：US20110170745A1

公开(公告)日：2011-07-14

申请号：US13004091

申请日：2011-01-11

Applicant: Chao-Lieh Chen ,  Chueh-Han Lo ,  Chin-Wei Ho

Inventor： Chao-Lieh Chen ,  Chueh-Han Lo ,  Chin-Wei Ho

IPC: G06K9/00

CPC classification number: G06K9/00342 ,  G06F3/017 ,  G06F3/042 ,  G06F3/0488

Abstract: A body gesture control system for operating electrical and electronic devices includes an image sensor device and an image processor device to process body gesture images captured by the image sensor device for recognizing the body gesture. The image processor device includes an image calculation unit and a gesture change detection unit electrically connected therewith. The image calculation unit is used to calculate gesture regions of the captured body gesture images and the gesture change detection unit is operated to detect changes of the captured body gesture images and to thereby determine a body gesture recognition signal.

Abstract translation: 用于操作电气和电子设备的人体手势控制系统包括图像传感器设备和图像处理器设备，用于处理由图像传感器设备拍摄以识别人体姿态的身体姿势图像。 图像处理器装置包括与其电连接的图像计算单元和手势改变检测单元。 图像计算单元用于计算所捕获的身体姿势图像的手势区域，并且操作手势变化检测单元以检测所捕获的身体姿势图像的变化，从而确定身体手势识别信号。

公开(公告)号：US20110005071A1

公开(公告)日：2011-01-13

申请号：US12878658

申请日：2010-09-09

Applicant: Chin-Wei Ho

Inventor： Chin-Wei Ho

IPC: H05K3/10

CPC classification number: H05K1/115 ,  H05K3/423 ,  H05K3/4602 ,  H05K3/4617 ,  H05K2201/0394 ,  H05K2201/09627 ,  H05K2203/0733 ,  Y10T29/49165

Abstract: A printed circuit board and manufacturing method thereof is disclosed. First, a conductive layer disposed on an insulation layer is provided. The conductive layer is patterned to form at least a conductive layer opening and the insulation layer is drilled throughout to form a via at a position corresponding to the conductive layer opening. The via is then loaded with a conductive material. A plurality of substrates are formed through the steps above and are bonded to form a multi-layer printed circuit board.

Abstract translation: 公开了一种印刷电路板及其制造方法。 首先，设置在绝缘层上的导电层。 导电层被图案化以形成至少导电层开口，并且绝缘层被贯穿整个以在对应于导电层开口的位置处形成通孔。 然后通孔用导电材料加载。 通过上述步骤形成多个基板，并结合以形成多层印刷电路板。