PROCESS FOR PRODUCING MULTILAYER CHIP ZINC OXIDE VARISTOR CONTAINING PURE SILVER INTERNAL ELECTRODES AND FIRING AT ULTRALOW TEMPERATURE
    2.
    发明申请
    PROCESS FOR PRODUCING MULTILAYER CHIP ZINC OXIDE VARISTOR CONTAINING PURE SILVER INTERNAL ELECTRODES AND FIRING AT ULTRALOW TEMPERATURE 审中-公开
    生产含有纯银内电极的多层芯片氧化锌磁体的方法和超导温度

    公开(公告)号:US20120135563A1

    公开(公告)日:2012-05-31

    申请号:US13298458

    申请日:2011-11-17

    CPC classification number: H01C7/112 H01C7/18

    Abstract: A low-temperature firing process is available for cost saving to produce a multilayer chip ZnO varistor containing pure silver (Ag) formed as internal electrodes and calcined at ultralow firing temperature of 850-900° C., which process comprises: a) individually preparing ZnO grains in advance doped with doping ions for promotion of semi-conductivity of ZnO grains if calcined; b) individually preparing a desired high-impedance sintering material to be fired as grain boundaries to encapsulate ZnO grains; c) mixing the doped ZnO grains of Step a) with the high-impedance sintering material of Step b) in a predetermined ratio to form a mixture and proceeding with an initial sintering to have the mixture sintered and ground as composite ZnO ceramic powders, and d) processing the sintered mixture of Step c) to make multilayer chip ZnO varistors containing pure silver (Ag) internal electrodes but sintered at ultralow firing temperature of 850-900° C.

    Abstract translation: 低成本焙烧工艺可以节约成本,生产出一种含有形成内部电极的纯银(Ag)的多层芯片ZnO压敏电阻,并在850-900℃的超低烧结温度下煅烧,该方法包括:a)单独制备 预先掺杂掺杂离子的ZnO晶粒,如果煅烧,则促进ZnO晶粒的半导电性; b)单独制备待烧结的期望的高阻抗烧结材料作为晶界以包封ZnO颗粒; c)将步骤a)的掺杂ZnO晶粒与步骤b)的高阻抗烧结材料以预定比例混合,形成混合物,并进行初始烧结,将混合物烧结并研磨为复合ZnO陶瓷粉末; d)加工步骤c)的烧结混合物以制备含有纯银(Ag)内部电极但在850-900℃的超低烧结温度下烧结的多层片状ZnO压敏电阻

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