公开(公告)号：US20130126914A1

公开(公告)日：2013-05-23

申请号：US13407028

申请日：2012-02-28

申请人： Ching-Jen PAN ,  Wei-Tai CHENG ,  Ming-Hung CHEN

发明人： Ching-Jen PAN ,  Wei-Tai CHENG ,  Ming-Hung CHEN

IPC分类号： H01L27/15

CPC分类号： H01L27/156 ,  H01L33/0079 ,  H01L33/08 ,  H01L33/46 ,  H01L33/62 ,  H01L2224/16

摘要： A high-voltage alternating current (AC) light-emitting diode (LED) structure is provided. The high-voltage AC LED structure includes a circuit substrate and a plurality of high-voltage LED (HV LED) chips. Each one of the HV LED chips includes a first substrate, an adhering layer, first ohmic contact layers, epi-layers, a first insulating layer, at least two first electrically conducting plates, at least two second electrically conducting plates, and a second substrate. The HV LED chips manufactured by a wafer-level process are coupled to the low-cost circuit substrate to produce the downsized high-voltage AC LED structure.

摘要翻译： 提供了高压交流（AC）发光二极管（LED）结构。 高压AC LED结构包括电路基板和多个高压LED（HV LED）芯片。 每个HV LED芯片包括第一基板，粘合层，第一欧姆接触层，外延层，第一绝缘层，至少两个第一导电板，至少两个第二导电板和第二基板 。 通过晶片级工艺制造的HV LED芯片耦合到低成本电路基板以产生小型化的高压AC LED结构。

公开(公告)号：US20130127352A1

公开(公告)日：2013-05-23

申请号：US13407398

申请日：2012-02-28

申请人： Ching-Jen PAN ,  Wei-Tai CHENG ,  Ming-Hung CHEN

发明人： Ching-Jen PAN ,  Wei-Tai CHENG ,  Ming-Hung CHEN

IPC分类号： H05B37/00

CPC分类号： H01L25/0753 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present invention provides a high-voltage alternating current light-emitting diode (AC LED) structure. The high-voltage AC LED structure includes a circuit substrate and a plurality of AC LED chips. The AC LED chips each include an insulated substrate, an LED set, a first metal layer and a second metal layer. The AC LED chips manufactured by a wafer level process are coupled to the low-cost circuit substrate to produce the downsized high-voltage AC LED structure.

摘要翻译： 本发明提供一种高压交流发光二极管（AC LED）结构。 高压AC LED结构包括电路基板和多个AC LED芯片。 AC LED芯片各自包括绝缘基板，LED组，第一金属层和第二金属层。 通过晶片级工艺制造的AC LED芯片耦合到低成本电路基板，以产生小型化的高压AC LED结构。

公开(公告)号：US20130134447A1

公开(公告)日：2013-05-30

申请号：US13343844

申请日：2012-01-05

申请人： Ching-Jen PAN ,  Ming-Hung Chen

发明人： Ching-Jen PAN ,  Ming-Hung Chen

IPC分类号： H01L33/58

CPC分类号： A45D29/00 ,  A45D2200/205 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2924/00

摘要： A low-light-emitting-angle high-luminance ultraviolet (UV) light-emitting diode (LED) nail lamp structure and an LED light source module thereof are provided. The UV LED nail lamp structure includes a housing and an LED light source module. The LED light source module is provided in the housing and has a plurality of UV LEDs, wherein the light-emitting angle of each UV LED ranges between 25° and 80°. The UV LED nail lamp structure features high luminance and enhanced lighting effect.

摘要翻译： 提供了低发光角度高亮度紫外（UV）发光二极管（LED）指甲灯结构及其LED光源模块。 UV LED指甲灯结构包括壳体和LED光源模块。 LED光源模块设置在壳体中并且具有多个UV LED，其中每个UV LED的发光角度在25°和80°之间。 UV LED指甲灯结构具有高亮度和增强的照明效果。

公开(公告)号：US20130109001A1

公开(公告)日：2013-05-02

申请号：US13314352

申请日：2011-12-08

申请人： Ching-Jen PAN ,  Cheng-Wei Chan ,  Ming-Hung Chen

发明人： Ching-Jen PAN ,  Cheng-Wei Chan ,  Ming-Hung Chen

IPC分类号： F26B3/34

CPC分类号： F26B19/00 ,  A45D29/00 ,  A45D2200/205

摘要： A high-luminance ultraviolet (UV) light-emitting diode (LED) nail lamp structure and an LED light source module thereof are provided. The LED nail lamp structure includes a housing and an LED light source module. The LED light source module is provided in the housing and has a plurality of UV LEDs, wherein each UV LED has an LED chip disposed in a concave lamp cup. The LED nail lamp structure features high luminance and good lighting effect.

摘要翻译： 提供了高亮度紫外（UV）发光二极管（LED）指甲灯结构及其LED光源模块。 LED指甲灯结构包括壳体和LED光源模块。 LED光源模块设置在壳体中并具有多个UV LED，其中每个UV LED具有设置在凹灯杯中的LED芯片。 LED指甲灯结构具有高亮度和良好的照明效果。