摘要:
The invention provides a modular network sensor assembly operable to sense environmental conditions at a computer or equipment rack. The network sensor assembly includes a flexible body operable to be folded along a central fold line. The central fold line separates the flexible body into a first panel and second panel. A number of mounting tabs are hingedly attached to either the first panel or second panel. These mounting tabs are operable to secure the network assembly to the computer rack. A number of sensor tabs are located along the central fold line. Addressable sensors capable of sensing environmental conditions are positioned proximate to the sensor tabs, and communicatively coupled to a common bus. A memory device is also communicatively coupled to the common bus and is operable to store configuration information and data associated with the sensed environmental conditions sampled by the addressable sensors.
摘要:
In a network sensor assembly, network environmental monitor, and associated fabrication methods, a network sensor assembly comprises a panel configured for mounting on a surface, a plurality of addressable sensors coupled to the panel that sense environmental conditions at the surface, a memory device that stores configuration information associated with the plurality of addressable sensors, and a bus. The bus is communicatively coupled to the plurality of addressable sensors and the memory device and is configured for communicatively coupling the network sensor assembly to a network node for communicating data associated with the sensed environmental conditions in a network.
摘要:
In a network sensor assembly, network environmental monitor, and associated fabrication methods, a network sensor assembly comprises a panel configured for mounting on a surface, a plurality of addressable sensors coupled to the panel that sense environmental conditions at the surface, a memory device that stores configuration information associated with the plurality of addressable sensors, and a bus. The bus is communicatively coupled to the plurality of addressable sensors and the memory device and is configured for communicatively coupling the network sensor assembly to a network node for communicating data associated with the sensed environmental conditions in a network.
摘要:
Systems, methods, and media associated with a rack-mountable device are described. One exemplary system embodiment includes a display having a corner to diagonally opposite corner dimension of at least seventeen inches, a pointing apparatus having at least three buttons, a communication access port positioned on the front of the device, and an identification light positioned on the front of the device. In one example, the device will fold open and shut. In one example, the device will fit into a 1 U (1.75 inch) rack space when the device is folded shut and will have a QWERTY keyboard having a horizontal dimension of at least fourteen inches.
摘要:
A notebook computer base housing has operatively disposed therein a CD ROM drive, a hard disk drive and a floppy disk drive, an AC/DC electrical power converter, a modem, a PCMCIA card bay structure and a battery. This internal provision of three drive units in addition to the other equipment within the base housing is facilitated from a space standpoint by the vertical stacking of the hard disk drive atop the CD ROM drive within the base housing. To dissipate the operating heat from these components within the base housing, a heat spreader plate is interposed between the CD ROM drive and the overlying hard disk drive, and the high heat-generating components—namely, the modem, the AC/DC converter, the PCMCIA card bay structure, and the computer processor—are closely grouped together, with the AC/DC converter in thermal communication with a second heat spreader plate. The processor is disposed above the other high heat-generating components on a horizontally oriented main system circuit board. with the circuit board having top and bottom side heat sink members thermally communicated with the processor. An axial fan disposed in the base housing creates an upper flow of cooling air that passes over the upper heat sink member, and a lower flow of cooling air that passes over the lower heat sink member and the heat-generating components grouped below the processor.
摘要:
A notebook computer base housing has operatively disposed therein a CD ROM drive, a hard disk drive and a floppy disk drive, an AC/DC electrical power converter, a modem, a PCMCIA card bay structure and a battery. This internal provision of three drive units in addition to the other equipment within the base housing is facilitated from a space standpoint by the vertical stacking of the hard disk drive atop the CD ROM drive within the base housing. To dissipate the operating heat from these components within the base housing, a heat spreader plate is interposed between the CD ROM drive and the overlying hard disk drive, and the high heat-generating components--namely, the modem, the AC/DC converter, the PCMCIA card bay structure, and the computer processor--are closely grouped together, with the AC/DC converter in thermal communication with a second heat spreader plate. The processor is disposed above the other high heat-generating components on a horizontally oriented main system circuit board, with the circuit board having top and bottom side heat sink members thermally communicated with the processor. An axial fan disposed in the base housing creates an upper flow of cooling air that passes over the upper heat sink member, and a lower flow of cooling air that passes over the lower heat sink member and the heat-generating components grouped below the processor.
摘要:
Determining power topology of a computer system. At least some of the illustrative embodiments are methods including communicating with a first computer system of a plurality of computer systems mounted in a rack (the communicating through dedicated communication conductors integral with a first cord carrying operational power to first computer system), communicating with a second computer system of the plurality of computer systems (the communicating through dedicated communication conductors integral with a second cord carrying operational power to first computer system), determining a power topology regarding the plurality of computer systems based on the communicating, and displaying an indication of the power topology.
摘要:
Determining power topology of a computer system. At least some of the illustrative embodiments are methods including communicating with a first computer system of a plurality of computer systems mounted in a rack (the communicating through dedicated communication conductors integral with a first cord carrying operational power to first computer system), communicating with a second computer system of the plurality of computer systems (the communicating through dedicated communication conductors integral with a second cord carrying operational power to first computer system), determining a power topology regarding the plurality of computer systems based on the communicating, and displaying an indication of the power topology.
摘要:
A notebook computer base housing has operatively disposed therein a CD ROM drive, a hard disk drive and a floppy disk drive, an AC/DC electrical power converter, a modem, a PCMCIA card bay structure and a battery. This internal provision of three drive units in addition to the other equipment within the base housing is facilitated from a space standpoint by the vertical stacking of the hard disk drive atop the CD ROM drive within the base housing. To dissipate the operating heat from these components within the base housing, a heat spreader plate is interposed between the CD ROM drive and the overlying hard disk drive, and the high heat-generating components—namely, the modem, the AC/DC converter, the PCMCIA card bay structure, and the computer processor—are closely grouped together, with the AC/DC converter in thermal communication with a second heat spreader plate. The processor is disposed above the other high heat-generating components on a horizontally oriented main system circuit board with the circuit board having top and bottom side heat sink members thermally communicated with the processor. An axial fan disposed in the base housing creates an upper flow of cooling air that passes over the upper heat sink member, and a lower flow of-cooling air that passes over the lower heat sink member and the heat-generating components grouped below the processor.