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公开(公告)号：US20100272982A1
公开(公告)日：2010-10-28
申请号：US12582237
申请日：2009-10-20
CPC分类号： C23C4/02 , C23C4/10 , C23C4/11 , H01J37/32477 , Y10T428/249953 , Y10T428/31678
摘要： This invention relates to thermal spray coatings on a metal or non-metal substrate. The thermal spray coating comprises a partially or fully stabilized ceramic coating, e.g., yttria stabilized zirconia coating, and has sufficiently high thermodynamic phase stability to provide corrosion and/or erosion resistance to the substrate. This invention also relates to methods of protecting metal and non-metal substrates by applying the thermal spray coatings. The coatings are useful, for example, in the protection of integrated circuit manufacturing equipment, internal chamber components, and electrostatic chuck manufacture.
摘要翻译： 本发明涉及金属或非金属基底上的热喷涂。 热喷涂包括部分或完全稳定的陶瓷涂层，例如氧化钇稳定的氧化锆涂层，并且具有足够高的热力学相稳定性，以提供对基材的腐蚀和/或耐冲蚀性。 本发明还涉及通过施加热喷涂涂层来保护金属和非金属基材的方法。 涂层可用于例如集成电路制造设备的保护，内部腔室部件和静电卡盘制造。
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公开(公告)号：US20120183790A1
公开(公告)日：2012-07-19
申请号：US13180748
申请日：2011-07-12
CPC分类号： C23C30/00 , C04B35/488 , C04B35/505 , C04B2235/3225 , C04B2235/3246 , C04B2235/80 , C23C4/02 , C23C4/06 , C23C4/10 , C23C4/11 , C23C24/04 , C23C28/04 , C23C28/042
摘要： This invention relates to thermal spray composite coatings on a metal or non-metal substrate. The thermal spray composite coatings comprise a ceramic composite coating having at least two ceramic material phases randomly and uniformly dispersed and/or spatially oriented throughout the ceramic composite coating. At least a first ceramic material phase is present in an amount sufficient to provide corrosion resistance to the ceramic composite coating, and at least a second ceramic material phase is present in an amount sufficient to provide plasma erosion resistance to the ceramic composite coating. This invention also relates to methods of protecting metal and non-metal substrates by applying the thermal spray coatings. The composite coatings provide erosion and corrosion resistance at processing temperatures higher than conventional processing temperatures used in the semiconductor etch industry, e.g., greater than 100° C. The coatings are useful, for example, in the protection of semiconductor manufacturing equipment, e.g., integrated circuit, light emitting diode, display, and photovoltaic, internal chamber components, and electrostatic chuck manufacture.
摘要翻译： 本发明涉及金属或非金属基底上的热喷涂复合涂层。 热喷涂复合涂层包括具有至少两个陶瓷材料相的陶瓷复合涂层，其随机均匀分散和/或空间取向贯穿整个陶瓷复合涂层。 至少第一陶瓷材料相以足以提供对陶瓷复合涂层的耐腐蚀性的量存在，并且至少第二陶瓷材料相以足以提供对陶瓷复合涂层的耐等离子体侵蚀性的量存在。 本发明还涉及通过施加热喷涂涂层来保护金属和非金属基材的方法。 复合涂层在高于半导体蚀刻工业中使用的常规加工温度的处理温度下提供耐腐蚀和耐蚀性，例如大于100℃。涂层可用于例如半导体制造设备的保护，例如集成 电路，发光二极管，显示器和光伏，内部腔室部件和静电卡盘制造。
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公开(公告)号：US20120196139A1
公开(公告)日：2012-08-02
申请号：US13180904
申请日：2011-07-12
CPC分类号： C23C30/00 , C04B35/488 , C04B35/505 , C04B2235/3225 , C04B2235/3246 , C04B2235/80 , C23C4/02 , C23C4/06 , C23C4/10 , C23C4/11 , C23C24/04 , C23C28/04 , C23C28/042
摘要： This invention relates to thermal spray composite coatings on a metal or non-metal substrate. The thermal spray composite coatings comprise (i) a ceramic composite coating undercoat layer having at least two ceramic material phases randomly and uniformly dispersed and/or spatially oriented throughout the ceramic composite coating, and (ii) a ceramic coating topcoat layer applied to the undercoat layer. At least a first ceramic material phase is present in the undercoat layer in an amount sufficient to provide corrosion resistance to the ceramic composite coating, and at least a second ceramic material phase is present in the undercoat layer in an amount sufficient to provide plasma erosion resistance to the ceramic composite coating. This invention also relates to methods of protecting metal and non-metal substrates by applying the thermal spray coatings. The composite coatings provide erosion and corrosion resistance at processing temperatures higher than conventional processing temperatures used in the semiconductor etch industry, e.g., greater than 100° C. The coatings are useful, for example, in the protection of semiconductor manufacturing equipment, e.g., integrated circuit, light emitting diode, display, and photovoltaic, internal chamber components, and electrostatic chuck manufacture.
摘要翻译： 本发明涉及金属或非金属基底上的热喷涂复合涂层。 热喷涂复合涂层包括（i）具有至少两个陶瓷材料相的陶瓷复合涂层底涂层，其随机均匀分散和/或空间取向于整个陶瓷复合涂层，以及（ii）涂覆在底涂层上的陶瓷涂层顶涂层 层。 至少第一陶瓷材料相以足以提供对陶瓷复合涂层的耐腐蚀性的量存在于底涂层中，并且至少第二陶瓷材料相以足以提供耐等离子体侵蚀性的量存在于底涂层中 到陶瓷复合涂层。 本发明还涉及通过施加热喷涂涂层来保护金属和非金属基材的方法。 复合涂层在高于半导体蚀刻工业中使用的常规加工温度的处理温度下提供耐腐蚀和耐蚀性，例如大于100℃。涂层可用于例如半导体制造设备的保护，例如集成 电路，发光二极管，显示器和光伏，内部腔室部件和静电卡盘制造。
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公开(公告)号：US20120177908A1
公开(公告)日：2012-07-12
申请号：US13180592
申请日：2011-07-12
CPC分类号： C23C4/10 , C23C4/02 , C23C4/11 , C23C4/12 , C23C24/04 , C23C28/04 , C23C28/042 , Y10T428/249961
摘要： This invention relates to thermal spray coatings on a metal or non-metal substrate. The thermal spray coating comprises a ceramic coating having a functionally graded porosity across the ceramic coating thickness. The ceramic coating includes an inner layer and an outer layer. The inner layer has a porosity at or near the interface of the inner layer and the metal or non-metal substrate sufficient to provide a compliant ceramic coating capable of straining under thermal expansion mismatch between the ceramic coating and the metal or non-metal substrate at elevated temperature. The outer layer has a decreasing porosity extending from the surface of the inner layer to the surface of the ceramic coating sufficient to provide corrosion resistance and/or plasma erosion resistance to said ceramic coating. This invention also relates to methods of protecting metal and non-metal substrates by applying the thermal spray coatings. The coatings are useful, for example, in the protection of semiconductor manufacturing equipment, e.g., integrated circuit, light emitting diode, display, and photovoltaic, internal chamber components, and electrostatic chuck manufacture.
摘要翻译： 本发明涉及金属或非金属基底上的热喷涂。 热喷涂包括在陶瓷涂层厚度上具有功能梯度孔隙率的陶瓷涂层。 陶瓷涂层包括内层和外层。 内层在内层和金属或非金属基材的界面处或附近具有足够的孔隙率，足以提供能够在陶瓷涂层和金属或非金属基材之间的热膨胀失配下变形的柔性陶瓷涂层 升温 外层具有从内层的表面延伸到陶瓷涂层的表面的孔隙率降低，足以提供对所述陶瓷涂层的耐腐蚀性和/或耐等离子体侵蚀性。 本发明还涉及通过施加热喷涂涂层来保护金属和非金属基材的方法。 涂层可用于例如半导体制造设备的保护，例如集成电路，发光二极管，显示器和光伏，内部腔室部件和静电卡盘制造。
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