公开(公告)号：US20120299177A1

公开(公告)日：2012-11-29

申请号：US13242359

申请日：2011-09-23

申请人： Chun Chieh Chao ,  Chun Hung Lu

发明人： Chun Chieh Chao ,  Chun Hung Lu

IPC分类号： H01L23/48 ,  H01L21/60

CPC分类号： H01L21/486 ,  H01L23/147 ,  H01L23/481 ,  H01L23/49827 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L2224/02372 ,  H01L2224/05569 ,  H01L2224/0557 ,  H01L2224/06181 ,  H01L2924/00014 ,  H01L2224/05552

摘要： A semiconductor component structure is provided, which includes a body formed with openings, an insulating layer formed on surfaces of the body and the openings, conductive bumps formed in the openings, and a re-distributed circuit formed by conductive traces electrically connecting the conductive bumps, wherein the conductive traces are formed on a portion of the insulating layer on the body. As the conductive traces and the conductive bumps are formed on and in the body prior to the formation of the re-distributed circuit. The process for fabricating the semiconductor component structure is simplified and the reliability of the semiconductor component structure is enhanced. A method for fabricating the semiconductor component is also provided.

摘要翻译： 提供一种半导体部件结构，其包括形成有开口的主体，形成在主体和开口的表面上的绝缘层，形成在开口中的导电凸起，以及由导电迹线形成的再分布电路，该导电迹线电连接导电凸块 其中导电迹线形成在主体上的绝缘层的一部分上。 由于导电迹线和导电凸起形成在重新分布电路形成之前和之中。 简化了半导体元件结构的制造工艺，提高了半导体元件结构的可靠性。 还提供了制造半导体部件的方法。