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公开(公告)号：US20240126177A1
公开(公告)日：2024-04-18
申请号：US18395774
申请日：2023-12-26
IPC分类号： G03F7/00
CPC分类号： G03F7/70291 , G03F7/70025 , G03F7/70275
摘要： An exposure device and method for semiconductor manufacturing, focusing on the creation of exposure patterns with High Dynamic Range (HDR) capabilities, is disclosed. The exposure device includes a laser source, a first spatial light modulator (SLM), specifically a Liquid Crystal on Silicon (LCOS) device, and a second SLM, specifically a Digital Micromirror Device (DMD). The LCOS is positioned upstream in the optical path and is optimized for modulating the phase of the laser. It also directs the laser light towards specific areas on the DMD, crucial for enhancing detail and contrast in exposure patterns. The DMD, placed downstream, is composed of micromirrors that modulate the amplitude of the reflected laser, essential for achieving HDR in exposure patterns. This cooperative interaction between the LCOS and DMD allows for the creation of exposure patterns with a wide range of light intensities, from very bright to very dark, thereby achieving high dynamic range.
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公开(公告)号：US20230133808A1
公开(公告)日：2023-05-04
申请号：US17979791
申请日：2022-11-03
摘要： The present disclosure provides a laser cutting method comprising steps of: (a) emitting a laser light to a spatial light modulator that has a plurality of pixels; (b) the laser light modulated by the spatial light modulator being irradiated on an uncut object, which is to be cut, for forming a focal point and cutting the uncut object; (c) measuring a cutting depth of the object; (d) the spatial light modulator converting a phase of each of the laser light modulated by each of the pixels to change a light pattern distribution at the focal point when the cutting depth of the object reaches a first predetermined depth; and (e) repeating the step (b) to the step (d) until the cutting depth of the object reaches a second predetermined depth; wherein the first predetermined depth is varied when the step (b) to the step (d) are repeated.
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公开(公告)号：US20230141790A1
公开(公告)日：2023-05-11
申请号：US17979795
申请日：2022-11-03
CPC分类号： B08B7/0042 , B08B7/04 , B08B13/00 , H01L21/67028
摘要： A method for cleaning semiconductor process equipment and a system thereof are provided. The method is adapted to apply to an object with at least one pollutant thereon and includes steps of providing multi-channel optical tweezers to irradiate the pollutant and locations where the pollutant is neighbor to, in order to let the optical tweezers generate a resultant force to the pollutant; and providing an airflow to the object. The resultant force is greater than a maximum static friction between the pollutant and the object so as to remove the pollutant.
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公开(公告)号：US20240118608A1
公开(公告)日：2024-04-11
申请号：US18375984
申请日：2023-10-02
IPC分类号： G03F1/82
CPC分类号： G03F1/82
摘要： The present disclosure pertains to a photomask cleaning device suitable for cleaning a photomask. The interior of the photomask cleaning device is equipped with a cleaning area and a photomask flipping area. The photomask has a first surface and a second surface, with a pattern and a photomask protective film set on the first surface. The photomask protective film covers the pattern. The photomask cleaning device includes a photomask flipping mechanism, a transport mechanism, and at least one cleaning mechanism. The photomask flipping mechanism is located within the photomask flipping area and is configured to flip the photomask. Additionally, the transport mechanism is used to transport the photomask, enabling the photomask to move between the photomask flipping area and the cleaning area. The cleaning mechanism is located within the cleaning area and is used to clean the photomask.
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公开(公告)号：US11860545B2
公开(公告)日：2024-01-02
申请号：US17979794
申请日：2022-11-03
IPC分类号： G03F7/00
CPC分类号： G03F7/70191 , G03F7/70025
摘要： An exposure device includes a laser source, a first spatial light modulator, a second spatial light modulator and a controller. The laser source is provided for emitting a laser. The first spatial light modulator is irradiated by the laser and used for modulating the phase of the laser irradiated on the first spatial light modulator before reflecting the laser. The second spatial light modulator is irradiated by the laser reflected from the first spatial light modulator and used for modulating the amplitude of the laser irradiated on the second spatial light modulator before reflecting the laser. The laser reflected by the second spatial light modulator is irradiated on a photoresist layer to form an exposure pattern.
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公开(公告)号：US20230137963A1
公开(公告)日：2023-05-04
申请号：US17979794
申请日：2022-11-03
IPC分类号： G03F7/20
摘要： An exposure device includes a laser source, a first spatial light modulator, a second spatial light modulator and a controller. The laser source is provided for emitting a laser. The first spatial light modulator is irradiated by the laser and used for modulating the phase of the laser irradiated on the first spatial light modulator before reflecting the laser. The second spatial light modulator is irradiated by the laser reflected from the first spatial light modulator and used for modulating the amplitude of the laser irradiated on the second spatial light modulator before reflecting the laser. The laser reflected by the second spatial light modulator is irradiated on a photoresist layer to form an exposure pattern.
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