摘要:
A wireless communications device includes an antenna, a multi-port path selection structure having an antenna port connected to the antenna, and plural ports connected to respective one or more receive and transmit paths of the wireless communications device. The multi-port path selection structure has a transmit band reject filter connected to the transmit path and a second filter connected to the receive path.
摘要:
A wireless communications device includes an antenna, a multi-port path selection structure having an antenna port connected to the antenna, and plural ports connected to respective one or more receive and transmit paths of the wireless communications device. The multi-port path selection structure has a transmit band reject filter connected to the transmit path and a second filter connected to the receive path.
摘要:
A wireless communications device includes an antenna, a multi-port path selection structure having an antenna port connected to the antenna, and plural ports connected to respective one or more receive and transmit paths of the wireless communications device. The multi-port path selection structure has a transmit band reject filter connected to the transmit path and a second filter connected to the receive path.
摘要:
A filter package is provided with a support structure, a filter device having terminals, impedance matching circuits formed on the support structure and electrically connected to at least some of the terminals of the filter device, and at least one electrical ground structure electrically connected to the impedance matching circuits. Moreover, the filter package has an outer housing to contain the support structure, filter device, impedance matching circuits, and at least one ground structure.
摘要:
A filter package is provided with a support structure, a filter device having terminals, impedance matching circuits formed on the support structure and electrically connected to at least some of the terminals of the filter device, and at least one electrical ground structure electrically connected to the impedance matching circuits. Moreover, the filter package has an outer housing to contain the support structure, filter device impedance matching circuits, and at least one ground structure.
摘要:
A filter package is provided with a support structure, a filter device having terminals, impedance matching circuits formed on the support structure and electrically connected to at least some of the terminals of the filter device, and at least one electrical ground structure electrically connected to the impedance matching circuits. Moreover, the filter package has an outer housing to contain the support structure, filter device impedance matching circuits, and at least one ground structure.
摘要:
A filter package is provided with a support structure, a filter device having terminals, impedance matching circuits formed on the support structure and electrically connected to at least some of the terminals of the filter device, and at least one electrical ground structure electrically connected to the impedance matching circuits. Moreover, the filter package has an outer housing to contain the support structure, filter device, impedance matching circuits, and at least one ground structure.
摘要:
A filter package is provided with a support structure, a filter device having terminals, impedance matching circuits formed on the support structure and electrically connected to at least some of the terminals of the filter device, and at least one electrical ground structure electrically connected to the impedance matching circuits. Moreover, the filter package has an outer housing to contain the support structure, filter device, impedance matching circuits, and at least one ground structure.
摘要:
A filter package is provided with a support structure, a filter device having terminals, impedance matching circuits formed on the support structure and electrically connected to at least some of the terminals of the filter device, and at least one electrical ground structure electrically connected to the impedance matching circuits. Moreover, the filter package has an outer housing to contain the support structure, filter device, impedance matching circuits, and at least one ground structure.
摘要:
Band reject filters are disclosed. A band reject filter includes a first acoustic resonator and a second acoustic resonator, each of which has either shunt resonators adapted to resonate substantially at respective resonance frequencies defining a rejection frequency band or series resonators adapted to anti-resonate substantially at respective anti-resonance frequencies defining the rejection frequency band. These resonators are connected through a phase shifter which imparts an impedance phase shift of approximately 45° to 135°. Exemplary applications of the band reject filters disclosed herein include implementation as an inter-stage band reject filter for a base station power amplifier for a wireless communication system, as a radio frequency band reject filter in a duplexer for a wireless communication terminal, and in a low noise amplifier input stage.