公开(公告)号：US09031808B2

公开(公告)日：2015-05-12

申请号：US13423215

申请日：2012-03-17

申请人： Shih-Feng Huang ,  Yueh-Cheng Lee ,  Chung-Er Huang

发明人： Shih-Feng Huang ,  Yueh-Cheng Lee ,  Chung-Er Huang

IPC分类号： G01R31/28

CPC分类号： G01R31/2822 ,  H04B17/20 ,  H04B17/29

摘要： This invention provides a system of testing multiple RF modules. The system includes a RF signal analyzer, a RF switch, a control module, and a plurality of testing modules. The RF switch is electrically coupled to the RF signal analyzer, and operational bands of the RF switch includes operational bands of the RF modules for transmitting and receiving RF signals. The controller module controls the RF signal analyzer and the RF switch. The testing modules are electrically coupled to the controller module and controlled by the controller module. Each testing module has a memorizing unit for storing testing results for the RF modules transmitting and receiving the RF signals. The RF switch and the testing modules are used to electrically couple each RF module.

摘要翻译： 本发明提供一种测试多个RF模块的系统。 该系统包括RF信号分析器，RF开关，控制模块和多个测试模块。 RF开关电耦合到RF信号分析器，并且RF开关的操作频带包括用于发射和接收RF信号的RF模块的操作频带。 控制器模块控制RF信号分析仪和RF开关。 测试模块电耦合到控制器模块并由控制器模块控制。 每个测试模块都有一个存储单元，用于存储RF模块发送和接收RF信号的测试结果。 RF开关和测试模块用于电耦合每个RF模块。

公开(公告)号：US20120211876A1

公开(公告)日：2012-08-23

申请号：US13092938

申请日：2011-04-23

申请人： CHUNG-ER HUANG ,  Yueh-Cheng Lee

发明人： CHUNG-ER HUANG ,  Yueh-Cheng Lee

IPC分类号： H01L23/552

CPC分类号： H01L23/552 ,  H01L23/3121 ,  H01L23/66 ,  H01L2924/0002 ,  H01L2924/00

摘要： A module IC package structure includes a substrate unit, a radio frequency unit, an inner shielding unit, an insulative package unit, and an outer shielding unit. The substrate unit includes a circuit substrate. The radio frequency unit includes at least one radio frequency element disposed on and electrically connected to the circuit substrate. The inner shielding unit includes an inner metal shielding layer formed on a predetermined surface of the radio frequency element. The insulative package unit includes an insulative package resin body disposed on the circuit substrate to cover the radio frequency element. The outer shielding unit is formed on the outer surface of the insulative package resin body and electrically connected to the circuit substrate. The inner metal shielding layer is a radio frequency property maintaining layer disposed between the radio frequency element and one part of the outer shielding unit for shielding the radio frequency element.

摘要翻译： 模块IC封装结构包括基板单元，射频单元，内屏蔽单元，绝缘封装单元和外屏蔽单元。 基板单元包括电路基板。 射频单元包括设置在电路基板上并与其电连接的至少一个射频元件。 内屏蔽单元包括形成在射频元件的预定表面上的内金属屏蔽层。 绝缘封装单元包括设置在电路基板上以覆盖射频元件的绝缘封装树脂体。 外屏蔽单元形成在绝缘封装树脂体的外表面上并与电路基板电连接。 内金属屏蔽层是设置在射频元件与外屏蔽单元的一部分之间的用于屏蔽射频元件的射频特性保持层。

公开(公告)号：US20090051044A1

公开(公告)日：2009-02-26

申请号：US11987147

申请日：2007-11-28

申请人： Chung-Er Huang ,  Yueh-Cheng Lee

发明人： Chung-Er Huang ,  Yueh-Cheng Lee

IPC分类号： H01L23/31 ,  H01L21/78

CPC分类号： H01L21/78 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/6836 ,  H01L23/3114 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2924/0002 ,  H01L2924/00

摘要： A wafer-level packaging method is shown below: providing an un-cut wafer having a front side and a back side. A plurality of cutting lines is formed on the front side of the wafer so as to define the positions of each chip module such as a wireless module. The next step is providing an extendible film attached onto the back side of the wafer. Next is dicing the wafer along the cutting line to separate each chip module and expending the extendible film so that a gap is formed between each chip module. At last, filling a packaging compound onto the front side and the lateral side of the chip module produces a packaged structure. As mentioned above, the structure is employed for protecting the external surface of the chip.

摘要翻译： 晶片级封装方法如下所示：提供具有正面和背面的未切割晶片。 多个切割线形成在晶片的前侧，以便限定诸如无线模块的每个芯片模块的位置。 下一步是提供附着在晶片背面的可延伸膜。 接下来，沿着切割线切割晶片以分离每个芯片模块并且扩展可扩展膜，使得在每个芯片模块之间形成间隙。 最后，将包装化合物填充到芯片模块的前侧和侧面产生封装结构。 如上所述，该结构用于保护芯片的外表面。