摘要:
Disclosed is a thermosetting resin composition including a thermosetting aromatic oligomer represented by the following Chemical Formula 1, a hollow particle, and solvent, and a board comprising the same. In the above Chemical Formula 1, wherein B, L1, L2, Z1 and Z2 are the same as in defined in the specification.
摘要:
Disclosed is a composition for forming a board including a benzoxazine-based compound and a liquid crystal polymer or oligomer, and a board fabricated using the same. A board comprising the composition including the benzoxazine-based compound and the liquid crystal compound, and a prepreg comprising the cured composition, are also disclosed