公开(公告)号：US20210066221A1

公开(公告)日：2021-03-04

申请号：US16897036

申请日：2020-06-09

Applicant: Cirrus Logic International Semiconductor Ltd.

Inventor： Kathryn Rose HOLLAND ,  Marc L. TARABBIA ,  Yaoyu PANG ,  Alexander BARR

IPC: H01L23/00

Abstract: A method may include forming a metal pattern in a metal layer of a fabricated integrated circuit device and under a target bump of the fabricated integrated circuit device, wherein the metal pattern has an inner shape and an outer field such that a void space in the metal layer is created between the inner shape and the outer field and approximately centering the void space on an outline of an under-bump metal formed under the target bump with a keepout distance from the inner shape and the outer field on either side of the outline such that the metal minimizes local variations in mechanical stress on underlying structures within the fabricated integrated circuit device.

公开(公告)号：US20200309611A1

公开(公告)日：2020-10-01

申请号：US16569047

申请日：2019-09-12

Applicant: Cirrus Logic International Semiconductor Ltd.

Inventor： Emmanuel MARCHAIS ,  Kathryn Rose HOLLAND ,  Carl Lennart STÅHL ,  Eric LINDEMANN

IPC: G01L1/08 ,  G01L5/10

Abstract: A system for performing force sensing with an electromagnetic load may include a signal generator configured to generate a signal for driving an electromagnetic load and a processing subsystem configured to monitor at least one operating parameter of the electromagnetic load and determine a force applied to the electromagnetic load based on a variation of the at least one operating parameter.