公开(公告)号：US20180352339A1

公开(公告)日：2018-12-06

申请号：US15987346

申请日：2018-05-23

Applicant: Cirrus Logic International Semiconductor Ltd.

Inventor： Marek Sebastian PIECHOCINSKI ,  Richard Ian LAMING ,  Tsjerk Hans HOEKSTRA ,  Colin Robert JENKINS ,  Axel THOMSEN

IPC: H04R19/04 ,  B81B3/00

Abstract: The application describes MEMS transducers having a patterned membrane electrode which incorporates a plurality of openings or voids. A conductive element is provided on the surface of the underlying membrane within the opening.

公开(公告)号：US20180244516A1

公开(公告)日：2018-08-30

申请号：US15895689

申请日：2018-02-13

Applicant: Cirrus Logic International Semiconductor Ltd.

Inventor： Marek Sebastian PIECHOCINSKI

IPC: B81B7/00 ,  B81C1/00 ,  H04R19/04 ,  G01L9/00 ,  H04R7/26

CPC classification number: B81B7/0061 ,  B81B7/0029 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2203/0118 ,  B81B2203/0127 ,  B81B2203/0323 ,  B81B2207/012 ,  B81C1/00158 ,  G01L9/0042 ,  G01L9/0073 ,  H04R7/26 ,  H04R19/005 ,  H04R19/04 ,  H04R2201/003 ,  H04R2499/11

Abstract: The application describes MEMS transducers and associated methods of fabrication. The MEMS transducer has a flexible membrane with a vent structure comprising a moveable portion which opens in response to a differential pressure across the membrane to provide a flow path through the membrane. At least one edge of the moveable portion comprises one or more protrusions and/or recesses in the plane of the moveable portion.

公开(公告)号：US20180167742A1

公开(公告)日：2018-06-14

申请号：US15830447

申请日：2017-12-04

Applicant: Cirrus Logic International Semiconductor Ltd.

Inventor： Roberto BRIOSCHI ,  Rkia ACHEHBOUNE ,  Marek Sebastian PIECHOCINSKI

IPC: H04R9/08 ,  B81B7/00 ,  H04R31/00

CPC classification number: H04R9/08 ,  B81B7/0061 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2207/012 ,  B81B2207/03 ,  B81C1/00269 ,  B81C2203/0109 ,  H04R31/00 ,  H04R2201/003

Abstract: The applications describes lid designs for transducer packaging. The lid comprising at least one side wall which extends between a foot of the lid and an upper surface of the lid. One or more grooves are provided in a surface of the side wall which serve to resist the flow of molten solder on the surface of the lid.

公开(公告)号：US20180002160A1

公开(公告)日：2018-01-04

申请号：US15636825

申请日：2017-06-29

Applicant: Cirrus Logic International Semiconductor Ltd.

Inventor： Marek Sebastian PIECHOCINSKI ,  Colin Robert JENKINS ,  Clive Robert GRAHAM

IPC: B81B3/00 ,  B81C1/00 ,  H01L41/09 ,  B81C3/00 ,  H04R31/00 ,  H04R19/04

CPC classification number: B81B3/0021 ,  B81B3/0072 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2203/04 ,  B81C1/00158 ,  B81C3/001 ,  H01L41/0973 ,  H04R1/04 ,  H04R1/06 ,  H04R19/005 ,  H04R19/04 ,  H04R31/003 ,  H04R31/006 ,  H04R2201/003 ,  H04R2499/15

Abstract: The application describes MEMS transducer structures comprising a membrane structure having a flexible membrane layer and at least one electrode layer. The electrode layer is spaced from the flexible membrane layer such that at least one air volume extends between the material of the electrode layer and the membrane layer. The electrode layer is supported relative to the flexible membrane by means of a support structure which extends between the first electrode layer and the flexible membrane layer.

公开(公告)号：US20200055726A1

公开(公告)日：2020-02-20

申请号：US16603740

申请日：2018-04-12

Applicant: Cirrus Logic International Semiconductor Ltd.

Inventor： James Thomas DEAS ,  Colin Wei Hong CHUNG ,  Marek Sebastian PIECHOCINSKI

IPC: B81B3/00 ,  B81C1/00 ,  H04R1/04 ,  H04R19/04 ,  H04R19/00

Abstract: Micro-electro-mechanical system (MEMS) devices are disclosed, including a MEMS device comprising a semiconductor die including integrated circuitry, a structure mounted on the semiconductor die and covering at least a portion of the circuitry, the structure defining a space between the structure and the at least a portion of the circuitry, and a transducer including a membrane, the transducer located outside of the space.

公开(公告)号：US20190297428A1

公开(公告)日：2019-09-26

申请号：US16302978

申请日：2016-06-30

Applicant: Cirrus Logic International Semiconductor Ltd.

Inventor： Marek Sebastian PIECHOCINSKI ,  Tsjerk Hans HOEKSTRA

IPC: H04R19/00 ,  H04R31/00 ,  B81B3/00 ,  B81C1/00

Abstract: A wafer for use in fabricating a plurality of individual transducer devices comprises a bracing structure for partitioning the wafer into a plurality of regions, and a plurality of transducer devices fabricated in one or more of the plurality of regions.

公开(公告)号：US20180273372A1

公开(公告)日：2018-09-27

申请号：US15924876

申请日：2018-03-19

Applicant: Cirrus Logic International Semiconductor Ltd.

Inventor： Marek Sebastian PIECHOCINSKI

IPC: B81B3/00 ,  H04R19/04 ,  H04R19/00 ,  H04R3/00

Abstract: The application relates to MEMS microphone transducers having a vent structure provided in the membrane layer and an opening formed at the vent structure for tuning the frequency response of the microphone.

公开(公告)号：US20170217760A1

公开(公告)日：2017-08-03

申请号：US15413608

申请日：2017-01-24

Applicant: Cirrus Logic International Semiconductor Ltd.

Inventor： Marek Sebastian PIECHOCINSKI

IPC: B81B7/00 ,  H04R19/04 ,  G01L9/00 ,  B81C1/00

CPC classification number: B81B7/0061 ,  B81B7/0029 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2203/0118 ,  B81B2203/0127 ,  B81B2203/0323 ,  B81B2207/012 ,  B81C1/00158 ,  G01L9/0042 ,  G01L9/0073 ,  H04R7/26 ,  H04R19/005 ,  H04R19/04 ,  H04R2201/003 ,  H04R2499/11

Abstract: The application describes MEMS transducers and associated methods of fabrication. The MEMS transducer has a flexible membrane with a vent structure comprising a moveable portion which opens in response to a differential pressure across the membrane to provide a flow path through the membrane. At least one edge of the moveable portion comprises one or more protrusions and/or recesses in the plane of the moveable portion.

公开(公告)号：US20210144482A1

公开(公告)日：2021-05-13

申请号：US16605155

申请日：2018-04-13

Applicant: Cirrus Logic International Semiconductor Ltd.

Inventor： Marek Sebastian PIECHOCINSKI ,  Roberto BRIOSCHI ,  Rkia ACHEHBOUNE

IPC: H04R19/00 ,  B81B3/00 ,  B81C3/00 ,  H04R19/04

Abstract: The present disclosure describes techniques for altering the epoxy wettability of a surface of a MEMS device. Particularly applicable to flip-chip bonding arrangements in which a top surface of a MEMS device is adhered to a package substrate. A barrier region is provided on a top surface of the MEMs device, laterally outside a region which forms, or overlies, the backplate and/or the cavity in the transducer substrate. The barrier region comprises a plurality of discontinuities, e.g. dimples, which inhibit the flow of epoxy.

公开(公告)号：US20190127217A1

公开(公告)日：2019-05-02

申请号：US16149515

申请日：2018-10-02

Applicant: Cirrus Logic International Semiconductor Ltd.

Inventor： Scott Lyall CARGILL ,  Marek Sebastian PIECHOCINSKI

IPC: B81B7/00 ,  H04R19/00 ,  H04R19/04

Abstract: This application relates to MEMS transducer having a membrane layer (101) and at least one variable vent structure (301). The variable vent structure has a vent hole for venting fluid so as to reduce a pressure differential across the membrane layer and a moveable vent cover (302a, 302b) which, at an equilibrium position, at least partly blocks the vent hole. The vent cover is moveable from its equilibrium position in response to a pressure differential across the vent cover so as to vary the size of a flow path through the vent hole. In various embodiments the vent cover comprises at least a first flap section (302a) and a second flap section (302b), the first flap section being hingedly coupled to the side of the vent hole and the second flap section being hingedly coupled to the first flap section so as to be moveable with respect to the first flap section. In some embodiments the second flap section (302b) may be configured so that it deflects away from the first section (302a) more readily than the first section deflects away from its equilibrium position.