公开(公告)号：US20180091906A1

公开(公告)日：2018-03-29

申请号：US15708822

申请日：2017-09-19

Applicant: Cirrus Logic International Semiconductor Ltd.

Inventor： Aleksey Sergeyevich KHENKIN ,  Tsjerk Hans HOEKSTRA

IPC: H04R19/04 ,  H04R19/00 ,  H04R31/00

CPC classification number: H04R19/04 ,  H04R1/04 ,  H04R19/005 ,  H04R31/003 ,  H04R2201/003 ,  H04R2410/01 ,  H04R2410/03

Abstract: The application describes a MEMS transducer comprising: a substrate; a primary membrane supported in a fixed relation relative to the substrate and a secondary membrane provided in a plane overlying the primary membrane. The secondary membrane is mechanically coupled to the primary membrane by a substantially rigid coupling structure. A rigid support plate may be interposed between the primary and secondary membranes.

公开(公告)号：US20180288547A1

公开(公告)日：2018-10-04

申请号：US15938665

申请日：2018-03-28

Applicant: Cirrus Logic International Semiconductor Ltd.

Inventor： Jean Pierre LASSEUGUETTE ,  Aleksey Sergeyevich KHENKIN ,  Axel THOMSEN

IPC: H04R29/00 ,  B81B7/00 ,  H04R19/04

CPC classification number: H04R29/004 ,  B81B7/008 ,  B81B2201/0257 ,  B81B2207/03 ,  B81C99/003 ,  H04R19/005 ,  H04R19/04 ,  H04R2201/003

Abstract: The disclosure provides a system, comprising: a MEMS capacitive transducer, comprising one or more first capacitive plates coupled to a first node and one or more second capacitive plates coupled to a second node; biasing circuitry coupled to the first node, operable to provide a biasing voltage to the one or more first capacitive plates; and test circuitry coupled to the second node, operable to: selectively apply one or more current sources to the second node, so as to charge and discharge the MEMS capacitive transducer and so vary a signal based on a voltage at said second node between an upper value and a lower value; determine a parameter that is indicative of a time period of the variation of the signal; and determine a capacitance of the MEMS capacitive transducer based on the parameter that is indicative of the time period.

公开(公告)号：US20190047847A1

公开(公告)日：2019-02-14

申请号：US16052006

申请日：2018-08-01

Applicant: Cirrus Logic International Semiconductor Ltd.

Inventor： Aleksey Sergeyevich KHENKIN ,  Tsjerk Hans HOEKSTRA ,  Colin Robert Jenkins

IPC: B81B7/02 ,  B81B3/00 ,  B81B7/00 ,  H04R1/08

Abstract: A MEMS transducer configured to operate as a microphone, the MEMS transducer comprising a flexible membrane, the flexible membrane having a first surface and a second surface, wherein the first surface of the flexible membrane is fluidically isolated from the second surface of the flexible membrane. Also, a MEMS device comprising a MEMS transducer, an electronic device comprising a MEMS transducer and/or a MEMS device, and a method for forming a MEMS device.

公开(公告)号：US20180279057A1

公开(公告)日：2018-09-27

申请号：US15852098

申请日：2017-12-22

Applicant: Cirrus Logic International Semiconductor Ltd.

Inventor： Aleksey Sergeyevich KHENKIN ,  David PATTEN ,  Dimitris DROGOUDIS

IPC: H04R19/04 ,  H03H7/06 ,  H01L27/01 ,  B81B7/00 ,  H04R3/00 ,  H04R19/00

Abstract: A MEMS transducer package comprising a substrate; a filter circuit for filtering RF signals, the filter circuit comprising a resistor and a capacitor; and an IPD chip; wherein at least a portion of the filter circuit is provided within the IPD chip.

公开(公告)号：US20200045485A1

公开(公告)日：2020-02-06

申请号：US16598799

申请日：2019-10-10

Applicant: Cirrus Logic International Semiconductor Ltd.

Inventor： Jean Pierre LASSEUGUETTE ,  Aleksey Sergeyevich KHENKIN ,  Axel THOMSEN

IPC: H04R29/00 ,  B81B7/00 ,  B81C99/00

Abstract: The disclosure provides a system, comprising: a MEMS capacitive transducer, comprising one or more first capacitive plates coupled to a first node and one or more second capacitive plates coupled to a second node; biasing circuitry coupled to the first node, operable to provide a biasing voltage to the one or more first capacitive plates; and test circuitry coupled to the second node, operable to: selectively apply one or more current sources to the second node, so as to charge and discharge the MEMS capacitive transducer and so vary a signal based on a voltage at said second node between an upper value and a lower value; determine a parameter that is indicative of a time period of the variation of the signal; and determine a capacitance of the MEMS capacitive transducer based on the parameter that is indicative of the time period.

公开(公告)号：US20190158962A1

公开(公告)日：2019-05-23

申请号：US16179237

申请日：2018-11-02

Applicant: Cirrus Logic International Semiconductor Ltd.

Inventor： Rkia ACHEHBOUNE ,  Dimitris DROGOUDIS ,  Roberto BRIOSCHI ,  Aleksey Sergeyevich KHENKIN ,  David PATTEN

IPC: H04R19/04 ,  B81B7/02 ,  H04R19/00 ,  H04R1/04

Abstract: A package for a MEMS device, the package comprising a MEMS transducer within a chamber of the package; and a package substrate, wherein an upper surface of the package substrate defines at least part of a surface of the chamber; wherein the package substrate comprises a plurality of metal layers, the package substrate further comprising at least a part of a filter circuit for filtering RF signals, wherein a first metal layer is provided in a first plane of the substrate and wherein a resistor of the filter circuit is provided in a plane below the first plane.

公开(公告)号：US20180362332A1

公开(公告)日：2018-12-20

申请号：US16007799

申请日：2018-06-13

Applicant: Cirrus Logic International Semiconductor Ltd.

Inventor： Aleksey Sergeyevich KHENKIN ,  David PATTEN

IPC: B81B7/00 ,  H04R19/04

Abstract: The application describes a package for a MEMS transducer. The package has a package substrate having an acoustic port formed in the package substrate. The acoustic port comprises a first acoustic port volume portion and a second acoustic port volume portion, the first acoustic port volume portion being separated from the second acoustic port volume potion by a discontinuity in a sidewall of the substrate. The cross sectional area of the first acoustic port volume portion is greater than the cross sectional area of the second acoustic port volume portion. A barrier may be attached to the upper surface of the package substrate so as to seal or cover the acoustic port.

公开(公告)号：US20180152792A1

公开(公告)日：2018-05-31

申请号：US15826255

申请日：2017-11-29

Applicant: Cirrus Logic International Semiconductor Ltd.

Inventor： Tsjerk Hans HOEKSTRA ,  Axel THOMSEN ,  Colin Robert JENKINS ,  Aleksey Sergeyevich KHENKIN

IPC: H04R9/08 ,  H04R29/00 ,  B81B3/00

CPC classification number: H04R9/08 ,  B81B3/0086 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2203/04 ,  H04R19/005 ,  H04R19/04 ,  H04R29/004 ,  H04R2201/003

Abstract: A MEMS transducer comprising: a flexible membrane, the flexible membrane comprising a first membrane electrode; a back plate, the back plate comprising a first back plate electrode; wherein the back plate is supported in a spaced relation with respect to the flexible membrane. The MEMS transducer is configured to provide electrical connections to the first membrane electrode and the first back plate electrode. The flexible membrane further comprises a second membrane electrode, the second membrane electrode being electrically isolated from the first membrane electrode, wherein the first membrane electrode and the second membrane electrode are arranged to reduce variation in electrostatic forces across the flexible membrane.