公开(公告)号：US20150036408A1

公开(公告)日：2015-02-05

申请号：US14519759

申请日：2014-10-21

Applicant: CONVERSANT INTELLECTUAL PROPERTY MANAGEMENT INC.

Inventor： Byoung Jin CHOI

IPC: G11C5/06 ,  G11C11/4076 ,  G11C11/408 ,  G11C11/4097

CPC classification number: H01L25/0657 ,  G11C5/06 ,  G11C7/10 ,  G11C7/1066 ,  G11C7/1093 ,  G11C11/401 ,  G11C11/4076 ,  G11C11/408 ,  G11C11/4097 ,  G11C29/023 ,  G11C29/028 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method and apparatus for organizing memory for a computer system including a plurality of memory devices, connected to a logic device, particularly a memory system having a plurality of stacked memory dice connected to a logic die, with the logic device having capability to analyze and compensate for differing delays to the stacked devices stacking multiple dice divided into partitions serviced by multiple buses connected to a logic die, to increase throughput between the devices and logic device allowing large scale integration of memory with self-healing capability.

Abstract translation: 一种用于组织包括连接到逻辑设备的多个存储器设备的计算机系统的存储器的方法和装置，特别是具有连接到逻辑管芯的多个堆叠存储器管芯的存储器系统，该逻辑器件具有分析能力和 补偿堆叠设备的不同延迟，堆叠多个骰子被分成由连接到逻辑管芯的多个总线所服务的分区，以增加设备和逻辑设备之间的吞吐量，从而允许具有自愈能力的存储器的大规模集成。

公开(公告)号：US20160071825A1

公开(公告)日：2016-03-10

申请号：US14826251

申请日：2015-08-14

Applicant: Conversant Intellectual Property Management Inc.

Inventor： Byoung Jin CHOI

IPC: H01L25/065 ,  G11C11/401

CPC classification number: H01L25/0657 ,  G11C5/06 ,  G11C7/10 ,  G11C7/1066 ,  G11C7/1093 ,  G11C11/401 ,  G11C11/4076 ,  G11C11/408 ,  G11C11/4097 ,  G11C29/023 ,  G11C29/028 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method and apparatus for organizing memory for a computer system including a plurality of memory devices, connected to a logic device, particularly a memory system having a plurality of stacked memory dice connected to a logic die, with the logic device having capability to analyze and compensate for differing delays to the stacked devices stacking multiple dice divided into partitions serviced by multiple buses connected to a logic die, to increase throughput between the devices and logic device allowing large scale integration of memory with self-healing capability.