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公开(公告)号：US08479590B2
公开(公告)日：2013-07-09
申请号：US12949113
申请日：2010-11-18
CPC分类号： G01N29/2462 , G01N29/223 , G01N2291/0232 , G01N2291/2634
摘要： A system for detection of stress and deformation in a structural asset, for instance, one of reinforced concrete. An area on the asset may have a structure interface, such as a patch, attached to it with a fastening mechanism which may be a layer of an epoxy or other material, or be items such as screws, bolts, welds, or the like. One or more surface acoustic wave (SAW) strain sensors may be attached to the interface with an adhesive layer of epoxy or other material, or with mechanical items. Stress may be transmitted by the interface to the strain sensors. The sensors may be interrogated with a wire or wireless reader to obtain strain measurements. The measurements may indicate stress and deformations such as bulges and breaks in the asset. The measurements may also be a basis for determining location and extent of the stress and deformations.
摘要翻译： 一种用于检测结构资产中的应力和变形的系统，例如钢筋混凝土之一。 资产上的区域可以具有附接到其上的结构界面，例如贴片，其具有可以是环氧树脂或其它材料层的紧固机构，或者诸如螺钉，螺栓，焊接等的物品。 一个或多个表面声波（SAW）应变传感器可以与环氧树脂或其它材料或机械物品的粘合剂层附接到界面。 应力可以通过接口传递到应变传感器。 传感器可以用线或无线读取器询问以获得应变测量值。 测量结果可能表示压力和变形，如资产中的凸起和断裂。 测量也可能是确定应力和变形的位置和程度的基础。
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公开(公告)号：US20120125118A1
公开(公告)日：2012-05-24
申请号：US12949113
申请日：2010-11-18
IPC分类号： G01N29/04
CPC分类号： G01N29/2462 , G01N29/223 , G01N2291/0232 , G01N2291/2634
摘要： A system for detection of stress and deformation in a structural asset, for instance, one of reinforced concrete. An area on the asset may have a structure interface, such as a patch, attached to it with a fastening mechanism which may be a layer of an epoxy or other material, or be items such as screws, bolts, welds, or the like. One or more surface acoustic wave (SAW) strain sensors may be attached to the interface with an adhesive layer of epoxy or other material, or with mechanical items. Stress may be transmitted by the interface to the strain sensors. The sensors may be interrogated with a wire or wireless reader to obtain strain measurements. The measurements may indicate stress and deformations such as bulges and breaks in the asset. The measurements may also be a basis for determining location and extent of the stress and deformations.
摘要翻译： 一种用于检测结构资产中的应力和变形的系统，例如钢筋混凝土之一。 资产上的区域可以具有附接到其上的结构界面，例如贴片，其具有可以是环氧树脂或其它材料层的紧固机构，或者诸如螺钉，螺栓，焊接等的物品。 一个或多个表面声波（SAW）应变传感器可以与环氧树脂或其它材料或机械物品的粘合剂层附接到界面。 应力可以通过接口传递到应变传感器。 传感器可以用线或无线读取器询问以获得应变测量值。 测量结果可能表示压力和变形，如资产中的凸起和断裂。 测量也可能是确定应力和变形的位置和程度的基础。
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公开(公告)号：US07891252B2
公开(公告)日：2011-02-22
申请号：US12362741
申请日：2009-01-30
IPC分类号： G01L7/00
CPC分类号： G01L9/0025 , B60C23/0408 , C03C27/00 , H01L41/1132 , H01L41/331 , Y10T29/42
摘要： A method includes forming multiple trenches in a first wafer, forming a sensor structure on a first surface of a second wafer, and bonding the first wafer and the second wafer. The method also includes etching a second surface of the second wafer to form a sensor diaphragm in the second wafer. The method further includes removing a portion of the first wafer by cutting the first wafer in multiple areas of the first wafer associated with the trenches. A sensor includes a substrate and a surface acoustic wave (SAW) resonator on a first surface of the substrate. The sensor also includes a bonding pad electrically coupled to the SAW resonator and a notch formed in a second surface of the substrate. The sensor further includes a cover separated from the first surface of the substrate by a spacer. The SAW resonator is located between the cover and the substrate.
摘要翻译： 一种方法包括在第一晶片中形成多个沟槽，在第二晶片的第一表面上形成传感器结构，以及结合第一晶片和第二晶片。 该方法还包括蚀刻第二晶片的第二表面以在第二晶片中形成传感器膜片。 该方法还包括通过在与沟槽相关联的第一晶片的多个区域中切割第一晶片来去除第一晶片的一部分。 传感器包括在基板的第一表面上的基板和表面声波（SAW）谐振器。 传感器还包括电耦合到SAW谐振器的接合焊盘和形成在衬底的第二表面中的凹口。 传感器还包括通过间隔件与衬底的第一表面分离的盖。 SAW谐振器位于盖和基板之间。
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公开(公告)号：US20070164859A1
公开(公告)日：2007-07-19
申请号：US11331722
申请日：2006-01-13
申请人： Cornel Cobianu , Ion Georgescu , James Cook , Viorel Avramescu
发明人： Cornel Cobianu , Ion Georgescu , James Cook , Viorel Avramescu
CPC分类号： G06K19/0723 , G06K19/0716
摘要： A multifunctional multichip system can operate in a passive mode by using at least one antenna to receive electromagnetic energy and using that energy to perform system functions. The system includes a sensor, an impedance matching circuit and an RFID module. The sensor produces a sensor signal containing a measurement. The RFID can produce an identification signal containing identification information. Alternatively, the RFID chip can be used in an addressing mode wherein the system only produces a signal in response to an addressing signal containing addressing information. The addressing signal is received from the electromagnetic field. In either mode, the sensor signal is coupled from the antenna into the electromagnetic field from which a receiver can obtain it. The signal can contain the identification information as well as the measurement. A matching network minimizes the effects of impedance mismatches between the system elements.
摘要翻译： 多功能多芯片系统可以通过使用至少一个天线来接收电磁能并使用该能量来执行系统功能，以无源模式操作。 该系统包括传感器，阻抗匹配电路和RFID模块。 传感器产生包含测量值的传感器信号。 RFID可以产生包含识别信息的识别信号。 或者，RFID芯片可以以寻址模式使用，其中系统仅响应于包含寻址信息的寻址信号产生信号。 从电磁场接收寻址信号。 在任一模式中，传感器信号从天线耦合到电磁场中，接收器可从该电磁场获得它。 该信号可以包含识别信息以及测量。 匹配网络可以最大限度地减少系统元件之间阻抗失配的影响。
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公开(公告)号：US20090193903A1
公开(公告)日：2009-08-06
申请号：US12362741
申请日：2009-01-30
CPC分类号： G01L9/0025 , B60C23/0408 , C03C27/00 , H01L41/1132 , H01L41/331 , Y10T29/42
摘要： A method includes forming multiple trenches in a first wafer, forming a sensor structure on a first surface of a second wafer, and bonding the first wafer and the second wafer. The method also includes etching a second surface of the second wafer to form a sensor diaphragm in the second wafer. The method further includes removing a portion of the first wafer by cutting the first wafer in multiple areas of the first wafer associated with the trenches. A sensor includes a substrate and a surface acoustic wave (SAW) resonator on a first surface of the substrate. The sensor also includes a bonding pad electrically coupled to the SAW resonator and a notch formed in a second surface of the substrate. The sensor further includes a cover separated from the first surface of the substrate by a spacer. The SAW resonator is located between the cover and the substrate.
摘要翻译： 一种方法包括在第一晶片中形成多个沟槽，在第二晶片的第一表面上形成传感器结构，以及结合第一晶片和第二晶片。 该方法还包括蚀刻第二晶片的第二表面以在第二晶片中形成传感器膜片。 该方法还包括通过在与沟槽相关联的第一晶片的多个区域中切割第一晶片来去除第一晶片的一部分。 传感器包括在基板的第一表面上的基板和表面声波（SAW）谐振器。 传感器还包括电耦合到SAW谐振器的接合焊盘和形成在衬底的第二表面中的凹口。 传感器还包括通过间隔件与衬底的第一表面分离的盖。 SAW谐振器位于盖和基板之间。
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公开(公告)号：US20070164633A1
公开(公告)日：2007-07-19
申请号：US11331632
申请日：2006-01-13
申请人： Cornel Cobianu , Viorel Avramescu , Ion Georgescu
发明人： Cornel Cobianu , Viorel Avramescu , Ion Georgescu
IPC分类号： H03H9/145
CPC分类号： G01L9/008 , G01L9/0025
摘要： A SAW sensor module can be produced with a true all quartz sensor package (TAQSP) attached to a substrate. The TAQSP has a quartz cover direct quartz bonded to a SAW sensor on a quartz substrate. The TAQSP can be mass produced by direct quartz bonding a quartz cover wafer, having many covers, to a quartz sensor wafer, having many sensors, thereby producing a wafer tandem. The wafer tandem can be further processed because the bond protects the sensors within. Individual sensor packages can be obtained by cutting stripes out of the cover wafer, revealing SAW sensor bonding pads, and then dicing the wafer tandem. A SAW sensor module results when the sensor packages are attached to an antenna bearing substrate and then sealed.
摘要翻译： SAW传感器模块可以使用附着在基板上的真正的所有石英传感器封装（TAQSP）来生产。 TAQSP具有石英盖直接石英结合到石英基板上的SAW传感器。 TAQSP可以通过将具有许多盖的石英盖晶片直接石英粘合到具有许多传感器的石英传感器晶片上进行批量生产，从而制造晶圆串联。 晶圆串联可以进一步处理，因为焊接保护传感器内部。 可以通过从盖晶片上切割条纹，露出SAW传感器接合焊盘，然后将晶片串联切割来获得各个传感器封装。 当传感器封装安装在天线轴承衬底上，然后密封时，会产生SAW传感器模块。
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公开(公告)号：US20110241959A1
公开(公告)日：2011-10-06
申请号：US12755123
申请日：2010-04-06
申请人： Ion Georgescu , Dana E. Guran , Ioan Pavelescu , Cornel Cobianu
发明人： Ion Georgescu , Dana E. Guran , Ioan Pavelescu , Cornel Cobianu
CPC分类号： H01Q11/08 , H01Q1/3233 , H01Q1/38
摘要： An apparatus includes a sensor that receives a first electrical signal and provides a second electrical signal in response to the first electrical signal. The second electrical signal is based on at least one parameter monitored by the sensor. The apparatus also includes an antenna that converts first wireless signals into the first electrical signal and that converts the second electrical signal into second wireless signals. The antenna includes a substrate, conductive traces, and conductive interconnects. The conductive traces are formed on first and second surfaces of the substrate. The conductive interconnects couple the conductive traces, and the conductive interconnects and the conductive traces form at least one helical arm of the antenna. The conductive traces could be formed in various ways, such as by etching or direct printing. The conductive interconnects could also be formed in various ways, such as by filling vias in the substrate or direct printing.
摘要翻译： 一种装置包括传感器，其接收第一电信号并响应于第一电信号提供第二电信号。 第二电信号基于由传感器监测的至少一个参数。 该装置还包括天线，其将第一无线信号转换成第一电信号并将第二电信号转换成第二无线信号。 天线包括基板，导电迹线和导电互连。 导电迹线形成在基板的第一和第二表面上。 导电互连件耦合导电迹线，并且导电互连和导电迹线形成天线的至少一个螺旋臂。 导电迹线可以以各种方式形成，例如通过蚀刻或直接印刷。 导电互连也可以以各种方式形成，例如通过在基板中填充通孔或直接印刷。
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公开(公告)号：US07514841B1
公开(公告)日：2009-04-07
申请号：US11975217
申请日：2007-10-18
申请人： Cornel Cobianu , Ion Georgescu
发明人： Cornel Cobianu , Ion Georgescu
IPC分类号： H03H9/25
CPC分类号： G01L3/10 , Y10T29/42 , Y10T156/1062
摘要： A glass cover wafer is bonded to a quartz SAW using glass frit technology, such that the glass wafer and glass frit formulation provides a thermal coefficient of expansion (TCE) of glass that fits the average TCE of the quartz in two perpendicular directions in a unique package. A dicing technology is used for chip separation. The sensor back side and the shaft are attached with a glass glue that transitions the TCE from the shaft to the quartz without interposing a large amount of the glue.
摘要翻译： 使用玻璃料技术将玻璃盖晶片结合到石英SAW上，使得玻璃晶片和玻璃料配方提供了玻璃的热膨胀系数（TCE），其适合于在两个垂直方向上的石英的平均TCE在独特的 包。 切片技术用于芯片分离。 传感器背面和轴附有玻璃胶，它将TCE从轴转到石英，而不会插入大量的胶水。
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公开(公告)号：US09437933B2
公开(公告)日：2016-09-06
申请号：US12755123
申请日：2010-04-06
申请人： Ion Georgescu , Dana E. Guran , Ioan Pavelescu , Cornel Cobianu
发明人： Ion Georgescu , Dana E. Guran , Ioan Pavelescu , Cornel Cobianu
CPC分类号： H01Q11/08 , H01Q1/3233 , H01Q1/38
摘要： An apparatus includes a sensor that receives a first electrical signal and provides a second electrical signal in response to the first electrical signal. The second electrical signal is based on at least one parameter monitored by the sensor. The apparatus also includes an antenna that converts first wireless signals into the first electrical signal and that converts the second electrical signal into second wireless signals. The antenna includes a substrate, conductive traces, and conductive interconnects. The conductive traces are formed on first and second surfaces of the substrate. The conductive interconnects couple the conductive traces, and the conductive interconnects and the conductive traces form at least one helical arm of the antenna. The conductive traces could be formed in various ways, such as by etching or direct printing. The conductive interconnects could also be formed in various ways, such as by filling vias in the substrate or direct printing.
摘要翻译： 一种装置包括传感器，其接收第一电信号并响应于第一电信号提供第二电信号。 第二电信号基于由传感器监测的至少一个参数。 该装置还包括天线，其将第一无线信号转换成第一电信号并将第二电信号转换成第二无线信号。 天线包括基板，导电迹线和导电互连。 导电迹线形成在基板的第一和第二表面上。 导电互连件耦合导电迹线，并且导电互连和导电迹线形成天线的至少一个螺旋臂。 导电迹线可以以各种方式形成，例如通过蚀刻或直接印刷。 导电互连也可以以各种方式形成，例如通过在基板中填充通孔或直接印刷。
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公开(公告)号：US20090267761A1
公开(公告)日：2009-10-29
申请号：US12110948
申请日：2008-04-28
IPC分类号： G08B21/00
CPC分类号： G06K19/0672 , B65D2203/10 , G01N29/043 , G01N29/2481 , G01N2291/0258 , G06K19/0675 , G06K19/0723 , G06K19/07798 , H03H9/6406
摘要： An intelligent packaging system utilizing acoustic wave devices includes an electronic module, a SAW ID, various passive SAW sensors and a printed antenna. The passive SAW sensors include a SAW pressure sensor, a SAW temperature sensor and one or more SAW chemical sensors for monitoring physical parameters of a package content. The electronic module generally includes a printed large area distributed electrical circuit, an impedance transformer and a SAW transponder for realizing passive wireless monitoring of the structural integrity of the package. A separate power harvesting antenna and/or a separate dual band antenna can generate radio frequency (RF) power for biasing components associated with the electronic module.
摘要翻译： 使用声波器件的智能封装系统包括电子模块，SAW ID，各种被动SAW传感器和印刷天线。 无源SAW传感器包括SAW压力传感器，SAW温度传感器和用于监测封装内容物理参数的一个或多个SAW化学传感器。 电子模块通常包括印刷的大面积分布式电路，阻抗变换器和SAW应答器，用于实现对封装的结构完整性的被动无线监测。 单独的功率收集天线和/或单独的双频带天线可以产生用于偏置与电子模块相关联的组件的射频（RF）功率。
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