公开(公告)号：US07651879B2

公开(公告)日：2010-01-26

申请号：US11164845

申请日：2005-12-07

申请人： Cornel P. Cobianu ,  Ioan Pavelescu ,  Viorel V. Avramescu ,  James D. Cook ,  Leonard J. McNally

发明人： Cornel P. Cobianu ,  Ioan Pavelescu ,  Viorel V. Avramescu ,  James D. Cook ,  Leonard J. McNally

IPC分类号： H01L21/00

CPC分类号： G01L9/0025 ,  Y10T29/49005 ,  Y10T29/4902 ,  Y10T29/4908

摘要： Improved SAW pressure sensors and manufacturing methods thereof. A SAW wafer including a number of SAW transducers disposed thereon may be provided. A cover wafer may also be provided, with a glass wall situated between the cover wafer and the SAW wafer. The cover wafer may be secured to the SAW wafer such that the glass wall surrounds the SAW transducers. In some instances, the glass wall may define, at least in part, a separation between the cover wafer and the SAW wafer. One or more contours may also be provided between the cover wafer and the SAW wafer such that at least one of the contours surrounds at least one of the SAW transducers when the cover wafer is disposed over and secured relative to the SAW wafer.

摘要翻译： 改进的SAW压力传感器及其制造方法。 可以提供包括设置在其上的多个SAW换能器的SAW晶片。 还可以提供覆盖晶片，其中玻璃壁位于盖晶片和SAW晶片之间。 覆盖晶片可以固定到SAW晶片，使得玻璃壁围绕SAW换能器。 在一些情况下，玻璃壁可以至少部分地限定覆盖晶片和SAW晶片之间的间隔。 也可以在盖晶片和SAW晶片之间提供一个或多个轮廓，使得当盖晶片相对于SAW晶片设置在上方并且被固定时，轮廓中的至少一个围绕至少一个SAW换能器。

公开(公告)号：US07372074B2

公开(公告)日：2008-05-13

申请号：US11247700

申请日：2005-10-11

申请人： James C. Milne ,  Leonard J. McNally

发明人： James C. Milne ,  Leonard J. McNally

IPC分类号： H01L29/04 ,  H01L31/036 ,  H01L23/02 ,  H01L23/12 ,  H01L23/06

CPC分类号： B81B3/001 ,  B81C2201/115 ,  B81C2203/036

摘要： An apparatus and method for a silicon-based Micro-Electro Mechanical System (MEMS) device, including a pair of silicon cover structures each having a substantially smooth and planar contact surface formed thereon; a silicon mechanism structure having a part thereof that is movably suspended relative to a relatively stationary frame portion thereof, the frame portion being formed with substantially parallel and spaced-apart smooth and planar contact surfaces; a relatively rough surface disposed between the contact surfaces of the covers and corresponding surfaces of the movable part of the mechanism structure; and wherein the contact surfaces of the cover structures form silicon fusion bond joints with the respective contact surfaces of the mechanism frame.

摘要翻译： 一种硅基微电子机械系统（MEMS）器件的装置和方法，包括一对硅覆盖结构，每个硅覆盖结构具有形成在其上的基本平滑且平坦的接触表面; 硅机构结构，其一部分相对于其相对固定的框架部分可移动地悬挂，所述框架部分形成有大致平行且间隔开的平滑和平坦的接触表面; 布置在所述盖的接触表面和所述机构结构的可移动部分的对应表面之间的相对粗糙的表面; 并且其中所述覆盖结构的接触表面与所述机构框架的相应接触表面形成硅熔合接合点。