公开(公告)号：US07651879B2

公开(公告)日：2010-01-26

申请号：US11164845

申请日：2005-12-07

申请人： Cornel P. Cobianu ,  Ioan Pavelescu ,  Viorel V. Avramescu ,  James D. Cook ,  Leonard J. McNally

发明人： Cornel P. Cobianu ,  Ioan Pavelescu ,  Viorel V. Avramescu ,  James D. Cook ,  Leonard J. McNally

IPC分类号： H01L21/00

CPC分类号： G01L9/0025 ,  Y10T29/49005 ,  Y10T29/4902 ,  Y10T29/4908

摘要： Improved SAW pressure sensors and manufacturing methods thereof. A SAW wafer including a number of SAW transducers disposed thereon may be provided. A cover wafer may also be provided, with a glass wall situated between the cover wafer and the SAW wafer. The cover wafer may be secured to the SAW wafer such that the glass wall surrounds the SAW transducers. In some instances, the glass wall may define, at least in part, a separation between the cover wafer and the SAW wafer. One or more contours may also be provided between the cover wafer and the SAW wafer such that at least one of the contours surrounds at least one of the SAW transducers when the cover wafer is disposed over and secured relative to the SAW wafer.

摘要翻译： 改进的SAW压力传感器及其制造方法。 可以提供包括设置在其上的多个SAW换能器的SAW晶片。 还可以提供覆盖晶片，其中玻璃壁位于盖晶片和SAW晶片之间。 覆盖晶片可以固定到SAW晶片，使得玻璃壁围绕SAW换能器。 在一些情况下，玻璃壁可以至少部分地限定覆盖晶片和SAW晶片之间的间隔。 也可以在盖晶片和SAW晶片之间提供一个或多个轮廓，使得当盖晶片相对于SAW晶片设置在上方并且被固定时，轮廓中的至少一个围绕至少一个SAW换能器。

公开(公告)号：US07198981B2

公开(公告)日：2007-04-03

申请号：US10971140

申请日：2004-10-21

申请人： Viorel V. Avramescu ,  Cornel P. Cobianu ,  Ioan Pavelescu

发明人： Viorel V. Avramescu ,  Cornel P. Cobianu ,  Ioan Pavelescu

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： G01L9/0025 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/15151 ,  H01L2924/181 ,  H01L2924/1815 ,  Y10T29/49 ,  Y10T29/49007 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A vacuum sealed SAW pressure sensor is disclosed herein, which includes a sensing element configured as a SAW device (e.g., SAW resonator or SAW delay line) supported by a thin diaphragm. The substrate material can be implemented as a quartz wafer (i.e., a “base” wafer). The SAW device can be configured on one side of the wafer and the diaphragm etched on the opposite side. A quartz micromachined pressure sensor can thus be realized, which operates based on a variation of the surface wave velocity of a SAW device situated on the thin diaphragm. The SAW sensor is generally sealed in a vacuum and diaphragm sustains the sensor, thereby implementing a sensor on a wafer scale while allowing for a cost reduction per chip.

摘要翻译： 本文公开了一种真空密封的SAW压力传感器，其包括被配置为由薄隔膜支撑的SAW器件（例如，SAW谐振器或SAW延迟线）的感测元件。 衬底材料可以实现为石英晶片（即，“基底”晶片）。 SAW器件可以配置在晶片的一侧，并且隔膜在相对侧蚀刻。 因此可以实现基于位于薄隔膜上的SAW器件的表面波速度的变化而操作的石英微加工压力传感器。 SAW传感器通常在真空中密封并且隔膜维持传感器，从而在晶片秤上实现传感器，同时允许每个芯片的成本降低。

公开(公告)号：US07391325B2

公开(公告)日：2008-06-24

申请号：US11331722

申请日：2006-01-13

申请人： Cornel P. Cobianu ,  Ion Georgescu ,  James D. Cook ,  Viorel V. Avramescu

发明人： Cornel P. Cobianu ,  Ion Georgescu ,  James D. Cook ,  Viorel V. Avramescu

IPC分类号： G08B13/14

CPC分类号： G06K19/0723 ,  G06K19/0716

摘要： A multifunctional multichip system can operate in a passive mode by using at least one antenna to receive electromagnetic energy and using that energy to perform system functions. The system includes a sensor, an impedance matching circuit and an RFID module. The sensor produces a sensor signal containing a measurement. The RFID can produce an identification signal containing identification information. Alternatively, the RFID chip can be used in an addressing mode wherein the system only produces a signal in response to an addressing signal containing addressing information. The addressing signal is received from the electromagnetic field. In either mode, the sensor signal is coupled from the antenna into the electromagnetic field from which a receiver can obtain it. The signal can contain the identification information as well as the measurement. A matching network minimizes the effects of impedance mismatches between the system elements.

摘要翻译： 多功能多芯片系统可以通过使用至少一个天线来接收电磁能并使用该能量来执行系统功能，以无源模式操作。 该系统包括传感器，阻抗匹配电路和RFID模块。 传感器产生包含测量值的传感器信号。 RFID可以产生包含识别信息的识别信号。 或者，RFID芯片可以以寻址模式使用，其中系统仅响应于包含寻址信息的寻址信号产生信号。 从电磁场接收寻址信号。 在任一模式中，传感器信号从天线耦合到电磁场中，接收器可从该电磁场获得它。 该信号可以包含识别信息以及测量。 匹配网络可以最大限度地减少系统元件之间阻抗失配的影响。

公开(公告)号：US09074983B2

公开(公告)日：2015-07-07

申请号：US11728359

申请日：2007-03-23

申请人： Bogdan Catalin Serban ,  Viorel V. Avramescu ,  Cornel P. Cobianu ,  Ion Georgescu ,  Nicolae Varachiu

发明人： Bogdan Catalin Serban ,  Viorel V. Avramescu ,  Cornel P. Cobianu ,  Ion Georgescu ,  Nicolae Varachiu

IPC分类号： B05D5/12 ,  G01N29/02 ,  B81C1/00 ,  G01N29/24 ,  G01N7/00

CPC分类号： G01N29/022 ,  B81B2201/0214 ,  B81C1/00206 ,  G01N29/2462 ,  G01N2291/021 ,  G01N2291/0423

摘要： The design and deposition of a sensing layer for room temperature SAW/BAW chemical sensors utilizing macrocyclic compounds in accordance with supra-molecular chemistry principles. The gas to be sensed is attached to the organic sensing film thus changing its visco-elastic properties and creating a mass increase of the film deposited on the surface of SAW/BAW devices. A direct printing method can be used as an additive, mask-less procedure to deposit metallic interdigital transducers and electrodes required for SAW/BAW devices, along with the deposition of a guiding layer and the organic films only on the location required by the sensing SAW/BAW principle of the sensor. Different thermal treatment solutions can be used for the consolidation of the gelly organic films deposited by the direct printing methods.

摘要翻译： 根据超分子化学原理，使用大环化合物的室温SAW / BAW化学传感器的感测层的设计和沉积。 被感测的气体被附着到有机传感膜上，从而改变其粘弹性，并且产生沉积在SAW / BAW装置的表面上的膜的质量增加。 直接印刷方法可以用作为SAW / BAW器件所需的金属叉指式换能器和电极的添加剂，无掩模程序，以及引导层和有机膜的沉积仅在感测SAW所需的位置 / BAW原理的传感器。 不同的热处理溶液可用于固化通过直接印刷方法沉积的凝胶状有机膜。

公开(公告)号：US20080229831A1

公开(公告)日：2008-09-25

申请号：US11728359

申请日：2007-03-23

申请人： Bogdan Catalin Serban ,  Viorel V. Avramescu ,  Cornel P. Cobianu ,  Ion Georgescu ,  Nicolae Varachiu

发明人： Bogdan Catalin Serban ,  Viorel V. Avramescu ,  Cornel P. Cobianu ,  Ion Georgescu ,  Nicolae Varachiu

IPC分类号： G01N29/00 ,  B05D5/12

CPC分类号： G01N29/022 ,  B81B2201/0214 ,  B81C1/00206 ,  G01N29/2462 ,  G01N2291/021 ,  G01N2291/0423

摘要： The design and deposition of a sensing layer for room temperature SAW/BAW chemical sensors utilizing macrocyclic compounds in accordance with supra-molecular chemistry principles. The gas to be sensed is attached to the organic sensing film thus changing its visco-elastic properties and creating a mass increase of the film deposited on the surface of SAW/BAW devices. A direct printing method can be used as an additive, mask-less procedure to deposit metallic interdigital transducers and electrodes required for SAW/BAW devices, along with the deposition of a guiding layer and the organic films only on the location required by the sensing SAW/BAW principle of the sensor. Different thermal treatment solutions can be used for the consolidation of the gelly organic films deposited by the direct printing methods.

摘要翻译： 根据超分子化学原理，使用大环化合物的室温SAW / BAW化学传感器的感测层的设计和沉积。 被感测的气体被附着到有机传感膜上，从而改变其粘弹性，并且产生沉积在SAW / BAW装置的表面上的膜的质量增加。 直接印刷方法可以用作为SAW / BAW器件所需的金属叉指式换能器和电极的添加剂，无掩模程序，以及引导层和有机膜的沉积仅在感测SAW所需的位置 / BAW原理的传感器。 不同的热处理溶液可用于固化通过直接印刷方法沉积的凝胶状有机膜。

公开(公告)号：US20080265711A1

公开(公告)日：2008-10-30

申请号：US11799346

申请日：2007-04-30

申请人： Sachin Kumar ,  James D. Cook ,  Gary O'Brien ,  Mohammed AJ. Qasimi ,  Richard C. Sorenson ,  Brian J. Marsh ,  Viorel V. Avramescu

发明人： Sachin Kumar ,  James D. Cook ,  Gary O'Brien ,  Mohammed AJ. Qasimi ,  Richard C. Sorenson ,  Brian J. Marsh ,  Viorel V. Avramescu

IPC分类号： H02N2/18 ,  H01L41/22

CPC分类号： G01L9/0025 ,  Y10T29/42

摘要： A method and apparatus, wherein a die is attached to a supporting base structure utilizing a rigid bond adhesive for a SAW (Surface Acoustic Wave) sensor. A rigid bond adhesive with a preferably high glass transition temperature (Tg) can be applied directly between the die and the die supporting structure in a pattern to eliminate time dependent gradual stress effects upon SAW sensor. The rigid bond adhesive can then be cured, which results in a high yield strength and a high young's modulus. The supporting base and the die material comprise a same co-efficient of thermal expansion in order to avoid die displacement over temperature.

摘要翻译： 一种方法和装置，其中使用用于SAW（表面声波）传感器的刚性粘合剂将模具附接到支撑基座结构。 具有优选高玻璃化转变温度（Tg）的刚性粘合剂可以以模式直接施加在模具和模具支撑结构之间，以消除对SAW传感器的时间依赖性渐变应力影响。 然后刚性粘合剂可以固化，这导致高屈服强度和高的杨氏模量。 支撑基底和模具材料包括相同的热膨胀系数，以避免在温度下的模具位移。

公开(公告)号：US07576470B2

公开(公告)日：2009-08-18

申请号：US11799346

申请日：2007-04-30

申请人： Sachin Kumar ,  James D. Cook ,  Gary O'Brien ,  Mohammed A J Qasimi ,  Richard C. Sorenson ,  Brian J. Marsh ,  Viorel V. Avramescu

发明人： Sachin Kumar ,  James D. Cook ,  Gary O'Brien ,  Mohammed A J Qasimi ,  Richard C. Sorenson ,  Brian J. Marsh ,  Viorel V. Avramescu

IPC分类号： H01L41/08

CPC分类号： G01L9/0025 ,  Y10T29/42

摘要： A method and apparatus, wherein a die is attached to a supporting base structure utilizing a rigid bond adhesive for a SAW (Surface Acoustic Wave) sensor. A rigid bond adhesive with a preferably high glass transition temperature (Tg) can be applied directly between the die and the die supporting structure in a pattern to eliminate time dependent gradual stress effects upon SAW sensor. The rigid bond adhesive can then be cured, which results in a high yield strength and a high young's modulus. The supporting base and the die material comprise a same co-efficient of thermal expansion in order to avoid die displacement over temperature.

摘要翻译： 一种方法和装置，其中使用用于SAW（表面声波）传感器的刚性粘合剂将模具附接到支撑基座结构。 具有优选高玻璃化转变温度（Tg）的刚性粘合剂可以以模式直接施加在模具和模具支撑结构之间，以消除对SAW传感器的时间依赖性渐变应力影响。 然后刚性粘合剂可以固化，这导致高屈服强度和高的杨氏模量。 支撑基底和模具材料包括相同的热膨胀系数，以避免在温度下的模具位移。