Semiconductor substrate processing chamber and substrate transfer chamber interfacial structure
    1.
    发明申请
    Semiconductor substrate processing chamber and substrate transfer chamber interfacial structure 审中-公开
    半导体衬底处理室和衬底转移室界面结构

    公开(公告)号:US20060027326A1

    公开(公告)日:2006-02-09

    申请号:US11208964

    申请日:2005-08-22

    IPC分类号: C23F1/00

    摘要: A semiconductor substrate processor includes a substrate transfer chamber and a plurality of substrate processing chambers connected therewith. An interfacial structure is received between at least one of the processing chambers and the transfer chamber. The interfacial structure includes a substantially non-metallic, thermally insulative mass of material interposed between the one processing chamber and the transfer chamber. The mass is of sufficient volume to effectively reduce heat transfer from the processing chamber to the transfer chamber than would otherwise occur in the absence of said mass of material. An interfacial structure includes a body having a substrate passageway extending therethrough. The passageway includes walls at least a portion of which are substantially metallic. The body includes material peripheral of the walls which is substantially non-metallic and thermally insulative. The substantially non-metallic material has mounting openings extending at least partially therein.

    摘要翻译: 半导体衬底处理器包括衬底传送室和与之连接的多个衬底处理室。 在至少一个处理室和传送室之间接收界面结构。 界面结构包括插入在一个处理室和传送室之间的基本上非金属的绝热材料块。 质量足够的体积以有效地减少从处理室到传送室的传热比否则不存在所述材料块的情况。 界面结构包括具有延伸穿过其中的基底通道的主体。 该通道包括其至少一部分基本上是金属的壁。 主体包括基本上非金属和热绝缘的壁的材料周边。 基本上非金属材料具有其中至少部分延伸的安装开口。

    Methods of operating a liquid vaporizer
    2.
    发明申请
    Methods of operating a liquid vaporizer 失效
    操作液体蒸发器的方法

    公开(公告)号:US20070062465A1

    公开(公告)日:2007-03-22

    申请号:US11198560

    申请日:2004-08-10

    IPC分类号: F22B37/10

    CPC分类号: H01L21/6708 C23C16/4481

    摘要: The present invention is generally directed to a vaporizer with positive liquid shut-off. In one illustrative embodiment, the vaporizer is comprised of a body, a liquid inlet and a carrier gas inlet coupled to the body, a nozzle positioned within the body, the nozzle having at least one opening formed therethrough that defines a vaporized liquid exit, and a positive shut-off valve, a portion of which is adapted to engage the vaporized liquid exit of the nozzle. In another illustrative embodiment, the vaporizer is comprised of a body, a liquid inlet and a carrier gas inlet coupled to-the body and a plurality of peltier cells coupled to the body.

    摘要翻译: 本发明一般涉及具有正液体截止的汽化器。 在一个说明性实施例中,蒸发器包括主体,液体入口和连接到主体的载气入口,位于主体内的喷嘴,喷嘴具有限定蒸发的液体出口的至少一个通过其形成的开口,以及 正截止阀,其一部分适于接合喷嘴的汽化液体出口。 在另一示例性实施例中,蒸发器包括主体,液体入口和连接到主体的载气入口以及耦合到主体的多个珀耳帖细胞。

    Methods of operating a liquid vaporizer
    3.
    发明申请
    Methods of operating a liquid vaporizer 失效
    操作液体蒸发器的方法

    公开(公告)号:US20050011974A1

    公开(公告)日:2005-01-20

    申请号:US10917640

    申请日:2004-08-13

    CPC分类号: H01L21/6708 C23C16/4481

    摘要: The present invention is generally directed to a vaporizer with positive liquid shut-off. In one illustrative embodiment, the vaporizer is comprised of a body, a liquid inlet and a carrier gas inlet coupled to the body, a nozzle positioned within the body, the nozzle having at least one opening formed therethrough that defines a vaporized liquid exit, and a positive shut-off valve, a portion of which is adapted to engage the vaporized liquid exit of the nozzle. In another illustrative embodiment, the vaporizer is comprised of a body, a liquid inlet and a carrier gas inlet coupled to the body and a plurality of peltier cells coupled to the body.

    摘要翻译: 本发明一般涉及具有正液体截止的汽化器。 在一个说明性实施例中,蒸发器包括主体,液体入口和连接到主体的载气入口,位于主体内的喷嘴,喷嘴具有限定蒸发的液体出口的至少一个通过其形成的开口,以及 正截止阀,其一部分适于接合喷嘴的汽化液体出口。 在另一个说明性实施例中,蒸发器包括主体,液体入口和连接到主体的载气入口以及耦合到主体的多个珀耳帖细胞。

    Heated gas line body feedthrough for vapor and gas delivery systems and methods of employing same

    公开(公告)号:US20060207506A1

    公开(公告)日:2006-09-21

    申请号:US11438056

    申请日:2006-05-18

    IPC分类号: C23C16/00

    CPC分类号: C23C16/455

    摘要: A feedthrough device for use in deposition chambers such as chemical vapor deposition chambers and atomic layer deposition chambers and methods using the same in association with such chambers as well as chambers so equipped. The feedthrough device includes an associated heating device to maintain the temperature of the feedthrough device above a predetermined level and thus maintain a temperature differential between the deposition chamber body and a vaporize organometallic precursor as it passes therethrough. The feedthrough device may include a helical groove formed along the surface of a longitudinal body portion thereof to complementarily receive a resistance type cable heater. The heater may further include a temperature sensing device to assist in monitoring and controlling the temperature of the feedthrough device.

    Systems and methods for controlling fluid flow
    5.
    发明申请
    Systems and methods for controlling fluid flow 审中-公开
    控制流体流动的系统和方法

    公开(公告)号:US20070193637A1

    公开(公告)日:2007-08-23

    申请号:US11360868

    申请日:2006-02-23

    IPC分类号: F16K11/22

    CPC分类号: F16K11/105 Y10T137/87684

    摘要: Systems and methods for controlling fluid flow, including valve assemblies that control the flow of two or more fluids during microfeature workpiece processing, are disclosed herein. Certain aspects of the invention are directed toward a valve assembly having a compartment with an interior volume, a first inlet, a second inlet, and an outlet. The assembly further includes a first sealing element having an open position and a closed position and a second sealing element having an open position and a closed position. The second sealing element is located downstream of the first sealing element so that when the first sealing element is in the open position and the second sealing element is in the closed position, fluid can enter the interior volume through the first inlet, pass by a portion of the second sealing element while in the interior volume, and exit the interior volume via the outlet.

    摘要翻译: 本文公开了用于控制流体流动的系统和方法,包括在微特征工件处理期间控制两种或多种流体的流动的阀组件。 本发明的某些方面涉及具有具有内部容积,第一入口,第二入口和出口的隔间的阀组件。 组件还包括具有打开位置和关闭位置的第一密封元件和具有打开位置和关闭位置的第二密封元件。 第二密封元件位于第一密封元件的下游,使得当第一密封元件处于打开位置并且第二密封元件处于关闭位置时,流体可以通过第一入口进入内部容积,经过一部分 的第二密封元件,并且通过出口离开内部容积。