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    Method of producing copper surfaces for improved bonding, compositions used therein and articles made therefrom
    3.
    发明授权
    Method of producing copper surfaces for improved bonding, compositions used therein and articles made therefrom 失效
    生产铜表面以改进粘合的方法，其中使用的组合物和由其制成的制品

    公开(公告)号：US06284309B1

    公开(公告)日：2001-09-04

    申请号：US08994184

    申请日：1997-12-19

    申请人： Craig V. Bishop ,  George S. Bokisa ,  Robert J. Durante ,  John R. Kochilla

    发明人： Craig V. Bishop ,  George S. Bokisa ,  Robert J. Durante ,  John R. Kochilla

    IPC分类号： B05D512

    CPC分类号： H05K3/383 ,  C23F1/18 ,  H05K3/4611 ,  H05K2203/0796 ,  H05K2203/121 ,  H05K2203/124 ,  Y10T428/12354 ,  Y10T428/12361 ,  Y10T428/12389 ,  Y10T428/12472 ,  Y10T428/12479 ,  Y10T428/12514 ,  Y10T428/12993 ,  Y10T428/24273 ,  Y10T428/31663 ,  Y10T428/31678

    摘要： This invention relates to a method of forming a substrate with preparing a surface capable of making a cocontinuous bond comprising the steps of 1) obtaining a copper or copper alloy substrate and 2) applying an etching composition which comprises (a) an acid, (b) an oxidizing agent, (c) a copper complexing agent, and (d) a copper complex, wherein the copper complex is present in an amount which precipitates when applied to the copper or copper alloy substrate. The method also includes the step of 3) treating the substrate with a coating composition and/or 4) applying a stripping composition to the substrate. The invention also relates to copper articles, having surface porosity, including multilayer articles such as printed circuit boards and compositions used in the method. The present invention provides microporous copper or copper alloy substrates which have improved adhesion properties to organic material.

    摘要翻译： 本发明涉及一种通过制备能够形成共连续键的表面来形成基底的方法，包括以下步骤：1）获得铜或铜合金基底; 2）施加蚀刻组合物，其包含（a）酸，（b ）氧化剂，（c）铜络合剂和（d）铜络合物，其中铜配合物以施加到铜或铜合金基材上时析出的量存在。 该方法还包括以下步骤：3）用涂料组合物处理基材和/或4）将剥离组合物施加到基材上。 本发明还涉及具有表面孔隙率的铜制品，包括多层制品如印刷电路板和用于该方法的组合物。 本发明提供了具有改善的对有机材料的粘合性能的微孔铜或铜合金基材。

    Copper etching compositions and method for etching copper
    4.
    发明授权
    Copper etching compositions and method for etching copper 有权
    铜蚀刻组合物和蚀刻铜的方法

    公开(公告)号：US6086779A

    公开(公告)日：2000-07-11

    申请号：US260169

    申请日：1999-03-01

    申请人： Craig V. Bishop ,  John R. Kochilla ,  Robert J. Durante ,  George S. Bokisa

    发明人： Craig V. Bishop ,  John R. Kochilla ,  Robert J. Durante ,  George S. Bokisa

    IPC分类号： C23F1/18 ,  C23F1/46 ,  H05K3/38 ,  C23F1/00

    CPC分类号： H05K3/383 ,  C23F1/18 ,  C23F1/46

    摘要： This invention relates to an aqueous etching composition for etching metallic copper comprising(a) an acid,(b) a copper complexing agent,(c) a metal capable of having a multiplicity of oxidation states which is present in one of its higher positive oxidation states and which metal forms a composition soluble salt, and(d) oxygen wherein the concentration of the higher positive oxidation state metal in the composition is greater than about 4 grams/liter of composition.The invention also relates to a process for etching metallic copper comprising contacting the surface of a copper substrate with the aqueous etching compositions of the invention. A method of regenerating a spent aqueous etching composition of the invention which has been used for etching metallic copper also is described.

    摘要翻译： 本发明涉及一种用于蚀刻金属铜的水性蚀刻组合物，其包含（a）酸，（b）铜络合剂，（c）能够具有多种氧化态的金属，其存在于其较高的阳性氧化物之一 状态和哪种金属形成组合物可溶性盐，和（d）氧，其中组合物中较高阳性氧化态金属的浓度大于约4克/升组合物。 本发明还涉及一种用于蚀刻金属铜的方法，包括使铜基材的表面与本发明的水性蚀刻组合物接触。 还描述了已经用于蚀刻金属铜的本发明的废水性蚀刻组合物的再生方法。