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8 条记录 (耗时 0.024 秒)

    Method of producing copper surfaces for improved bonding, compositions used therein and articles made therefrom
    3.
    发明授权
    Method of producing copper surfaces for improved bonding, compositions used therein and articles made therefrom 失效
    生产铜表面以改进粘合的方法，其中使用的组合物和由其制成的制品

    公开(公告)号：US06284309B1

    公开(公告)日：2001-09-04

    申请号：US08994184

    申请日：1997-12-19

    申请人： Craig V. Bishop ,  George S. Bokisa ,  Robert J. Durante ,  John R. Kochilla

    发明人： Craig V. Bishop ,  George S. Bokisa ,  Robert J. Durante ,  John R. Kochilla

    IPC分类号： B05D512

    CPC分类号： H05K3/383 ,  C23F1/18 ,  H05K3/4611 ,  H05K2203/0796 ,  H05K2203/121 ,  H05K2203/124 ,  Y10T428/12354 ,  Y10T428/12361 ,  Y10T428/12389 ,  Y10T428/12472 ,  Y10T428/12479 ,  Y10T428/12514 ,  Y10T428/12993 ,  Y10T428/24273 ,  Y10T428/31663 ,  Y10T428/31678

    摘要： This invention relates to a method of forming a substrate with preparing a surface capable of making a cocontinuous bond comprising the steps of 1) obtaining a copper or copper alloy substrate and 2) applying an etching composition which comprises (a) an acid, (b) an oxidizing agent, (c) a copper complexing agent, and (d) a copper complex, wherein the copper complex is present in an amount which precipitates when applied to the copper or copper alloy substrate. The method also includes the step of 3) treating the substrate with a coating composition and/or 4) applying a stripping composition to the substrate. The invention also relates to copper articles, having surface porosity, including multilayer articles such as printed circuit boards and compositions used in the method. The present invention provides microporous copper or copper alloy substrates which have improved adhesion properties to organic material.

    摘要翻译： 本发明涉及一种通过制备能够形成共连续键的表面来形成基底的方法，包括以下步骤：1）获得铜或铜合金基底; 2）施加蚀刻组合物，其包含（a）酸，（b ）氧化剂，（c）铜络合剂和（d）铜络合物，其中铜配合物以施加到铜或铜合金基材上时析出的量存在。 该方法还包括以下步骤：3）用涂料组合物处理基材和/或4）将剥离组合物施加到基材上。 本发明还涉及具有表面孔隙率的铜制品，包括多层制品如印刷电路板和用于该方法的组合物。 本发明提供了具有改善的对有机材料的粘合性能的微孔铜或铜合金基材。

    Copper etching compositions and method for etching copper
    4.
    发明授权
    Copper etching compositions and method for etching copper 有权
    铜蚀刻组合物和蚀刻铜的方法

    公开(公告)号：US6086779A

    公开(公告)日：2000-07-11

    申请号：US260169

    申请日：1999-03-01

    申请人： Craig V. Bishop ,  John R. Kochilla ,  Robert J. Durante ,  George S. Bokisa

    发明人： Craig V. Bishop ,  John R. Kochilla ,  Robert J. Durante ,  George S. Bokisa

    IPC分类号： C23F1/18 ,  C23F1/46 ,  H05K3/38 ,  C23F1/00

    CPC分类号： H05K3/383 ,  C23F1/18 ,  C23F1/46

    摘要： This invention relates to an aqueous etching composition for etching metallic copper comprising(a) an acid,(b) a copper complexing agent,(c) a metal capable of having a multiplicity of oxidation states which is present in one of its higher positive oxidation states and which metal forms a composition soluble salt, and(d) oxygen wherein the concentration of the higher positive oxidation state metal in the composition is greater than about 4 grams/liter of composition.The invention also relates to a process for etching metallic copper comprising contacting the surface of a copper substrate with the aqueous etching compositions of the invention. A method of regenerating a spent aqueous etching composition of the invention which has been used for etching metallic copper also is described.

    摘要翻译： 本发明涉及一种用于蚀刻金属铜的水性蚀刻组合物，其包含（a）酸，（b）铜络合剂，（c）能够具有多种氧化态的金属，其存在于其较高的阳性氧化物之一 状态和哪种金属形成组合物可溶性盐，和（d）氧，其中组合物中较高阳性氧化态金属的浓度大于约4克/升组合物。 本发明还涉及一种用于蚀刻金属铜的方法，包括使铜基材的表面与本发明的水性蚀刻组合物接触。 还描述了已经用于蚀刻金属铜的本发明的废水性蚀刻组合物的再生方法。

    Tin whisker-free printed circuit board
    5.
    发明授权
    Tin whisker-free printed circuit board 失效
    锡须无印刷电路板

    公开(公告)号：US06720499B2

    公开(公告)日：2004-04-13

    申请号：US10002714

    申请日：2001-11-01

    申请人： George S. Bokisa ,  Craig V. Bishop ,  John R. Kochilla

    发明人： George S. Bokisa ,  Craig V. Bishop ,  John R. Kochilla

    IPC分类号： H05K109

    CPC分类号： H05K3/244 ,  C23C18/1651 ,  C23C18/1666 ,  C23C18/1669 ,  C23C18/31 ,  C23C18/48 ,  C23C18/54 ,  Y10T428/12701 ,  Y10T428/12708 ,  Y10T428/12722

    摘要： A printed circuit board including electrical circuitry formed on an outer surface of the printed circuit board, the circuitry comprising copper or a copper alloy; a final finish on the circuitry, the final finish including a coating of tin on the copper or copper alloy circuitry; and an alloy cap layer on the tin coating, the alloy cap layer comprising at least two immersion-platable metals. The immersion platable metals in the alloy cap layer may be at least two metals selected from tin, silver, bismuth, copper, nickel, lead, zinc, indium, palladium, platinum, gold, cadmium, ruthenium and cobalt. The circuitry remains whisker free and solderable.

    摘要翻译： 一种印刷电路板，包括形成在印刷电路板的外表面上的电路，该电路包括铜或铜合金; 在电路上进行了最后的完成，最后完成包括在铜或铜合金电路上镀锡; 以及锡涂层上的合金盖层，所述合金盖层包括至少两个可浸镀金属。 合金盖层中的浸渍金属可以是选自锡，银，铋，铜，镍，铅，锌，铟，钯，铂，金，镉，钌和钴中的至少两种金属。 该电路保持无须且可焊接。

    Process for whisker-free aqueous electroless tin plating
    6.
    发明授权
    Process for whisker-free aqueous electroless tin plating 有权
    无晶须水性无电镀锡工艺

    公开(公告)号：US06361823B1

    公开(公告)日：2002-03-26

    申请号：US09454023

    申请日：1999-12-03

    申请人： George S. Bokisa ,  Craig V. Bishop ,  John R. Kochilla

    发明人： George S. Bokisa ,  Craig V. Bishop ,  John R. Kochilla

    IPC分类号： B05D512

    CPC分类号： H05K3/244 ,  C23C18/1651 ,  C23C18/1666 ,  C23C18/1669 ,  C23C18/31 ,  C23C18/48 ,  C23C18/54 ,  Y10T428/12701 ,  Y10T428/12708 ,  Y10T428/12722

    摘要： A process of preserving solderability and inhibiting tin whisker growth of exposed copper or copper alloy surfaces on a substrate comprises the steps of preparing an immersion tin plating solution substantially free of other immersion-platable metals; applying the immersion tin plating solution to the substrate to form a tin coating on the surfaces; preparing an immersion alloy plating solution containing at least two immersion-platable metals; applying the immersion alloy plating solution to the substrate by immersing the substrate in the immersion alloy plating solution to form an alloy cap layer on the tin coating. The immersion platable metals in the immersion alloy plating solution may be at least two metals selected from tin, silver, bismuth, copper, nickel, lead, zinc, indium, palladium, platinum, gold, cadmium, ruthenium and cobalt. The immersion platable metals may be added to the solution in the form of metal salts

    摘要翻译： 保护基材上暴露的铜或铜合金表面的可焊性和抑制锡晶须生长的方法包括以下步骤：制备基本上不含其它可浸镀金属的浸锡镀液; 将浸镀锡溶液施加到基底上以在表面上形成锡涂层; 制备含有至少两种可浸镀金属的浸没合金电镀溶液; 通过将浸渍合金电镀液浸渍在浸渍合金电镀液中，在锡涂层上形成合金盖层，将浸渍合金电镀液施加到基板上。 浸渍合金电镀液中的浸渍金属可以是选自锡，银，铋，铜，镍，铅，锌，铟，钯，铂，金，镉，钌和钴中的至少两种金属。 浸渍金属可以以金属盐的形式加入溶液中

    CHROMIUM-FREE PASSIVATION OF VAPOR DEPOSITED ALUMINUM SURFACES
    7.
    发明申请
    CHROMIUM-FREE PASSIVATION OF VAPOR DEPOSITED ALUMINUM SURFACES 审中-公开
    无铬钝化的蒸气沉积铝表面

    公开(公告)号：US20110206844A1

    公开(公告)日：2011-08-25

    申请号：US12711431

    申请日：2010-02-24

    申请人： Jacob Grant Wiles ,  John R. Kochilla

    发明人： Jacob Grant Wiles ,  John R. Kochilla

    IPC分类号： B05D3/00 ,  C23C16/28 ,  C23C14/34

    CPC分类号： C23C22/34 ,  C23C14/16 ,  C23C14/5853 ,  C23C16/06 ,  C23C16/56 ,  C23C22/362 ,  C23C22/368 ,  C23C22/83

    摘要： A process for passivating a vapor-deposited aluminum layer on a substrate, including providing a substrate comprising vapor deposited aluminum on a surface thereof; treating the surface of the substrate with an aqueous substantially chromium-free composition comprising a hexafluorozirconate; and rinsing the treated surface with water. A process for passivating a vapor-deposited aluminum layer on a substrate, including vapor depositing a layer of aluminum on a substrate; treating the substrate with the vapor deposited aluminum with an aqueous substantially chromium-free composition comprising a hexafluorozirconate; and rinsing the treated substrate with water.

    摘要翻译： 一种钝化基板上的气相沉积铝层的方法，包括在其表面上提供包括蒸镀铝的基板; 用含有六氟锆酸盐的基本上不含铬的组合物处理基材的表面; 并用水冲洗处理过的表面。 一种用于钝化基底上的气相沉积铝层的方法，包括在基底上蒸镀一层铝层; 用包含六氟锆酸盐的基本上不含铬的组合物的水蒸气处理铝; 并用水冲洗经处理的基材。