公开(公告)号：US20220311392A1

公开(公告)日：2022-09-29

申请号：US17213895

申请日：2021-03-26

Applicant: Cree, Inc.

Inventor： Phil Saint-Erne ,  William Pribble ,  Warren Brakensiek ,  Bradley Millon

IPC: H03F3/193 ,  H01L23/31 ,  H01L23/66 ,  H03F3/195 ,  H03F3/213 ,  H01L29/20

Abstract: Packaged RF transistor amplifiers are provided that include a flat no-lead overmold package that includes a die pad, a plurality of terminal pads and an overmold encapsulation that at least partially covers the die pad and the terminal pads and an RF transistor amplifier die mounted on the die pad and at least partially covered by the overmold encapsulation. These packaged RF transistor amplifiers may have an output power density of at least 3.0 W/mm2.

公开(公告)号：US20210111144A1

公开(公告)日：2021-04-15

申请号：US16597224

申请日：2019-10-09

Applicant: Cree, Inc.

Inventor： Sung Chul Joo ,  Jack Powell ,  Donald Farrell ,  Bradley Millon

IPC: H01L23/00 ,  H01L23/66 ,  H01P3/00 ,  H01P11/00

Abstract: A system configured to increase a reliability of electrical connections in a device. The system including a lead configured to electrically connect a pad of at least one support structure to a pad of at least one electrical component. The lead includes an upper portion that includes a lower surface arranged on a lower surface thereof. The lower surface of the upper portion is arranged vertically above a first upper surface of a first pad connection portion; and the lower surface of the upper portion is arranged vertically above a second upper surface of the second pad connection portion. A process configured to increase a reliability of electrical connections in a device is also disclosed.

公开(公告)号：US20200321268A1

公开(公告)日：2020-10-08

申请号：US16909334

申请日：2020-06-23

Applicant: Cree, Inc.

Inventor： Sung Chul Joo ,  Bradley Millon ,  Erwin Cohen

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/34 ,  H01L23/60

Abstract: A device comprises a base, a die, leads, and an electrically-insulating die housing covering the die. The base comprises a die mounting section in which the die is mounted. The leads extend away from the die mounting section and are electrically connected to the die. The base further comprises a base mounting section and a recessed section. The recessed section comprises a recess between the die mounting section and the base mounting section. The base further comprises a first side, a second side opposing the first side, and a thickness measured between the first and second sides. The thickness of the base throughout the recessed section is less than the thickness of the base throughout the base mounting section. The base further comprises an opening extending at least through the base mounting section from the first side to the second side.

公开(公告)号：US11289441B2

公开(公告)日：2022-03-29

申请号：US16597224

申请日：2019-10-09

Applicant: Cree, Inc.

Inventor： Sung Chul Joo ,  Jack Powell ,  Donald Farrell ,  Bradley Millon

IPC: H01L23/66 ,  H01L23/00 ,  H01P11/00 ,  H01P3/00

Abstract: A system configured to increase a reliability of electrical connections in a device. The system including a lead configured to electrically connect a pad of at least one support structure to a pad of at least one electrical component. The lead includes an upper portion that includes a lower surface arranged on a lower surface thereof. The lower surface of the upper portion is arranged vertically above a first upper surface of a first pad connection portion; and the lower surface of the upper portion is arranged vertically above a second upper surface of the second pad connection portion. A process configured to increase a reliability of electrical connections in a device is also disclosed.

公开(公告)号：US10886198B2

公开(公告)日：2021-01-05

申请号：US16909334

申请日：2020-06-23

Applicant: Cree, Inc.

Inventor： Sung Chul Joo ,  Bradley Millon ,  Erwin Cohen

IPC: H01L23/495 ,  H01L23/60 ,  H01L23/34 ,  H01L23/31

Abstract: A device comprises a base, a die, leads, and an electrically-insulating die housing covering the die. The base comprises a die mounting section in which the die is mounted. The leads extend away from the die mounting section and are electrically connected to the die. The base further comprises a base mounting section and a recessed section. The recessed section comprises a recess between the die mounting section and the base mounting section. The base further comprises a first side, a second side opposing the first side, and a thickness measured between the first and second sides. The thickness of the base throughout the recessed section is less than the thickness of the base throughout the base mounting section. The base further comprises an opening extending at least through the base mounting section from the first side to the second side.

公开(公告)号：US10720379B2

公开(公告)日：2020-07-21

申请号：US16226517

申请日：2018-12-19

Applicant: Cree, Inc.

Inventor： Sung Chul Joo ,  Bradley Millon ,  Erwin Cohen

IPC: H01L23/22 ,  H01L23/495 ,  H01L23/34 ,  H01L23/31 ,  H01L23/60

Abstract: The base of an integrated circuit package comprises a first side, and a second side opposing the first side. The base further comprises, a base mounting section, a die mounting section, and a recessed section. The recessed section comprises a recess between the die mounting section and the base mounting section. The base further comprises an opening extending through the base from the first side to the second side. At least a portion of the recess intersects with the opening.