公开(公告)号：US20130249434A1

公开(公告)日：2013-09-26

申请号：US13851688

申请日：2013-03-27

Applicant: CREE, INC.

Inventor： Nicholas W. Medendorp, JR. ,  Mark Terrence McClear ,  Bernd P. Keller ,  George R. Brandes ,  Ronan P. LeToquin

IPC: H05B37/02

CPC classification number: H05B37/02 ,  C09K11/586 ,  C09K11/623 ,  C09K11/7421 ,  C09K11/7702 ,  C09K11/7721 ,  C09K11/7734 ,  F21K9/00 ,  F21K9/64 ,  F21V23/005 ,  F21Y2105/10 ,  F21Y2105/12 ,  F21Y2113/17 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/504 ,  H01L2924/0002 ,  Y02B20/181 ,  H01L2924/00

Abstract: A multi-chip lighting emitting device (LED) lamp for providing white light includes a submount including first and second die mounting regions thereon. A first LED chip is mounted on the first die mounting region, and a second LED chip is mounted on the second die mounting region. The LED lamp is configured to emit light having a spectral distribution including at least four different color peaks to provide the white light. For example, a first conversion material may at least partially cover the first LED chip, and may be configured to absorb at least some of the light of the first color and re-emit light of a third color. In addition, a second conversion material may at least partially cover the first and/or second LED chips, and may be configured to absorb at least some of the light of the first and/or second colors and re-emit light of a fourth color. Related light fixtures and methods are also disclosed.

Abstract translation: 用于提供白光的多芯片发光装置（LED）灯包括其上包括第一和第二管芯安装区域的基座。 第一LED芯片安装在第一管芯安装区域上，第二LED芯片安装在第二管芯安装区域上。 LED灯被配置为发射具有包括至少四个不同颜色峰值的光谱分布的光以提供白光。 例如，第一转换材料可以至少部分地覆盖第一LED芯片，并且可以被配置为吸收第一颜色的至少一些光并重新发射第三颜色的光。 另外，第二转换材料可以至少部分地覆盖第一和/或第二LED芯片，并且可以被配置为吸收第一颜色和/或第二颜色的至少一些光并重新发射第四颜色的光 。 还公开了相关的灯具和方法。

公开(公告)号：US08847478B2

公开(公告)日：2014-09-30

申请号：US13851688

申请日：2013-03-27

Applicant: Cree, Inc.

Inventor： Nicholas W. Medendorp, Jr. ,  Mark Terrence McClear ,  Bernd P. Keller ,  George R. Brandes ,  Ronan P. LeToquin

IPC: H01L33/50 ,  H01L33/48 ,  F21V21/00 ,  H01L25/075 ,  F21K99/00 ,  C09K11/58 ,  C09K11/77 ,  C09K11/62 ,  C09K11/74 ,  H05B37/02

CPC classification number: H05B37/02 ,  C09K11/586 ,  C09K11/623 ,  C09K11/7421 ,  C09K11/7702 ,  C09K11/7721 ,  C09K11/7734 ,  F21K9/00 ,  F21K9/64 ,  F21V23/005 ,  F21Y2105/10 ,  F21Y2105/12 ,  F21Y2113/17 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/504 ,  H01L2924/0002 ,  Y02B20/181 ,  H01L2924/00

Abstract: A multi-chip lighting emitting device (LED) lamp for providing white light includes a submount including first and second die mounting regions thereon. A first LED chip is mounted on the first die mounting region, and a second LED chip is mounted on the second die mounting region. The LED lamp is configured to emit light having a spectral distribution including at least four different color peaks to provide the white light. For example, a first conversion material may at least partially cover the first LED chip, and may be configured to absorb at least some of the light of the first color and re-emit light of a third color. In addition, a second conversion material may at least partially cover the first and/or second LED chips, and may be configured to absorb at least some of the light of the first and/or second colors and re-emit light of a fourth color. Related light fixtures and methods are also disclosed.

Abstract translation: 用于提供白光的多芯片发光装置（LED）灯包括其上包括第一和第二管芯安装区域的基座。 第一LED芯片安装在第一管芯安装区域上，第二LED芯片安装在第二管芯安装区域上。 LED灯被配置为发射具有包括至少四个不同颜色峰值的光谱分布的光以提供白光。 例如，第一转换材料可以至少部分地覆盖第一LED芯片，并且可以被配置为吸收第一颜色的至少一些光并重新发射第三颜色的光。 此外，第二转换材料可以至少部分地覆盖第一和/或第二LED芯片，并且可以被配置为吸收第一颜色和/或第二颜色的至少一些光并重新发射第四颜色的光 。 还公开了相关的灯具和方法。