公开(公告)号：US20240235004A1

公开(公告)日：2024-07-11

申请号：US18282394

申请日：2022-03-16

Applicant: DAI NIPPON PRINTING CO., LTD.

Inventor： Kazuki KINOSHITA ,  Shotaro HOSODA ,  Hidetoshi IIOKA ,  Keita IIMURA ,  Shuji KAWAGUCHI ,  Masashi SAKAKI ,  Seiji TAKE

IPC: H01Q1/22 ,  H01Q1/38 ,  H05K1/02 ,  H05K3/06 ,  H05K3/38 ,  H10K59/95

CPC classification number: H01Q1/22 ,  H01Q1/38 ,  H05K1/0274 ,  H05K3/386 ,  H10K59/95 ,  H05K3/067 ,  H05K2201/09245 ,  H05K2201/10098 ,  H05K2201/10128

Abstract: A wiring board includes a substrate that has transparency, a primer layer provided on the substrate, and a mesh wiring layer that is disposed on the primer layer and that includes a plurality of first-direction wiring lines and a plurality of second-direction wiring lines that interconnect the plurality of first-direction wiring lines. The primer layer includes a polymer material. At intersections of the first-direction wiring lines and the second-direction wiring lines, at least one corner portion of four corner portions formed between the first-direction wiring lines and the second-direction wiring lines is rounded in plan view.