公开(公告)号：US20240049384A1

公开(公告)日：2024-02-08

申请号：US18381789

申请日：2023-10-19

Applicant: DAI NIPPON PRINTING CO., LTD.

Inventor： Hiroki FURUSHOU ,  Atsuko CHIGIRA ,  Toshio SASAO ,  Hiroshi MAWATARI

IPC: H05K1/02 ,  B32B15/04 ,  H01L23/40 ,  H05K3/38

CPC classification number: H05K1/0298 ,  B32B15/04 ,  H01L23/40 ,  H05K3/38

Abstract: A wiring board is disclosed. The wiring board includes a substrate including a first element, a diffusion layer in contact with the substrate and including a first metal element, and a first metal film in contact with the diffusion layer and including a second metal element. The diffusion layer has at least a region including the first element and the first metal element and a region including the first metal element and the second metal element. A concentration of the second metal element in the diffusion layer may decrease as it approaches the substrate in a depth direction. A concentration of the first element in the diffusion layer may decrease as it approaches the first metal film in the depth direction.